4 Channel Data Line EMI Filter with 2 Channel USB Filter and ESD Protection

NUF6107MN
4 Channel Data Line EMI
Filter with 2 Channel USB
Filter and ESD Protection
This device is a four-channel EMI filter array for data lines. Greater
than -35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers USB filtering circuitry with speed detection.
This includes the inline resistors for impedance matching and EMI
filtering. ESD protection is provided across all capacitors.
Features
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R1
1
12
C1
R2
2
•EMI Filtering and ESD Protection for Data Lines
•USB 1.1 and 2.0 Full Speed Filtering Provided
•Integration of 26 Discretes Offers Cost and Space Savings
•Low Profile DFN, Packaging, 3.0 x 1.35 mm
•MSL 1
•Compliant with IEC61000-4-2 (Level 4)
C3
D3
C5
D5
4
5
C4
D4
9
C6
D6
R5
5
3
R3
R4
4
•EMI and USB Filtering and ESD Protection for Data Lines
•Cell Phones
•Handheld Portables
•Notebook Computers
•MP3 Players
D2
10
3
Typical Applications
2
11
C2
> 8 kV Contact on all outputs and data lines
•This is a Pb-Free Device
1
D1
D7
8
C8
C7
D8
R6
7
6
C9
D9
C10
D10
(Top View)
6
MARKING DIAGRAM
1
GND
12
DFN12
CASE 506AD
1
12
11
10
9
8
(Bottom View)
61
07
MG
G
7
6107= Specific Device Code
M = Month
G
= Pb-Free Package
(Note: Microdot may be in either location)
Figure 1. Pin Connections
ORDERING INFORMATION
Device
Package
Shipping†
NUF6107MNTBG
DFN12
(Pb-Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2008
January, 2008 - Rev. 2
1
Publication Order Number:
NUF6107MN/D
NUF6107MN
MAXIMUM RATINGS
Parameter
Symbol
ESD Discharge IEC61000-4-2
pins 1 to 2
pins 3 to 12
Contact Discharge
Value
VPP
Unit
kV
2.0
8.0
Operating Temperature Range
TOP
-40 to 85
°C
Storage Temperature Range
TSTG
-55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Leakage Current
Symbol
Test Conditions
VRWM
Min
Typ
Max
Unit
-
-
5.0
V
VBR
IR = 1.0 mA
6.0
6.8
8.0
V
IR
VRWM = 3.3 V per line
-
-
0.1
mA
EMI Filter Resistors
R3 - R6
80
100
120
W
USB Resistors; Impedance Matching
R1, R2
18
22
26
W
Diode Capacitance
C3 - C10
VR = 2.5 V
24
30
36
pF
Diode Capacitance
C1, C2
VR = 2.5 V
29
36
43
pF
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2
0
-5
-5
-15
-15
S21 (dB)
0
-25
-35
-45
-45
-55
1.0E+06
S41 (dB)
-25
-35
1.0E+07
1.0E+08
1.0E+09
-55
1.0E+06
1.0E+10
1.0E+07
1.0E+10
Figure 2. Insertion Loss Characteristics on
Data Lines
Figure 3. Insertion Loss Characteristics on
USB Lines
26
-10
25
-20
24
-30
-40
-50
23
22
21
-60
20
-70
19
-80
1.0E+06
1.0E+07
1.0E+08
1.0E+09
18
-40
1.0E+10
-20
0
20
40
60
80
TEMPERATURE (°C)
FREQUENCY (Hz)
Figure 4. Typical Analog Crosstalk
Figure 5. Typical Resistance over Temperature for
R1 and R2
2
110
NORMALIZED CAPACITANCE
108
106
RESISTANCE (W)
1.0E+09
FREQUENCY (Hz)
0
104
102
100
98
96
94
92
90
-40
1.0E+08
FREQUENCY (Hz)
RESISTANCE (W)
S21 (dB)
NUF6107MN
1.5
1
0.5
0
-20
0
20
40
TEMPERATURE (°C)
60
0
80
1
2
3
4
REVERSE VOLTAGE (V)
Figure 6. Typical Resistance over Temperature for
R3 - R6
Figure 7. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance, Cd @ 2.5 V)
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3
5
NUF6107MN
PACKAGE DIMENSIONS
DFN12 3.0x1.35, 0.5P
CASE 506AD-01
ISSUE H
2X
0.15 C
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
D
B
(A3)
E
2X
0.15 C
EXPOSED Cu
TOP VIEW
PIN ONE
REFERENCE
(A3)
0.10 C
A
12 X
0.08 C
SEATING
PLANE
SIDE VIEW
A1
2X
0.2 X 0.25 MM
NOTE 5
12 X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
3.00 BSC
2.10
2.30
1.35 BSC
0.20
0.40
0.50 BSC
0.20
--0.20
0.40
D2
L
1
e
SOLDERING FOOTPRINT*
EXPOSED PAD
6
1.50
E2
0.40
1
12 X K
12
7
12 X
b
0.10 C A B
BOTTOM VIEW
0.05 C
0.35
NOTE 3
11X
0.30
12X
0.45
0.40
1.95
PITCH
PACKAGE
OUTLINE
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
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Phone: 421 33 790 2910
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Phone: 81-3-5773-3850
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4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUF6107MN/D