Data Sheet

BGA2002
MMIC amplifier
Rev. 4 — 9 February 2011
Product data sheet
1. Product profile
1.1 General description
Silicon Monolithic Microwave Integrated Circuit (MMIC) amplifier consisting of an NPN
double polysilicon transistor with integrated biasing for low voltage applications in a
plastic, 4-pin dual-emitter SOT343R package.
1.2 Features and benefits
„
„
„
„
„
„
Low current, low voltage
Very high power gain
Low noise figure
Integrated temperature compensated biasing
Supply and RF output pin combined
AEC-Q100 qualified, see Section 8.1
1.3 Applications
„ LNB IF amplifiers
„ General purpose low noise wideband amplifier for frequencies between
DC and 2.2 GHz
„ High frequency oscillators
„ High frequency oscillators
„ Satellite televisions tuners (SATV)
„ High frequency oscillators
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
supply voltage
RF input AC coupled
-
-
4.5
V
ICC
supply current
Vbias = 2.5 V; RF input AC coupled
MSG
maximum stable gain Vbias = 2.5 V; f = 1.8 GHz;
Tamb = 25 °C
NF
noise figure
VCC
Vbias = 2.5 V; f = 1.8 GHz; ΓS = Γopt
3
4.5
6
mA
-
19.5
-
dBm
-
1.3
-
dBm
BGA2002
NXP Semiconductors
MMIC amplifier
2. Pinning information
Table 2.
Pinning
Pin
Description
1
GND
2, 5
RFin
3
GND
4
VCC + RFout
Simplified outline
3
Graphic symbol
4
VCC + RFout
BIAS
CIRCUIT
2
1
RFin
GND
001aam981
3. Ordering information
Table 3.
Ordering information
Type number
BGA2002
Package
Name
Description
Version
-
plastic surface mounted package; reverse pinning;
4 leads
SOT343R
4. Marking
Table 4.
Marking
Type number
Marking code
Description
BGA2002
A2*
* = p: made in Hong Kong
* = t: made in Malaysia
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
BGA2002
Product data sheet
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
RF input AC coupled
-
4.5
V
ICC
supply current
forced by DC voltage on RF
input
-
30
mA
Ptot
total power dissipation
Tsp = 100 °C
-
135
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
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Rev. 4 — 9 February 2011
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MMIC amplifier
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to Ptot = 135 mW; Tsp = 100 °C
solder point
Conditions
Typ
Unit
350
K/W
7. Characteristics
Table 7.
Characteristics
Vbias = 2.5 V; Ibias = 4 mA; Tamb = 25 °C; unless otherwise specified.
Symbol Parameter
ICC
MSG
supply current
maximum stable gain
Conditions
Min
Typ
Max
Unit
Vbias = 1 V
-
0.7
-
mA
Vbias = 2.5 V
3
4.5
6
mA
Vbias = 4.5 V
-
11
-
mA
f = 900 MHz
-
22
-
dB
f = 1800 MHz
-
19.5
-
dB
f = 900 MHz
-
18
-
dB
f = 900 MHz
-
14
-
dB
-
−2
-
dBm
ΓS = Γopt; f = 900 MHz
-
1.3
-
dB
ΓS = Γopt; f = 1800 MHz
-
1.3
-
dB
Ibias = 4.4 mA; f = 900 MHz
-
−7.4
-
dBm
Ibias = 4.4 mA; f = 1800 MHz
-
−4.5
-
dBm
|S21|2
insertion power gain
PL(1dB)
output power at 1 dB gain compression Ibias = 4.4 mA; f = 900 MHz
NF
noise figure
IP3I
input third-order intercept point
001aam920
200
100 pF
R1
VCC
Ptot
(mW)
150
L1
C
RF out
GND
Vbias
100
GND
50
BGA2002
IN
C
RF in
001aam919
0
0
50
100
150
200
Tsp (°C)
Fig 1.
Typical application circuit
BGA2002
Product data sheet
Fig 2.
Power derating curve
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NXP Semiconductors
MMIC amplifier
001aam921
12
Ibias
(mA)
001aam922
16
Ibias
(mA)
(8)
12
(7)
8
(6)
(5)
8
(4)
4
(3)
4
(2)
(1)
0
−40
0
0
40
80
120
Tamb (°C)
0
1
2
3
4
5
Vbias (V)
(1) Vbias = 1 V
(2) Vbias = 1.5 V
(3) Vbias = 2 V
(4) Vbias = 2.5 V
(5) Vbias = 3 V
(6) Vbias = 3.5 V
(7) Vbias = 4 V
(8) Vbias = 4.5 V
Fig 3.
Bias current as a function of ambient
temperature; typical values
Fig 4.
001aam923
30
Bias current as a function of voltage at the
output pin; typical values
001aam924
25
gain
(dB)
gain
(dB)
20
GUM
MSG
MSG
20
GUM
15
10
10
5
0
0
0
2
4
6
8
10
Ibias (mA)
0
f = 900 MHz.
Fig 5.
Product data sheet
4
6
8
10
Ibias (mA)
f = 1800 MHz.
Gain as a function of bias current; typical
values
BGA2002
2
Fig 6.
Gain as a function of bias current; typical
values
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Rev. 4 — 9 February 2011
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BGA2002
NXP Semiconductors
MMIC amplifier
001aam925
40
gain
(dB)
NFmin
(dB)
GUM
30
001aam926
3
(1)
2
MSG
(2)
(3)
(4)
20
Gmax
1
10
0
102
103
0
10−1
104
f (MHz)
1
10
Ibias (mA)
Vbias = 25 V; Ibias = 4 mA.
(1) f = 2400 MHz
(2) f = 1000 MHz
(3) f = 900 MHz
(4) f = 1800 MHz
Fig 7.
Gain as a function of frequency; typical values
BGA2002
Product data sheet
Fig 8.
Minimum noise figure as a function of
frequency; typical values
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NXP Semiconductors
MMIC amplifier
90°
unstable region
source
135°
1.0
+1
+0.5
45° unstable
+2
region load
+0.2
180°
0.6
0.4
+5
(1)
0.8
Γopt
0.2
(2)
0
0.2
0.5
1
2
5
10
0°
0
(4)
(3)
(5)
−0.2
−135°
−5
(6)
−2
−0.5
−45°
−1
−90°
1.0
001aam927
f = 900 MHz; Vbias = 2.5 V; Ibias = 4 mA; ZO = 50 Ω.
(1) G = 22 dB
(2) G = 21 dB
(3) G = 20 dB
(4) NF = 1.3 dB
(5) NF = 1.5 dB
(6) NF = 1.7 dB
Fig 9.
Noise, stability and gain circles; typical values
BGA2002
Product data sheet
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Rev. 4 — 9 February 2011
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NXP Semiconductors
MMIC amplifier
unstable
region load
90°
unstable region
source
135°
+1
+0.5
1.0
0.8
45°
+2
0.6
(1)
+0.2
Γopt
0.4
+5
(2)
180°
0
0.2
(3)
0.2
0.5
1
(4)
2
5
10
0°
0
(5)
(6)
−5
−0.2
−135°
−2
−0.5
−45°
−1
−90°
1.0
001aam928
f = 1800 MHz; Vbias = 2.5 V; Ibias = 4 mA; ZO =50 Ω.
(1) G = 19 dB
(2) G = 18 dB
(3) G = 17 dB
(4) NF = 1.3 dB
(5) NF = 1.5 dB
(6) NF = 1.7 dB
Fig 10. Noise, stability and gain circles; typical values
BGA2002
Product data sheet
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Rev. 4 — 9 February 2011
© NXP B.V. 2011. All rights reserved.
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MMIC amplifier
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
0.2
180°
0
0.2
1
0.5
2
5
10
0°
0
100 MHz
3 GHz
200 MHz
−0.2
−5
500 MHz
1.8 GHz
1 GHz
900 MHz
−2
−0.5
−135°
−45°
−1
1.0
−90°
001aam929
Vbias = 2.5 V; Ibias = 4 mA; ZO = 50 Ω.
Fig 11. Common emitter input reflection coefficient (S11); typical values
90°
135°
45°
900 MHz
1.8 GHz
1 GHz
500 MHz
3 GHz
200 MHz
100 MHz
180°
10
8
6
4
2
0°
0
−135°
−45°
−90°
001aam930
Vbias = 2.5 V; Ibias = 4 mA; ZO = 50 Ω.
Fig 12. Common emitter forward transmission coefficient (S21); typical values
BGA2002
Product data sheet
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Rev. 4 — 9 February 2011
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MMIC amplifier
90°
135°
180°
0.5
0.4
45°
0.3
0.2
3 GHz
0.1
0°
100 MHz
−135°
−45°
−90°
001aam931
Vbias = 2.5 V; Ibias = 4 mA; ZO = 50 Ω.
Fig 13. Common emitter reverse transmission coefficient (S12); typical values
90°
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
0.2
180°
0
0.2
0.5
1
2
5
10
0°
0
100 MHz
200 MHz
−0.2
3 GHz
1.8 GHz
−135°
500 MHz
900 MHz
−5
1 GHz
−2
−0.5
−45°
−1
−90°
1.0
001aam932
Vbias = 2.5 V; Ibias = 4 mA; ZO = 50 Ω.
Fig 14. Common emitter output reflection coefficient (S22); typical values
BGA2002
Product data sheet
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Rev. 4 — 9 February 2011
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BGA2002
NXP Semiconductors
MMIC amplifier
8. Test information
8.1 Quality information
All qualification tests are performed according AEC-Q100 except for read point testing,
this is done only at room temperature.
BGA2002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 9 February 2011
© NXP B.V. 2011. All rights reserved.
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MMIC amplifier
9. Package outline
Plastic surface-mounted package; reverse pinning; 4 leads
D
SOT343R
E
B
A
X
HE
y
v M A
e
3
4
Q
A
A1
c
2
w M B
1
bp
Lp
b1
e1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.4
0.3
0.7
0.5
0.25
0.10
2.2
1.8
1.35
1.15
1.3
1.15
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-21
06-03-16
SOT343R
Fig 15. Package outline SOT343R
BGA2002
Product data sheet
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Rev. 4 — 9 February 2011
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MMIC amplifier
10. Abbreviations
Table 8.
Abbreviations
Acronym
Description
IF
Intermediate Frequency
LNB
Low-Noise Block converter
NPN
Negative Positive Negative
RF
Radio Frequency
11. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGA2002 v.4
20110209
Product data sheet
-
BGA2002 v.3
-
BGA2002 v.2
Modifications:
BGA2002 v.3
Modifications:
BGA2002 v.2
BGA2002
Product data sheet
•
Section 8 on page 10: has been added.
20101102
Product data sheet
•
•
Status changed from objective to product.
•
Legal texts have been adapted to the new company name where appropriate.
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
19980901
Objective data sheet
-
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Rev. 4 — 9 February 2011
-
© NXP B.V. 2011. All rights reserved.
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MMIC amplifier
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BGA2002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 9 February 2011
© NXP B.V. 2011. All rights reserved.
13 of 15
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MMIC amplifier
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGA2002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 9 February 2011
© NXP B.V. 2011. All rights reserved.
14 of 15
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MMIC amplifier
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information . . . . . . . . . . . . . . . . . . . . . . . . 10
Quality information . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 9 February 2011
Document identifier: BGA2002