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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16646
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Issue Date: 28-Jun-2011
TITLE: Pre Plated Frame Qualification for DFN12L 3.0 X 1.3 X 0.85 mm.
PROPOSED FIRST SHIP DATE: 1-Oct-2011
AFFECTED CHANGE CATEGORY(S): Leadframe material
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Eben Lim <[email protected] >
SAMPLES: Contact your local ON Semiconductor Sales Office
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or Redentor Canoza
<[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
ON Semiconductor is notifying customers of its qualification of Pre-Plated leadframe for package
DFN 12Lead 3*1.35*0.85MM PBF assembled in Seremban site. The purpose of qualification is to
enhance the robustness of plating process. Pre-plated Leadframe provides a predictable and well
characterized plating and thickness response.
Lead finish change from JEDEC category e3 – 100% matte Sn to category e4- Precious metals
(Gold-Silver Alloy).
Reliability qualification and electrical characterization have been performed. There will be no change
to the devices data sheet or functionalities.
Issue Date: 28-Jun-2011
Rev. 06-Jan-2010
Page 1 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16646
RELIABILITY DATA SUMMARY:
Reliability Test Results:
Qualification Vehicles chosen for this qualification:
NUF6401MNT1G
NUF6400MNTBG
NUF6401MNT1G
Test:
HTRB
TC+PC
Precondition
Autoclave+PC
HAST+PC
SAT + PC
SD
RSH
Conditions:
TA=150C, 80% Rated Voltage
Ta= -65 C to 150 C,
MSL1@ 260C , 3 X IR at 260 C
Ta=121C RH=100% ~15 psig
Temp = 130C, RH=85%, 80% of rated Voltage
pre & post PC
Solderability
Ta=260C, 10 sec
Interval:
1008 hrs
1000 cyc
96 hrs
96 hrs
Quantity
0/80
0/80
0/240
0/80
0/80
0/10
0/15
0/30
NUF6400MNTBG
Test:
HTRB
TC+PC
Precondition
Autoclave+PC
HAST+PC
SAT + PC
SD
RSH
Conditions:
TA=150C, 80% Rated Voltage
Ta= -65 C to 150 C,
MSL1@ 260C , 3 X IR at 260 C
Ta=121C RH=100% ~15 psig
Temp = 130C, RH=85%, 80% of rated Voltage
pre & post PC
Solderability
Ta=260C, 10 sec
Interval:
1008 hrs
1000 cyc
96 hrs
96 hrs
Quantity
0/160
0/160
0/480
0/160
0/160
0/20
0/30
0/60
ELECTRICAL CHARACTERISTIC SUMMARY:
Datasheet specifications and product electrical performance will remain unchanged
Characterization of each qual vehicle device will be performed to the following requirements:
1) ESD performance (HBM, MM)
2) Three temperature characterization
CHANGED PART IDENTIFICATION:
Devices with date code of 1140, representing Work Week 40, 2011 or newer may be built using preplated leadframe from ON Semiconductor Seremban.
Issue Date: 28-Jun-2011
Rev. 06-Jan-2010
Page 2 of 3
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16646
List of affected General Parts:
NUF6107MNTBG
NUF6401MNT1G
NUF6410MNT1G
NUF6406MNT1G
NUF6400MNTBG
NUF6402MNT1G
Issue Date: 28-Jun-2011
Rev. 06-Jan-2010
Page 3 of 3