REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED Thomas M. Hess 02-07-24 Add case outline Z and correct errors in figure 1. phn REV SHEET REV A A A A A A SHEET 15 16 17 18 19 20 REV STATUS REV A A A OF SHEETS SHEET 1 2 3 PMIC N/A PREPARED BY 4 5 6 A A A A A A A A 7 8 9 10 11 12 13 14 Phu H. Nguyen STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY Phu H. Nguyen APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE Thomas M. Hess DRAWING APPROVAL DATE MICROCIRCUIT, DIGITAL, ASIC, ERROR DETECTION AND CORRECTION UNIT, MONOLITHIC SILICON 01-08-08 AMSC N/A REVISION LEVEL A SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 5962-01A18 1 OF 20 5962-E437-02 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 01 Q X C Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead Finish (see 1.2.5) 01A18 / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function 29C516E Error Detection And Correction Unit (EDAC) 16 bit flow-through 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class M Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835, and as follows: Outline letter X Y Z 1/ Descriptive designator See figure 1 See figure 1 See figure 1 Terminals 100 100 100 Package style Multilayer pack unformed leads Multilayer pack gull wings leads Rectangular Multilayer Quad Pack with Flat leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 2 1.3 Absolute maximum ratings. 2/ 3/ Supply voltage range (VDD) ....................................................... -0.5 V to 7.0 V Input voltage range (VIN) .......................................................... VSS -0.5 V to VDD +0.5 V 4/ Input current (IIN) Signal pin ....................................................................... -10.0 mA to 10.0 mA Power pin ....................................................................... -50.0 mA to 50.0 mA Output short circuit current 5/ VOUT = VDD VOUT = VSS o o Storage temperature range (Ts) ................................................. -65 C to +150 C o Lead temperature (soldering, 10 sec) ........................................ +300 C 6/ o Maximum junction temperature (TJ) .......................................... +175 C 1.4 Recommended operating conditions. Supply voltage range (VDD) ........................................................ 4.5 V to 5.5 V o o Case temperature (TC) ............................................................... -55 C to 125 C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ 2/ 3/ 4/ 5/ 6/ This case outline is no longer available from an approved source. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. All voltages referenced to Ground unless otherwise specified. VDD + 0.5 V shall not exceed 7.0 V The maximum output current of any single output in a shorted condition for a maximum duration of 1 second. Duration 10 sec maximum at a distance not less than 1.6 mm. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 3 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall test patterns defined and controlled in Atmel Device-spec. 29C516 Rev. Dec 97 which have been developed from customer provided vectors and simulations specific to this device. 3.2.4 Block diagram(s). The block diagram shall be defined in figure 3. 3.2.5 Timing Waveforms. The timing waveforms shall be specified in figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device classes M devices covered by this drawing shall be in microcircuit group number 123 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Input clamp voltage to GND 1/ High level input current 2/ Output leakage low current Limits Units Group A Subgroups Min. Max. -0.2 IOH = -300 µA 1,2,3 -1.2 VIN = GND, VDD = 5.5 V 1,2,3 -100 IIH VIN = VDD = 5.5 V 1,2,3 IOZLPU Output disabled, 1,2,3 VIC Low level input current, pull-up 2/ Conditions -55°C ≤ TC ≤ 125°C VDD = 5.0 V ± 10% unless otherwise specified IILPU Pull-up output 2/ V µA µA 10 µA -100 VOUT = GND Output leakage high current 2/ IOZH Output disabled, 1,2,3 10 µA VOUT = VDD Low level input voltage VIL Functional verification 1,2,3 0.8 V Low level output voltage BUF 2/ VOL VDD = 5.5 V, IOL = 3 mA 1,2,3 0.4 V High level output voltage BUF VOH VDD = 4.5 V, IOH = -3 mA 1,2,3 3.9 V VIH Functional verification 1,2,3 2.2 V IDDSB VDD = 5.5 V, 1,2,3 20 µA 1,2,3 20 µA High level input voltage 1/ 1/ Supply current standby 2/ 2/ Static mode, Output = 0 mA Supply current operating 2/ IDDOP VDD = 5.5 V, F = 10 MHz Output = 0 mA Input capacitance 3/ CI VDD = 0 V 4 8 pF Output capacitance 3/ CIO VDD = 0 V 4 12 pF See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55°C ≤ TC ≤ 125°C VDD = 5.0 V ± 10% unless otherwise specified Limits Units Group A Subgroups Min. Propagation delay U1D to MC Max. TPBUS_MC 9,10,11 26 ns Propagationg delay MD to CERRN TPCERRN 9,10,11 33 ns Propagationg delay MD to U1D TPBUS_U1 9,10,11 33 ns Propagationg delay U1D to MD TPBUS_MD 9,10,11 15 ns TPBU_U2 9,10,11 22 ns Enable time from TN to U1D TPZ1BUS_U1 9,10,11 23 ns Disable time from TN to U1D TPZ2BUS_U1 9,10,11 23 ns Enable time from U2X1N to MC TPZ1BUS_MC 9,10,11 22 ns Disable time from TN to MC TPZ2BUS_MC 9,10,11 22 ns Enable time from U2X1N to MD TPZ1BUS_MD 9,10,11 22 ns Disable time from TN to MD TPZ2BUS_MD 9,10,11 22 ns Enable time from U2X1N to U2D TPZ1BUS_U2 9,10,11 22 ns Disable time from TN to U2D TPZ2BUS_U2 9,10,11 23 ns Propagationg delay Correct, Syn to U2D Notes: 1/ Forcing conditions of the functional test, assure that these limits are met, but they will not be individually recorded. 2/ Read and record measurements in accordance with MIL-PRF-38535. 3/ Tested at initial design and after major process changes, otherwise guaranteed. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL SHEET 6 CASE X Symbol Millimeters Inches Min Max Min Max A 2.21 2.67 0.087 0.105 c 0.15 0.20 0.006 0.008 D/E 31.80 32.80 1.252 1.291 D1/E1 18.80 19.30 0.740 0.760 e 0.635 BSC 0.025 BSC f 0.254 REF 0.010 REF A1 1.83 A2 L 2.24 0.072 0.203 REF 6.50 N1/N2 0.088 0.008 REF 6.75 0.256 25 0.266 25 Figure 1. Case Outline STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 7 CASE Y Symbol Millimeters Min Inches Max A Min Max 3.81 c 0.150 0.15 TYP 0.006 TYP D 23.76 24.48 0.935 0.964 D1 19.80 20.20 0.780 0.795 E 17.80 18.44 0.701 0.725 E1 13.85 14.15 0.545 0.557 e 0.65 BSC 0.0256 BSC f 0.17 0.33 0.0067 0.013 J 0.10 0.36 0.004 0.014 L 0.61 1.01 0.024 0.040 D2 15.87 16.13 0.624 0.635 E2 9.87 10.13 0.388 0.399 σ = 4° ±4° N1 = 30 N2 = 20 Figure 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 8 CASE Z Millimeters Symbol Min Max A A1 Inches Min Max 3.30 0.90 c 0.130 1.10 0.035 0.15 TYP 0.043 0.006 TYP D 27.50 28.50 1.08 1.12 D1 19.80 20.20 0.780 0.795 E 21.50 22.50 0.846 0.886 E1 13.85 14.15 0.545 0.557 e 0.65 BSC 0.0256 BSC f 0.22 0.38 0.008 0.015 L 3.70 4.30 0.146 0.170 D2 15.87 16.13 0.624 0.635 E2 9.87 10.13 0.388 0.399 N1 = 30 N2 = 20 Figure 1. Case Outline – Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 9 Terminal Signal name Burn-in Terminal connection number NC NC 26 2 NC NC 3 M2N S5 4 VSS 5 6 number 1 Signal name Burn-in connection CERRN R VDD 27 N22 R GND 28 U1D(15) S1 GND 29 NC NC U2D(15) S4 30 NC NC U2D(14) S3 31 NC NC 7 U2D(13) S4 32 VDD VDD 8 U2D(12) S3 33 U1D(14) S2 9 VDD VDD 34 U1D(13) S3 10 U2D(11) S2 35 U1D(12) S4 11 U2D(10) S1 36 VSS GND 12 U2D(9) S1 37 U1D(11) S3 13 U2D(8) S1 38 U1D(10) S2 14 VSS GND 39 U1D(9) S1 15 U2D(7) S1 40 U1D(8) S1 16 U2D(6) S2 41 VDD VDD 17 U2D(5) S2 42 U1D(7) S2 18 U2D(4) S2 43 U1D(6) S2 19 VDD VDD 44 U1D(5) S4 20 U2D(3) S1 45 U1D(4) S3 21 U2D(2) S1 46 VSS GND 22 U2D(1) S3 47 U1D(3) S2 23 U2D(0) S1 48 U1D(2) S1 24 VSS GND 49 U1D(1) S2 25 NCERRN R VDD 50 NC NC Note: S1 to S10 are connected to a square wave generator (10 KHz) through a resistor R = 1 KΩ Figure 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 10 Terminal Signal name number Burn-in Terminal Signal name Burn-in connection number 51 NC NC 76 MD(14) connection S2 52 NC NC 77 MD(15) S2 53 U1D(0) S1 78 VSS GND 54 VDD VDD 79 NC NC 55 RxW1N S8 80 NC NC 56 EN1N R GND 81 NC NC 57 M1N S7 82 NC NC 58 VSS GND 83 MC0 S2 59 MD(0) S1 84 MC1 S2 60 MD(1) S2 85 MC2 S1 61 MD(2) S2 86 MC3 S3 62 MD(3) S3 87 VDD VDD 63 VDD VDD 88 MC4 S4 64 MD(4) S4 89 MC5 S1 65 MD(5) S2 90 MC6 S2 66 MD(6) S1 91 MC7 S3 67 MD(7) S4 92 VSS GND 68 VSS GND 93 VSS GND 69 MD(8) S3 94 EN2 R GND 70 MD(9) S1 95 U2xU1 S10 71 MD(10) S3 96 IN S9 72 MD(11) S1 97 SYC R VDD 73 VDD VDD 98 CORR R VDD 74 MD(12) S1 99 RxW2N S6 75 MD(13) S4 100 VDD VDD Note: S1 to S10 are connected to a square wave generator (10 KHz) through a resistor R = 1 KΩ Figure 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 11 Figure 3. Block diagram and functional diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 12 Propagation delays t2 t3 t13 t4 13 ns 26 ns 18 ns 14 ns Output enable/ t18 t20 t21 t22 Disable time 23 ns 22 ns 22 ns 19 ns Figure 4. Timing waveforms. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 13 Propagation delays t1 t12 t13 14 ns 20 ns 18 ns Output enable/ t18 t19 t20 t21 t22 t23 Disable time 23 ns 23 ns 22 ns 22 ns 19 ns 19 ns Figure 4. Timing waveforms - Continued. . STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 14 t4 t5 t6 t7 t8 t9 t10 t15 t16 t17 24 ns 22 ns 24 ns 32 ns 31 ns 32 ns 19 ns 24 ns 24 ns 24 ns Output enable/ t18 t22 Disable time 21 ns 19 ns Propagation delays Figure 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 15 Propagation delays t1 t12 t13 14 ns 20 ns 18 ns Output enable/ t18 t19 t20 t21 t22 t23 Disable time 23 ns 23 ns 22 ns 22 ns 19 ns 19 ns Figure 4. Timing waveforms - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 16 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q, and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, D or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535 appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the functionality of the device. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 17 TABLE II. Electrical test requirements. Subgroups (in accordance with MIL-STD-883, method 5005, table I) Test requirements Interim electrical parameters (see 4.2) Subgroups (in accordance with MIL-PRF-38535, table III) Device class M Device class Q Device class V 1,7,9 1,7,9 1,7,9 1,2,3,7,8,9, 10,11 1/ 3/ 1,2,3,7,8,9, 10,11 2/ 3/ 1,2,3,4,7,8, 9,10,11 1,2,3,4,7,8, 9,10,11 1,2,3,7,8,9, 10,11 3/ 1,2,3,7,8,9, 10,11 3/ Final electrical parameters (see 4.2) 1,2,3,7,8,9,10,11 Group A test requirements (see 4.4) 1,2,3,4,7,8,9,10,11 1/ Group C end point electrical parameters (see 4.4) 1,7,9 Group D end point electrical parameters (see 4.4) 1,7,9 1,7,9 1,7,9 Group E end point electrical parameters (see 4.4) 1,7,9 1,7,9 1,7,9 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 3/ Delta limits are as specified in table IIB herein and shall be required where specified in table I. TABLE IIB Delta limits. Parameter 1/ High level input current 2/ Output leakage high current 2/ Symbol Test method Test conditions Change limit Unit IIH ±0.1 µA IOZH ±0.1 µA IDDSBA As per Table I ±2 µA Low level output voltage VOL As per Table I ±100 mV High level output voltage VOH ±100 mV Supply current stand-by for array 1/ 2/ The parameters shall be recorded before and after the required burn-in and life test to determine the delta limits. Only for inputs and I/O without pull up or pull down. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 18 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All o device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25 C o ±5 C, after exposure, to the subgroups specified in table II herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 19 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-01A18 A REVISION LEVEL A SHEET 20 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-07-24 Approved sources of supply for SMD 5962-01A19 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-01A1801QXC 3/ MMKR-29C516EMQ 5962-01A1801VXC 3/ SMKR-29C516ESV 5962-01A1801QYC F7400 MMFR-29C516EMQ 5962-01A1801VYC F7400 SMFR-29C516ESV 5962-01A1801QZC F7400 MMKR-29C516EMQ 5962-01A1801VZC F7400 SMKR-29C516ESV 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ This case outline is no longer available from an approved source. Vendor CAGE number F7400 Vendor name and address Atmel Nantes S.A. Part of Atmel Wireless & Microcontrollers La Chantrerie BP 70602 44306 Nantes Cedex 3 France The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.