ESD6100 2 Channel Very Low Capacitance ESD Protection Device in CSP Product Description http://onsemi.com The ESD6100 is a 4−bump very low capacitance ESD protection device in 0.4 mm CSP form factor. It is fully compliant with IEC 61000−4−2. The ESD6100 is RoHS II compliant. Table 1. PIN DESCRIPTIONS WLCSP4 CASE 567CB 4−bump CSP Package Pin Description A1 ESD Channel 1 A2 ESD Channel 2 B1 and B2 Device Ground ELECTRICAL SCHEMATIC CH1 (A1) PACKAGE / PINOUT DIAGRAMS CH2 (A2) 4−Bump CSP Package Orientation Marking 1 A 2 + 2 1 A2 A1 A1 A PX B B B2 B1 GND (B1) Orientation Marking GND (B2) MARKING DIAGRAM PX Top View (Bumps Down View) Bottom View (Bumps Up View) P X WHERE X = A = ww01, ww02 J = ww19, ww20 S = ww37, ww38 B = ww03, ww04 K = ww21, ww22 T = ww39, ww40 C = ww05, ww06 L = ww23, ww24 U = ww41, ww42 D = ww06, ww08 M = ww25, ww26 V = ww43, ww44 E = ww08, ww10 N = ww27, ww28 W = ww45, ww46 F = ww11, ww12 O = ww29, ww30 X = ww47, ww48 G = ww13, ww14 P = ww31, ww32 Y = ww49, ww50 H = ww15, ww16 Q = ww33, ww34 Z = ww51, ww52 I = ww17, ww18 R = ww35, ww36 © Semiconductor Components Industries, LLC, 2014 October, 2014 − Rev. 1 1 = ESD6100 = Single Digit Date Code ORDERING INFORMATION Device ESD6100 Package Shipping† WLCSP4 (Pb−Free) 10000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: ESD6100/D ESD6100 ELECTRICAL SPECIFICATIONS AND CONDITIONS Table 2. PARAMETERS AND OPERATING CONDITIONS Parameter Rating Units Storage Temperature Range –55 to +150 °C Operating Temperature Range –40 to +85 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions VIN Input Operating Supply Voltage VB Breakdown Voltage (Positive) IF = 1 mA Channel Leakage Current VIN = 3 V (Note 2) Channel Input Capacitance At 1 MHz, VIN = 0 V (Note 2) DCIN Channel Input Capacitance Matching At 1 MHz, VIN = 0 V (Note 2) VESD ESD Protection Peak Discharge Voltage at any channel input a) Contact Discharge per IEC 61000−4−2 standard b) Air Discharge per IEC 61000−4−2 standard (Notes 2 and 3) Channel Clamp Voltage Positive Transients Negative Transients IPP = 1 A, tP = 8/20 ms (Note 2) Dynamic Resistance Positive Transients Negative Transients IPP = 1 A, tP = 8/20 ms Any I/O pin to Ground (Note 2) ILEAK CIN VCL RDYN Min Typ Max Units 3.0 5.5 V 6 V 1.0 0.02 100 nA 1.5 pF pF kV ±8 ±15 V +9.8 −1.5 W 0.7 0.5 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. All parameters specified at TA = 25°C unless otherwise noted. 2. These parameters are guaranteed by design and characterization. 3. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W. http://onsemi.com 2 ESD6100 PACKAGE DIMENSIONS WLCSP4, 0.8x0.8 CASE 567CB ISSUE O ÈÈ ÈÈ A D PIN A1 REFERENCE E 0.05 C 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B DIM A A1 A2 b D E e 0.05 C 2X TOP VIEW A2 0.05 C A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 4X A1 0.05 C A B C SIDE VIEW SEATING PLANE A1 e b MILLIMETERS MIN MAX 0.63 0.57 0.17 0.24 0.41 REF 0.24 0.29 0.80 BSC 0.80 BSC 0.40 BSC 0.40 PITCH e B 0.03 C A PACKAGE OUTLINE 4X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS 1 2 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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