Q4 2010 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
Fourth QUARTER 2010
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product BU)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product BU)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7
7. Temperature Humidity Bias & HAST
8
8. Steam Pressure Pot
9
9. Technology List
10
10. Failure Rate Calculations
11
11. Definitions
12
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
Apr 11, 2011
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process, package or business unit and performing a series of reliability
tests to ensure that the reliability has maintained over time. Listed below are the overall
results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
Failure Rate: 6 FITS (2,462K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours. All failures were inconclusive.
2.
Data Retention Bake (150°C; 0 failures)
Failure Rate: 7 FITS (1,078K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 924 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 741K device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 923 units)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1
High Temperature Operating Life
(sorted by FAMILY)
BU
QTR
48 Hours
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
REJ
SS
Device-Hours*
WAF
EFR PPM
FITS
APG
3
LAST 4Q
0
0
162
648
0
0
162
648
0
0
162
648
0
0
162
648
162,000
648,000
35
35
0
0
160
40
ASIC
3
LAST 4Q
0
0
200
932
0
0
200
745
0
0
200
745
0
0
200
700
200,000
731,476
23
25
0
0
202
50
MEMORY
3
LAST 4Q
0
0
500
2,200
0
0
300
1,400
0
0
300
1,400
0
0
300
1,400
309,600
1,438,400
58
53
0
0
51
12
MCU
3
LAST 4Q
0
0
4,214
9,756
0
0
1,158
2,197
0
0
1,004
2,043
0
0
388
1,273
868,560
2,046,704
10
13
0
0
102
35
RFA
3
LAST 4Q
0
0
1,075
3,230
0
0
1,075
3,230
0
0
1,075
3,230
0
0
769
2,770
922,000
3,153,000
115
133
0
0
9
2
ATMEL
3
LAST 4Q
0
0
6,151
16,766
0
0
2,895
8,220
0
0
2,741
8,066
0
0
1,819
6,791
2,462,160
8,017,580
58
70
0
0
6
2
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
77
77,000
117
0
102
0
0
230
692
230,000
692,000
117
110
0
0
34
12
153
384
0
0
0
231
76,500
307,500
142
123
0
0
84
24
0
0
230
230
0
0
77
77
153,500
153,500
92
92
0
0
65
65
77
0
77
0
77
77,000
117
0
102
0
77
0
77
0
77
77,000
206
0
58
154
0
154
0
154
0
0
77,000
117
0
102
0
0
154
231
0
0
154
231
0
0
154
231
0
0
154
231
154,000
231,000
117
117
0
0
51
34
3
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0
0
77
77
77,000
77,000
117
117
0
0
102
102
75K
3
LAST 4Q
0
0
231
1,077
0
0
231
1,077
0
0
231
1,077
0
0
231
1,077
231,000
1,230,000
117
157
0
0
34
5
63K
3
LAST 4Q
0
0
300
1,200
0
0
100
400
0
0
100
400
0
0
100
400
109,600
438,400
76
64
0
0
110
33
58K
3
LAST 4Q
0
0
1,177
2,856
0
0
308
651
0
0
308
651
0
0
308
651
349,712
756,840
3
3
0
0
974
458
57K
3
LAST 4Q
0
0
100
200
0
0
100
200
0
0
100
200
0
0
100
200
100,000
200,000
23
23
0
0
403
202
56.9K
3
LAST 4Q
0
0
80
320
0
0
80
320
0
0
80
320
0
0
80
320
80,000
320,000
48
48
0
0
237
59
56K
3
LAST 4Q
0
0
100
400
0
0
100
400
0
0
100
400
0
0
100
400
100,000
400,000
23
23
0
0
403
101
46K
3
LAST 4Q
0
0
82
328
0
0
82
328
0
0
82
328
0
0
82
328
82,000
328,000
23
23
0
0
492
123
REJ
SS
REJ
SS
REJ
SS
REJ
SS
3
LAST 4Q
0
77
0
77
0
77
0
UHF
3
LAST 4Q
0
0
230
692
0
0
230
692
0
0
230
692
SCMOS3
3
LAST 4Q
0
0
153
384
0
0
153
384
0
0
SAC2NV
3
LAST 4Q
0
0
230
230
0
0
230
230
SIGE1
3
LAST 4Q
0
77
0
3
LAST 4Q
0
77
LAST 4Q
0
BICMOS2
3
LAST 4Q
0.5UMSPDMEE
UNI3
SIGE2
I2L
3
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
154
154,000
117
0
51
0
0
280
1,622
718,848
2,312,364
25
31
0
0
52
13
100
0
100
108,976
42
0
202
2,741
8,066
0
0
1,819
6,791
2,462,160
8,017,580
58
70
0
0
6
2
REJ
SS
REJ
SS
REJ
SS
REJ
SS
3
LAST 4Q
0
154
0
154
0
154
0
35K
3
LAST 4Q
0
0
3,237
7,945
0
0
1,050
2,591
0
0
896
2,437
19K
3
LAST 4Q
0
287
0
100
0
3
LAST 4Q
0
0
6,151
16,766
0
0
2,895
8,220
0
0
38.6 K
ATMEL
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
BU
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours
AF
FITS
APG
3
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
117
117
ASIC
3
LAST 4Q
0
0
0
77
0
0
0
77
0
0
0
77
0
77,000
117
117
3
0
77
0
77
0
77
77,000
102
LAST 4Q
0
462
0
462
0
462
462,000
117
117
MCU
3
LAST 4Q
0
0
1,309
2,899
0
0
1,078
2,591
0
0
847
2,360
1,001,308
2,527,244
117
117
8
3
RFA
3
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
117
117
ATMEL
3
LAST 4Q
0
0
1,386
3,438
0
0
1,155
3,130
0
0
924
2,899
1,078,308
3,066,244
117
117
MEMORY
RELIABILITY MONITOR -- ATMEL PROPRIETARY
102
17
7
3
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours AF
FITS
63 K
3
LAST 4Q
0
0
77
462
0
0
77
462
0
0
77
462
77,000
462,000
117
117
102
17
58K
3
LAST 4Q
0
0
616
924
0
0
616
924
0
0
462
770
539,000
847,000
117
117
15
9
35K
3
LAST 4Q
0
0
693
1,975
0
0
462
1,667
0
0
385
1,590
462,308
1,680,244
117
117
17
5
19K
3
LAST 4Q
0
77
0
77
0
77
77,000
117
102
3
LAST 4Q
0
0
1,386
3,438
0
0
1,155
3,130
0
0
924
2,899
1,078,308
3,066,244
117
117
7
3
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
100 Cycles
200 Cycles
500 Cycles
1K Cycles
% Defective
REJ
SS
REJ
SS
REJ
SS
REJ
SS
3
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
BGA
3
LAST 4Q
0
0
154
154
0
0
154
154
0
0
154
154
0
0
154
154
0.00%
0.00%
LGA
3
LAST 4Q
0
0
77
154
0
0
77
154
0
0
77
154
0
0
77
154
0.00%
0.00%
MLF / QFN
3
LAST 4Q
0
359
0
359
0
359
0
353
0.00%
3
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
SOIC
3
LAST 4Q
0
0
77
616
0
0
77
616
0
0
77
616
0
0
77
611
0.00%
0.00%
TQFP
3
LAST 4Q
0
0
616
847
0
0
616
847
0
0
616
924
0
0
452
678
0.00%
0.00%
TSOP / VSOP
3
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
3
LAST 4Q
0
281
0
281
0
281
0
204
0.00%
3
LAST 4Q
0
0
924
2,642
0
0
924
2,642
0
0
924
2,719
0
0
760
2,385
0.00%
0.00%
CASON
PDIP
TSSOP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Humidity Bias / HAST
Temperature Humidity Bias
HAST
PACKAGE
QTR
BGA
3
LAST 4Q
0
0
154
154
0
0
154
154
0
0
154
154
0
0
154,000
0.00%
3
LAST 4Q
0
283
0
283
0
283
0
77
437,000
0.00%
3
LAST 4Q
0
385
0
385
0
385
0
0
77
154
693,000
0.00%
3
LAST 4Q
0
0
356
587
0
0
356
510
0
0
202
356
0
0
445,936
0.00%
3
LAST 4Q
0
231
0
231
0
231
0
0
231,000
0.00%
3
LAST 4Q
0
0
510
1,640
0
0
510
1,563
0
0
356
1,409
0
0
154
616
741,000
2,730,936
0.00%
0.00%
MLF / QFN
SOIC
TQFP
TSSOP
ATMEL
168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective
REJ SS REJ SS REJ SS REJ SS
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Steam Pressure Pot
PACKAGE
QTR
96 Hours
168 Hours
240 Hours
% Defective
REJ
SS
REJ
SS
REJ
SS
3
LAST 4Q
0
77
0
77
0
77
0.0%
BGA
3
LAST 4Q
0
0
154
154
0
0
0
0
0
0
0
0
0.0%
0.0%
LGA
3
LAST 4Q
0
0
77
154
0
0
77
154
0
0
77
154
0.0%
0.0%
MLF / QFN
3
LAST 4Q
0
359
0
77
0
77
0.0%
3
LAST 4Q
0
77
0
77
0
77
0.0%
SOIC
3
LAST 4Q
0
0
77
616
0
0
77
231
0
0
77
231
0.0%
0.0%
TQFP
3
LAST 4Q
0
0
615
958
0
0
0
0
0
0
0
0
0.0%
0.0%
TSOP / VSOP
3
LAST 4Q
0
77
0
77
0
77
0.0%
3
LAST 4Q
0
231
0
0
0
0
0.0%
3
LAST 4Q
0
0
923
2,703
0
0
154
693
0
0
154
693
0.00%
0.00%
CASON
PDIP
TSSOP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µm]
TYPICAL PRODUCTS / APPLICATIONS
5
15.3
EEPROM
1.8 - 2.3
sEEPROM
5
19.3
EEPROM
1.1
sEEPROM
5
19.5
Embedded Memory Configurator
1.0
Configurator
5
19.6
Embedded Memory
0.7
EEPROM, MC (Intel core), MC (AVR core)
PLD
5
19.7
EPLD
0.5
5
19.76
EPLD
0.5
PLD
5
19.8
CMOS
0.7
ASIC
5
19.8
Embedded Memory Configurator
0.7
5
19.9
Embedded Memory
0.7
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
5
25
BiCMOS
1.0
ASIC
5
26
Logic
0.7
ASIC
5
33.5
FLASH
0.5
EPROM
0.5
5
34
NTO
35
5
35.5
Embedded Memory Configurator
0.35
EEPROM, FLASH, MICRO, EPLD
5
37
EEPROM
0.35
FLASH, PEROM, DATA FLASH, sEEPROM
5
39
EEPROM
0.25
DATA FLASH
5
39.1
EEPROM
0.25
FLASH, DATA FLASH
BiCMOS
0.6
5
42
CSO
43
HNO
46
5
55
Logic
5
55.8
5
56
5
EPROM
ASIC
ASIC, TX RF
RFA
0.5
ASIC
CMOS
0.5
ASIC
Logic
0.35
ASIC
56.8
Embedded Memory
0.35
ASIC
7
57.0
CMOS
0.25
ASIC
7
57.5
CMOS
0.21
ASIC / RFA
7
58.0
CMOS
0.18
ASIC / RFA
SJO
61
CMOS
0.18
FLASH
SJO
63
HNO
75
RFA
HNO
6UH6+BICMOS
RFA
HNO
BCDMOS
HNO
BICMOS
HNO
BICMOS2
HNO
I²L
HNO
SCMOS3
HNO
6BD1
0.8
ASIC / RFA
ASIC / RFA
RFA
6IL4
2
SIGE2
6SG1
0.8
RFA
HNO
UHF
6UH6
0.5
ASIC / RFA
HNO
UNI3
NTO
Z86
CMOS Digital
0.8
SRAM,MICRO, VAN DLC
ASIC
RFA
RFA
NTO
Z91
CMOS Digital
0.6
SRAM, ASIC, MICRO
NTO
Z92
CMOS Digital
0.5
ASIC, MICRO,VAN DLC
CMOS + EPROM
0.5
OTP MICRO
NTO
Z94
HNO
Z95
RFA
HNO
Z96
RFA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
11
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
12