NUF6107MN 4 Channel Data Line EMI Filter with 2 Channel USB Filter and ESD Protection This device is a four-channel EMI filter array for data lines. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers USB filtering circuitry with speed detection. This includes the inline resistors for impedance matching and EMI filtering. ESD protection is provided across all capacitors. Features http://onsemi.com R1 1 12 C1 R2 2 •EMI Filtering and ESD Protection for Data Lines •USB 1.1 and 2.0 Full Speed Filtering Provided •Integration of 26 Discretes Offers Cost and Space Savings •Low Profile DFN, Packaging, 3.0 x 1.35 mm •MSL 1 •Compliant with IEC61000-4-2 (Level 4) C3 D3 C5 D5 4 5 C4 D4 9 C6 D6 R5 5 3 R3 R4 4 •EMI and USB Filtering and ESD Protection for Data Lines •Cell Phones •Handheld Portables •Notebook Computers •MP3 Players D2 10 3 Typical Applications 2 11 C2 > 8 kV Contact on all outputs and data lines •This is a Pb-Free Device 1 D1 D7 8 C8 C7 D8 R6 7 6 C9 D9 C10 D10 (Top View) 6 MARKING DIAGRAM 1 GND 12 DFN12 CASE 506AD 1 12 11 10 9 8 (Bottom View) 61 07 MG G 7 6107= Specific Device Code M = Month G = Pb-Free Package (Note: Microdot may be in either location) Figure 1. Pin Connections ORDERING INFORMATION Device Package Shipping† NUF6107MNTBG DFN12 (Pb-Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2008 January, 2008 - Rev. 2 1 Publication Order Number: NUF6107MN/D NUF6107MN MAXIMUM RATINGS Parameter Symbol ESD Discharge IEC61000-4-2 pins 1 to 2 pins 3 to 12 Contact Discharge Value VPP Unit kV 2.0 8.0 Operating Temperature Range TOP -40 to 85 °C Storage Temperature Range TSTG -55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Symbol Test Conditions VRWM Min Typ Max Unit - - 5.0 V VBR IR = 1.0 mA 6.0 6.8 8.0 V IR VRWM = 3.3 V per line - - 0.1 mA EMI Filter Resistors R3 - R6 80 100 120 W USB Resistors; Impedance Matching R1, R2 18 22 26 W Diode Capacitance C3 - C10 VR = 2.5 V 24 30 36 pF Diode Capacitance C1, C2 VR = 2.5 V 29 36 43 pF http://onsemi.com 2 0 -5 -5 -15 -15 S21 (dB) 0 -25 -35 -45 -45 -55 1.0E+06 S41 (dB) -25 -35 1.0E+07 1.0E+08 1.0E+09 -55 1.0E+06 1.0E+10 1.0E+07 1.0E+10 Figure 2. Insertion Loss Characteristics on Data Lines Figure 3. Insertion Loss Characteristics on USB Lines 26 -10 25 -20 24 -30 -40 -50 23 22 21 -60 20 -70 19 -80 1.0E+06 1.0E+07 1.0E+08 1.0E+09 18 -40 1.0E+10 -20 0 20 40 60 80 TEMPERATURE (°C) FREQUENCY (Hz) Figure 4. Typical Analog Crosstalk Figure 5. Typical Resistance over Temperature for R1 and R2 2 110 NORMALIZED CAPACITANCE 108 106 RESISTANCE (W) 1.0E+09 FREQUENCY (Hz) 0 104 102 100 98 96 94 92 90 -40 1.0E+08 FREQUENCY (Hz) RESISTANCE (W) S21 (dB) NUF6107MN 1.5 1 0.5 0 -20 0 20 40 TEMPERATURE (°C) 60 0 80 1 2 3 4 REVERSE VOLTAGE (V) Figure 6. Typical Resistance over Temperature for R3 - R6 Figure 7. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance, Cd @ 2.5 V) http://onsemi.com 3 5 NUF6107MN PACKAGE DIMENSIONS DFN12 3.0x1.35, 0.5P CASE 506AD-01 ISSUE H 2X 0.15 C A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. D B (A3) E 2X 0.15 C EXPOSED Cu TOP VIEW PIN ONE REFERENCE (A3) 0.10 C A 12 X 0.08 C SEATING PLANE SIDE VIEW A1 2X 0.2 X 0.25 MM NOTE 5 12 X DIM A A1 A3 b D D2 E E2 e K L C MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 3.00 BSC 2.10 2.30 1.35 BSC 0.20 0.40 0.50 BSC 0.20 --0.20 0.40 D2 L 1 e SOLDERING FOOTPRINT* EXPOSED PAD 6 1.50 E2 0.40 1 12 X K 12 7 12 X b 0.10 C A B BOTTOM VIEW 0.05 C 0.35 NOTE 3 11X 0.30 12X 0.45 0.40 1.95 PITCH PACKAGE OUTLINE DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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