Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Fourth QUARTER 2010 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Technology List 10 10. Failure Rate Calculations 11 11. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: Apr 11, 2011 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 6 FITS (2,462K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 7 FITS (1,078K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 924 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 741K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 923 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 3 LAST 4Q 0 0 162 648 0 0 162 648 0 0 162 648 0 0 162 648 162,000 648,000 35 35 0 0 160 40 ASIC 3 LAST 4Q 0 0 200 932 0 0 200 745 0 0 200 745 0 0 200 700 200,000 731,476 23 25 0 0 202 50 MEMORY 3 LAST 4Q 0 0 500 2,200 0 0 300 1,400 0 0 300 1,400 0 0 300 1,400 309,600 1,438,400 58 53 0 0 51 12 MCU 3 LAST 4Q 0 0 4,214 9,756 0 0 1,158 2,197 0 0 1,004 2,043 0 0 388 1,273 868,560 2,046,704 10 13 0 0 102 35 RFA 3 LAST 4Q 0 0 1,075 3,230 0 0 1,075 3,230 0 0 1,075 3,230 0 0 769 2,770 922,000 3,153,000 115 133 0 0 9 2 ATMEL 3 LAST 4Q 0 0 6,151 16,766 0 0 2,895 8,220 0 0 2,741 8,066 0 0 1,819 6,791 2,462,160 8,017,580 58 70 0 0 6 2 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 77 77,000 117 0 102 0 0 230 692 230,000 692,000 117 110 0 0 34 12 153 384 0 0 0 231 76,500 307,500 142 123 0 0 84 24 0 0 230 230 0 0 77 77 153,500 153,500 92 92 0 0 65 65 77 0 77 0 77 77,000 117 0 102 0 77 0 77 0 77 77,000 206 0 58 154 0 154 0 154 0 0 77,000 117 0 102 0 0 154 231 0 0 154 231 0 0 154 231 0 0 154 231 154,000 231,000 117 117 0 0 51 34 3 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 77,000 77,000 117 117 0 0 102 102 75K 3 LAST 4Q 0 0 231 1,077 0 0 231 1,077 0 0 231 1,077 0 0 231 1,077 231,000 1,230,000 117 157 0 0 34 5 63K 3 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 100 400 0 0 100 400 109,600 438,400 76 64 0 0 110 33 58K 3 LAST 4Q 0 0 1,177 2,856 0 0 308 651 0 0 308 651 0 0 308 651 349,712 756,840 3 3 0 0 974 458 57K 3 LAST 4Q 0 0 100 200 0 0 100 200 0 0 100 200 0 0 100 200 100,000 200,000 23 23 0 0 403 202 56.9K 3 LAST 4Q 0 0 80 320 0 0 80 320 0 0 80 320 0 0 80 320 80,000 320,000 48 48 0 0 237 59 56K 3 LAST 4Q 0 0 100 400 0 0 100 400 0 0 100 400 0 0 100 400 100,000 400,000 23 23 0 0 403 101 46K 3 LAST 4Q 0 0 82 328 0 0 82 328 0 0 82 328 0 0 82 328 82,000 328,000 23 23 0 0 492 123 REJ SS REJ SS REJ SS REJ SS 3 LAST 4Q 0 77 0 77 0 77 0 UHF 3 LAST 4Q 0 0 230 692 0 0 230 692 0 0 230 692 SCMOS3 3 LAST 4Q 0 0 153 384 0 0 153 384 0 0 SAC2NV 3 LAST 4Q 0 0 230 230 0 0 230 230 SIGE1 3 LAST 4Q 0 77 0 3 LAST 4Q 0 77 LAST 4Q 0 BICMOS2 3 LAST 4Q 0.5UMSPDMEE UNI3 SIGE2 I2L 3 RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 154 154,000 117 0 51 0 0 280 1,622 718,848 2,312,364 25 31 0 0 52 13 100 0 100 108,976 42 0 202 2,741 8,066 0 0 1,819 6,791 2,462,160 8,017,580 58 70 0 0 6 2 REJ SS REJ SS REJ SS REJ SS 3 LAST 4Q 0 154 0 154 0 154 0 35K 3 LAST 4Q 0 0 3,237 7,945 0 0 1,050 2,591 0 0 896 2,437 19K 3 LAST 4Q 0 287 0 100 0 3 LAST 4Q 0 0 6,151 16,766 0 0 2,895 8,220 0 0 38.6 K ATMEL * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS APG 3 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 117 117 ASIC 3 LAST 4Q 0 0 0 77 0 0 0 77 0 0 0 77 0 77,000 117 117 3 0 77 0 77 0 77 77,000 102 LAST 4Q 0 462 0 462 0 462 462,000 117 117 MCU 3 LAST 4Q 0 0 1,309 2,899 0 0 1,078 2,591 0 0 847 2,360 1,001,308 2,527,244 117 117 8 3 RFA 3 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 117 117 ATMEL 3 LAST 4Q 0 0 1,386 3,438 0 0 1,155 3,130 0 0 924 2,899 1,078,308 3,066,244 117 117 MEMORY RELIABILITY MONITOR -- ATMEL PROPRIETARY 102 17 7 3 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS 63 K 3 LAST 4Q 0 0 77 462 0 0 77 462 0 0 77 462 77,000 462,000 117 117 102 17 58K 3 LAST 4Q 0 0 616 924 0 0 616 924 0 0 462 770 539,000 847,000 117 117 15 9 35K 3 LAST 4Q 0 0 693 1,975 0 0 462 1,667 0 0 385 1,590 462,308 1,680,244 117 117 17 5 19K 3 LAST 4Q 0 77 0 77 0 77 77,000 117 102 3 LAST 4Q 0 0 1,386 3,438 0 0 1,155 3,130 0 0 924 2,899 1,078,308 3,066,244 117 117 7 3 ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles % Defective REJ SS REJ SS REJ SS REJ SS 3 LAST 4Q 0 77 0 77 0 77 0 77 0.00% BGA 3 LAST 4Q 0 0 154 154 0 0 154 154 0 0 154 154 0 0 154 154 0.00% 0.00% LGA 3 LAST 4Q 0 0 77 154 0 0 77 154 0 0 77 154 0 0 77 154 0.00% 0.00% MLF / QFN 3 LAST 4Q 0 359 0 359 0 359 0 353 0.00% 3 LAST 4Q 0 77 0 77 0 77 0 77 0.00% SOIC 3 LAST 4Q 0 0 77 616 0 0 77 616 0 0 77 616 0 0 77 611 0.00% 0.00% TQFP 3 LAST 4Q 0 0 616 847 0 0 616 847 0 0 616 924 0 0 452 678 0.00% 0.00% TSOP / VSOP 3 LAST 4Q 0 77 0 77 0 77 0 77 0.00% 3 LAST 4Q 0 281 0 281 0 281 0 204 0.00% 3 LAST 4Q 0 0 924 2,642 0 0 924 2,642 0 0 924 2,719 0 0 760 2,385 0.00% 0.00% CASON PDIP TSSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST PACKAGE QTR BGA 3 LAST 4Q 0 0 154 154 0 0 154 154 0 0 154 154 0 0 154,000 0.00% 3 LAST 4Q 0 283 0 283 0 283 0 77 437,000 0.00% 3 LAST 4Q 0 385 0 385 0 385 0 0 77 154 693,000 0.00% 3 LAST 4Q 0 0 356 587 0 0 356 510 0 0 202 356 0 0 445,936 0.00% 3 LAST 4Q 0 231 0 231 0 231 0 0 231,000 0.00% 3 LAST 4Q 0 0 510 1,640 0 0 510 1,563 0 0 356 1,409 0 0 154 616 741,000 2,730,936 0.00% 0.00% MLF / QFN SOIC TQFP TSSOP ATMEL 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 3 LAST 4Q 0 77 0 77 0 77 0.0% BGA 3 LAST 4Q 0 0 154 154 0 0 0 0 0 0 0 0 0.0% 0.0% LGA 3 LAST 4Q 0 0 77 154 0 0 77 154 0 0 77 154 0.0% 0.0% MLF / QFN 3 LAST 4Q 0 359 0 77 0 77 0.0% 3 LAST 4Q 0 77 0 77 0 77 0.0% SOIC 3 LAST 4Q 0 0 77 616 0 0 77 231 0 0 77 231 0.0% 0.0% TQFP 3 LAST 4Q 0 0 615 958 0 0 0 0 0 0 0 0 0.0% 0.0% TSOP / VSOP 3 LAST 4Q 0 77 0 77 0 77 0.0% 3 LAST 4Q 0 231 0 0 0 0 0.0% 3 LAST 4Q 0 0 923 2,703 0 0 154 693 0 0 154 693 0.00% 0.00% CASON PDIP TSSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) PLD 5 19.7 EPLD 0.5 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 EPROM 0.5 5 34 NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 CSO 43 HNO 46 5 55 Logic 5 55.8 5 56 5 EPROM ASIC ASIC, TX RF RFA 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 HNO 75 RFA HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS HNO BICMOS2 HNO I²L HNO SCMOS3 HNO 6BD1 0.8 ASIC / RFA ASIC / RFA RFA 6IL4 2 SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA HNO UNI3 NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC ASIC RFA RFA NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12