REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 07-03-06 Thomas M. Hess Update boilerplate in according with MIL-PRF-38535 requirement. Editorial changes throughout. - phn REV SHEET REV SHEET REV STATUS REV A OF SHEETS SHEET 1 PMIC N/A PREPARED BY 2 A A 3 4 5 Phu H. Nguyen STANDARD MICROCIRCUIT DRAWING 6 7 8 9 10 11 A A 12 13 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY Phu H. Nguyen APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE Thomas M. Hess DRAWING APPROVAL DATE MICROCIRCUIT, DIGITAL, CMOS GATE ARRAY BASED ON CAN ASIC SPACE APPLICATION (CASA2), MONOLITHIC SILICON 03-08-11 AMSC N/A REVISION LEVEL A DSCC FORM 2233 APR 97 SIZE CAGE CODE A 67268 SHEET 1 OF 5962-03A06 13 5962-E285-07 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 03A06 Federal stock class designator \ RHA designator (see 1.2.1) 01 Q X C Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function AT7908E Can ASIC space application 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter X Descriptive designator See figure 1 Terminals Package style 44 Multilayer ceramic package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL SHEET 2 1.3 Absolute maximum ratings. 1/ Supply voltage range (VDD) ......................................................................... -0.5 V to 6.0 V 2/ Input voltage range (VIN) ........................................................................... -0.5 V to VDD + 0.5 V Storage temperature range ........................................................................ -65oC to +150oC Lead temperature ....................................................................................... +300oC 4/ Maximum junction temperature (TJ) ............................................................ +175oC Maximum power dissipation (PD) ................................................................ 0.3 W o Thermal resistance, junction-to-case (θJC) .................................................. 5.1 C/W 3/ 1.4 Recommended operating conditions. Supply voltage range (VDD) ........................................................................ 4.5 V to 5.5 V Ambient temperature (TA) ........................................................................... -55oC to 125oC Storage conditions ..................................................................................... 30oC, 20 to 65% RH, dust free, original packing 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. _______ 1/ 2/ 3/ 4/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. All voltages referenced to ground unless otherwise specified. VDD + 0.5 V shall not exceed 6.0 V. Duration 10 second maximum at a distance not less than 1.6 mm. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL A SHEET 3 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline The case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block or logic diagram. The block or logic diagram shall be as specified on figure 3. 3.2.4 Timing waveforms. The timing waveforms shall be specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 123 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL A SHEET 4 TABLE I. Electrical performance characteristics. Test Conditions - 55°C ≤ TA ≤ +125°C Symbol Group A Subgroups unless otherwise specified Limits Units Min. Max. -0.2 Input clamp voltage to ground 1/ VIC IOH = -300 µA 1, 2, 3 -1.2 Low level input current IIL VIN = GND, VDD = 5.5 V 1, 2, 3 -5 µA 2/ V Low level input current, pull-up 2/ IILPU VIN = GND, VDD = 5.5 V 1, 2, 3 -100 µA Low level input current, pull-down 2/ ILLPD VIN = GND, VDD = 5.5 V 1, 2, 3 -5 µA IIH VIN = VDD = 5.5 V 1, 2, 3 5 µA 2/ IIHPU VIN = VDD = 5.5 V 1, 2, 3 5 µA High level input current, pull-down 2/ IIHPD VIN = VDD = 5.5 V 1, 2, 3 300 µA Output leakage low current IOZL VOUT = GND, Outputs disabled 1, 2, 3 IOZHPD VOUT = VDD, Outputs disabled 1, 2, 3 IOZLPU VOUT = GND, Outputs disabled 1, 2, 3 IOZH VOUT = VDD, Outputs disabled 1, 2, 3 5 Low level output voltage, BOUT12 2/ VOL1 VDD = 4.5 V, IOL = +12 mA 1, 2, 3 0.4 V Low level output voltage, BOUT6 2/ VOL2 VDD = 4.5 V, IOL = +6 mA 1, 2, 3 0.4 V Low level output voltage, BOUT3 2/ VOL3 VDD = 4.5 V, IOL = +3 mA 1, 2, 3 0.4 V High level output voltage, BOUT12 2/ VOH1 VDD = 4.5 V, IOL = -12 mA 1, 2, 3 3.9 V High level output voltage, BOUT6 2/ VOH2 VDD = 4.5 V, IOL = -6 mA 1, 2, 3 3.9 V High level output voltage, BOUT3 2/ VOH3 VDD = 4.5 V, IOL = -3 mA 1, 2, 3 3.9 V High level input current 2/ High level input current, pull-up 2/ Output leakage high current, -5 µA 300 µA pull-down output 2/ Output leakage low current, -100 µA pull-up output 2/ Output leakage high current 2/ µA Low level input voltage 1/ VIL Functional verification 1, 2, 3 High level input voltage 1/ VIH Functional verification 1, 2, 3 CI VDD = 0 V 4 15 pF CIO VDD = 0 V 4 15 pF IDDSBA VDA = 5.5V 1, 2, 3 50 µA IDDOPA VDA = 5.5V 4, 5, 6 25 mA VDB = 5.5V 4, 5, 6 10 mA Input capacitance 3/ Output capacitance 3/ Supply current stand by for array 2/ Supply current operating for array 2/ Supply current operating for buffer 2/ IDDOPB 0.3 VDD 0.7 VDD V V See notes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions - 55°C ≤ TA ≤ +125°C Group A Subgroups unless otherwise specified Address valid to ALE low 2/ Units Limits Min. Max. TAVLL VDD = 5V ±10%, 9, 10, 11 4 9, 10, 11 4 9, 10, 11 100 TLLAX VSS = 0V, ALE high time TLHLL Tclk = 100 ns ALE low to RD low TLLRL 9, 10, 11 200 TCHRL 9, 10, 11 100 Input data valid to WR High TDVWH 9, 10, 11 300 Input data hold after WR high TWHQX 9, 10, 11 10 WR pulse width TWLWH 9, 10, 11 300 WR high to next ALE high TWHLH 9, 10, 11 100 TWS 9, 10, 11 -3 WR hold time after clock TWH 9, 10, 11 7 RD pulse width TRLRH 9, 10, 11 RD low to data valid TRLDV 9, 10, 11 6 82 Data float after RD High TRHDZ 9, 10, 11 4 20 Address hold after ALE low CS high to RD low 2/ 2/ WR setup time before clock 2/ ns 300 Notes: 1. Forcing conditions of the functional test assure that these limits are met but they will not be individually recorded. 2. Read and record measurements in accordance with MIL-PRF-38535. 3. Tested at initial design and after major process changes, otherwise guaranteed. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL SHEET 6 Case X Millimeters Symbol A Min Max Min Max 2.67 4.95 .105 .195 A1 b1 Inches 1.65 NOM 0.33 .065 NOM 0.56 .013 .022 b2 0.55 0.88 .022 .035 c1 0.17 0.25 .007 .010 D/E 17.14 17.78 .675 .700 D1/E1 15.74 16.75 .620 .660 e 1.27 BSC e2 16.00 BSC L .050 BSC .630 BSC 0.12 .005 ND/NE 11 R 0.50 J 0.58 11 1.01 .020 .040 .023 FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL SHEET 7 Case X Pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Signal name VDDA1 Addr[4] Addr[5] Addr[6] Addr[7] VSSB1 VDDB2 Cs Mode Ale Wr VSSA1 Rd Sena Test Reset VSSB2 VDDB3 Can_rx Hasync Xtalout Xtalin VDDA2 Int Hatrig Can_tx VSSB3 VDDB4 Data[0] Data[1] Data[2] Data[3] VSSA2 Data[4] Type I I I I I I I I I I I I I O I/O I O O O I/O I/O I/O I/O I/O Note Power for array Input address (mode 1) or output address (mode 0) Input address (mode 1) or output address (mode 0) Input address (mode 1) or output address (mode 0) Input address (mode 1) or output address (mode 0) Ground for periphery Power for periphery Chip Select signal Interface operational mode Adress latch enable Write signal Ground for Array Read signal Scan enable Input signal to increase testability Reset signal Ground for periphery Power for periphery RX signal Output synchronization signal Not connected Output from internal oscillator Input to internal oscillator or clock input from external oscillator Power for array Interrupt request Output signal to trigger the message matching TX signal Ground for periphery Power for periphery Adress data bus Adress data bus Adress data bus Adress data bus Ground for Array Adress data bus FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL A SHEET 8 Pin number Signal name Type Note 36 Data[5] I/O Adress data bus 37 Data[6] I/O Adress data bus 38 Data[7] I/O Adress data bus 39 VSSB4 Ground for periphery 40 VDDB1 Power for periphery 41 Addr[0] I Input address (mode 1) or output address (mode 0) 42 Addr[1] I Input address (mode 1) or output address (mode 0) 43 Addr[2] I Input address (mode 1) or output address (mode 0) 44 Addr[3] I Input address (mode 1) or output address (mode 0) Notes: 1. Mode : Input pin to select operational mode of interface: mode = 0 : 8 bit data bus multiplexed with lowest 8-bit address(register mapped between 8000Hex and 804Chex) mode = 1 : 8 bit not multiplexed address data bus ( register mapped between 00 Hex and 4C Hex) 2. VDDA1 = VDDA2 = VDDB1 = VDDB2 = VDDB3 = VDDB4 = 5 V 3. VSSA1 = VSSA2 = VSSB1 = VSSB2 = VSSB3 = VSSB4 = 0V 4. I = Input, O = Output FIGURE 2. Terminal connections - Continued. FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL A SHEET 9 FIGURE 4. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL A SHEET 10 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, D or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MILPRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the functionality of the device. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device; these tests shall have been fault graded in accordance with MIL-STD-883, test method 5012. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL A SHEET 11 TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) 1. 2. 3. Subgroups (in accordance with MIL-PRF-38535, table III) Device Device class Q class V 1, 7, 9 1, 7, 9 ∆ 1/ 1, 2, 3, 7, 8, 9, 1, 2, 3, 7, 8, 10, 11 2/ 9, 10, 11 3/ Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1, 7, 9 1, 2, 3, 7, 8, 9, 10, 11 2/ 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 7, 9 1, 2, 3, 7, 8, 9, 10, 11 1, 2, 3, 7, 8, 9, 10, 11 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 1, 7, 9 ∆ indicates delta limits (see table IIB) shall be required where specified and the delta values shall be computed with reference to previous interim electrical parameters. For device class V, performance of delta limits shall be specified by the manufacturer’s QM plan. PDA applies to subgroups 1. PDA applies to subgroups 1 and 7. TABLE IIB. Delta limits at 25°C Parameters 1/ ICCSBA All device types VOL/VOH ± 0.1 V ± 5 µA IOZL/IOZH ± 0.1 µA IIL/IIH ± 0.1 µA 1. The above parameters shall be recorded before and after burn-in and life test to determine the drift. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, D or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL A SHEET 12 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-03A06 A REVISION LEVEL A SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 07-03-06 Approved sources of supply for SMD 5962-03A06 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ 5962-03A0601QXC 5962-03A0601VXC Vendor CAGE number F7400 F7400 Vendor similar PIN 2/ AT7908EJLMQ AT7908EJLSV 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number F7400 Vendor name and address Atmel Nantes SA BP 70602 44306 Nantes Cedex 3 France The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.