SAM D09 - Summary

Atmel SAM D09
SMART ARM-Based Microcontroller
DATASHEET SUMMARY
Description
The Atmel® | SMART™ SAM D09 is a series of low-power microcontrollers using the 32-bit
ARM® Cortex®-M0+ processor, and ranging from 14- to 24-pins with up to16KB Flash and 4KB of
SRAM. The SAM D09 devices operate at a maximum frequency of 48MHz and reach
2.46 Coremark/MHz. They are designed for simple and intuitive migration with identical
peripheral modules, hex compatible code, identical linear address map and pin compatible
migration paths between all devices in the product series. All devices include intelligent and
flexible peripherals, Atmel Event System for inter-peripheral signaling, and support for capacitive
touch button, slider and wheel user interfaces. The SAM D09 series is compatible to the other
product series in the SAM D family, enabling easy migration to larger device with added features.
The Atmel SAM D09 devices provide the following features: In-system programmable Flash, sixchannel direct memory access (DMA) controller, 6 channel Event System, programmable
interrupt controller, up to 22 programmable I/O pins, 32-bit real-time clock and calendar, two 16bit Timer/Counters (TC), where each TC can be configured to perform frequency and waveform
generation, accurate program execution timing or input capture with time and frequency
measurement of digital signals. The TCs can operate in 8- or 16-bit mode, selected TCs can be
cascaded to form a 32-bit TC, and one timer/counter has extended functions optimized for motor,
lighting and other control applications. The series provide two Serial Communication Modules
(SERCOM) that each can be configured to act as an USART, UART, SPI, I2C, SMBus, PMBus
and LIN slave; up to 10-channel 350ksps 12-bit ADC with programmable gain and optional
oversampling and decimation supporting up to 16-bit resolution, programmable Watchdog Timer,
brown-out detector and power-on reset and two-pin Serial Wire Debug (SWD) program and
debug interface.
All devices have accurate and low-power external and internal oscillators. All oscillators can be
used as a source for the system clock. Different clock domains can be independently configured
to run at different frequencies, enabling power saving by running each peripheral at its optimal
clock frequency, and thus maintaining a high CPU frequency while reducing power consumption.
The SAM D09 devices have two software-selectable sleep modes, idle and standby. In idle mode
the CPU is stopped while all other functions can be kept running. In standby all clocks and
functions are stopped expect those selected to continue running. The device supports
SleepWalking. This feature allows the peripheral to wake up from sleep based on predefined
conditions, and thus allows the CPU to wake up only when needed, e.g. when a threshold is
crossed or a result is ready. The Event System supports synchronous and asynchronous events,
allowing peripherals to receive, react to and send events even in standby mode.
The Flash program memory can be reprogrammed in-system through the SWD interface. The
same interface can be used for non-intrusive on-chip debug and trace of application code. A boot
loader running in the device can use any communication interface to download and upgrade the
application program in the Flash memory.
The Atmel SAM D09 devices are supported with a full suite of program and system development
tools, including C compilers, macro assemblers, program debugger/simulators, programmers and
evaluation kits.
Atmel-42414FS-SAM-D09-Summary_05/2016
SMART
Features
z Processor
z ARM Cortex-M0+ CPU running at up to 48MHz
z Single-cycle hardware multiplier
z Micro Trace Buffer
z Memories
z 8/16KB in-system self-programmable Flash
z 4KB SRAM Memory
z System
z Power-on reset (POR) and brown-out detection (BOD)
z Internal and external clock options with 48MHz Digital Frequency Locked Loop (DFLL48M) and 48MHz to 96MHz Fractional
Digital Phase Locked Loop (FDPLL96M)
z External Interrupt Controller (EIC)
z 8 external interrupts
z One non-maskable interrupt
z Two-pin Serial Wire Debug (SWD) programming, test and debugging interface
z Low Power
z Idle and standby sleep modes
z SleepWalking peripherals
z Peripherals
z 6-channel Direct Memory Access Controller (DMAC)
z 6-channel Event System
z Two 16-bit Timer/Counters (TC), configurable as either:
z One 16-bit TC with compare/capture channels
z One 8-bit TC with compare/capture channels
z One 32-bit TC with compare/capture channels, by using two TCs
z 32-bit Real Time Counter (RTC) with clock/calendar function
z Watchdog Timer (WDT)
z CRC-32 generator
z Two Serial Communication Interfaces (SERCOM), each configurable to operate as either:
z USART with full-duplex and single-wire half-duplex configuration
z I2C Bus
z SMBUS/PMBUS
z SPI
z LIN slave
z 12-bit, 350ksps Analog-to-Digital Converter (ADC) with up to 10 channels
z Differential and single-ended input
z 1/2x to 16x programmable gain stage
z Automatic offset and gain error compensation
z Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution
z I/O
z Up to 22 programmable I/O pins
z Packages
z 24-pin QFN
z 14-pin SOIC
z Operating Voltage
z 2.4V – 3.63V
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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1.
Configuration Summary
Table 1-1.
Configuration Summary
SAM D09D – 24-pin QFN
SAM D09C – 14-pin SOIC
Pins
24
14
General Purpose I/O-pins (GPIOs)
22
12
Flash
16KB
8KB
SRAM
4KB
4KB
Timer Counter (TC)
2
2(1)
Waveform output channels for TC
2
2
DMA channels
6
6
Serial Communication Interface (SERCOM)
2
2
Analog-to-Digital Converter (ADC) channels
10
5
Real-Time Counter (RTC)
Yes
Yes
1
1
1 32-bit value or
2 16-bit values
1 32-bit value or
2 16-bit values
8
8
48MHz
48MHz
QFN
SOIC
RTC alarms
RTC compare values
External Interrupt lines
Maximum CPU frequency
Packages
32.768kHz crystal oscillator (XOSC32K)
0.4-32MHz crystal oscillator (XOSC)
32.768kHzinternal oscillator (OSC32K)
32kHz ultra-low-power internal oscillator (OSCULP32K)
8MHz high-accuracy internal oscillator (OSC8M)
48MHz Digital Frequency Locked Loop (DFLL48M)
96MHz Fractional Digital Phased Locked Loop (FDPLL96M)
Oscillators
Event System channels
6
6
SW Debug Interface
Yes
Yes
Watchdog Timer (WDT)
Yes
Yes
Note:
1.
The signals for TC2 are not routed out on the 14-pin package.
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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2.
Ordering Information
SAMD 09 C 13 A - M U T
Package Carrier
Product Family
SAMD = General Purpose Microcontroller
No character = Tray (Default)
T = Tape and Reel
Product Series
Package Grade
09 = Cortex M0+ DMA
O
Pin Count
U = -40 - 85 C Matte Sn Plating
C = 14 pins
D = 24 pins
Package Type
Flash Memory Density
M = QFN
SS = SOIC
14 = 16KB
13 = 8KB
Device Variant
A = Default Variant
2.1
SAM D09C – 14-pin SOIC
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
8K
4K
SOIC14
Tape & Reel
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
16K
4K
QFN24
Tape & Reel
ATSAMD09C13A-SSUT
2.2
SAM D09D – 24-pin QFN
Ordering Code
ATSAMD09D14A-MUT
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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Block Diagram
CORTEX-M0+
PROCESSOR
Fmax 48 MHz
SERIAL
WIRE
DEVICE
SERVICE
UNIT
8/16 KB
NVM
4 KB
RAM
NVM
CONTROLLER
Cache
SRAM
CONTROLLER
M
M
M
S
M
HIGH SPEED
BUS MATRIX
PERIPHERAL
ACCESS CONTROLLER
S
S
AHB-APB
BRIDGE B
AHB-APB
BRIDGE A
AHB-APB
BRIDGE C
PERIPHERAL
ACCESS CONTROLLER
SYSTEM CONTROLLER
2x
6 SERCOM
x SERCOM
XOSC
DFLL48M
FDPLL96M
EVENT SYSTEM
OSC32K
XOSC32K
OSC8M
XIN
XOUT
DMA
VREF
OSCULP32K
XOUT32
XIN32
DMA
S
PERIPHERAL
ACCESS CONTROLLER
BOD33
S
PAD0
PAD1
PAD2
PAD3
DMA
2 x TIMER / COUNTER
8 x Timer Counter
WO0
PORT
SWCLK
SWDIO
MICRO
TRACE BUFFER
IOBUS
PORT
3.
WO1
AIN[9..0]
DMA
10-CHANNEL
12-bit ADC 350KSPS
VREFA
VREFB
POWER MANAGER
CLOCK
CONTROLLER
RESETN
RESET
CONTROLLER
GCLK_IO[5..0]
SLEEP
CONTROLLER
GENERIC CLOCK
CONTROLLER
REAL TIME
COUNTER
WATCHDOG
TIMER
EXTINT[7..0]
NMI
2.
EXTERNAL INTERRUPT
CONTROLLER
Some products have different number of SERCOM instances and ADC signals.
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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4.
Pinout
4.1
SAM D09C 14-pin SOIC
PA05
1
14
PA04
PA08
2
13
PA02
PA09
3
12
VDDIO/IN/ANA
PA14
4
11
GND
PA15
5
10
PA25
6
9
PA24
7
8
PA31
PA28/RST
PA30
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
RESET/GPIO PIN
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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GND
PA25
PA24
PA31
PA30
24
23
22
21
20
19
VDDIO/IN/ANA
SAM D09D 24-pin QFN
1
2
3
4
5
6
18
17
16
15
14
13
PA28/RST
PA27
PA23
PA22
PA17
PA16
7
8
9
10
11
12
PA02
PA03
PA04
PA05
PA06
PA07
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
RESET/GPIO PIN
PA08
PA09
PA10
PA11
PA14
PA15
4.2
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5.
Product Mapping
Figure 5-1. Atmel SAM D09 Product Mapping
Global Memory Space
0x00000000
Code
0x00000000
Internal Flash
Code
0x20000000
0x00004000
Reserved
SRAM
0x1FFFFFFF
0x20001000
Undefined
0x40000000
AHB-APB Bridge C
SRAM
0x20000000
Peripherals
0x42000000
PAC2
0x42000400
Internal SRAM
EVSYS
0x42000800
SERCOM0
0x20001000
0x43000000
0x42000C00
Reserved
0x60000000
AHB-APB
SERCOM1
0x42001000
Reserved
0x40000000
AHB-APB
Bridge A
Undefined
0x42001400
Reserved
0x42001800
0x60000200
TC1
0x41000000
AHB-APB
Bridge B
Reserved
0xFFFFFFFF
0x42001C00
TC2
0x42002000
0x42000000
AHB-APB
Bridge C
0x42FFFFFF
ADC
0x42002400
Reserved
0x42002800
Reserved
AHB-APB Bridge A
0x42002C00
AHB-APB Bridge B
0x41000000
0x40000000
PAC1
PAC0
DSU
PM
0x41004000
0x40000800
NVMCTRL
SYSCTRL
0x41004400
0x40000C00
PORT
GCLK
0x41004800
0x40001000
DMAC
WDT
0x41005000
0x40001400
Reserved
RTC
0x41006000
0x40001800
MTB
EIC
0x41004700
0x40001C00
Reserved
0x40FFFFFF
Reserved
0x40FFFFFF
0x41002000
0x40000400
Reserved
0x42003000
Reserved
0x41FFFFFF
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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6.
Processor And Architecture
6.1
Cortex M0+ Processor
The Atmel SAM D09 implements the ARM® Cortex™-M0+ processor, which is based on the ARMv6 Architecture and
Thumb®-2 ISA. The Cortex M0+ is 100% instruction set compatible with its predecessor, the Cortex-M0 processor,
and upward compatible to Cortex-M3 and M4 processors.
For more information refer to www.arm.com.
6.1.1
Cortex M0+ Configuration
Features
Configuration option
Atmel SAM D09 configuration
Interrupts
External interrupts 0-32
32
Data endianness
Little-endian or big-endian
Little-endian
SysTick timer
Present or absent
Present
Number of watchpoint comparators
0, 1, 2
2
Number of breakpoint comparators
0, 1, 2, 3, 4
4
Halting debug support
Present or absent
Present
Multiplier
Fast or small
Fast (single cycle)
Single-cycle I/O port
Present or absent
Present
Wake-up interrupt controller
Supported or not supported
Not supported
Vector Table Offset Register
Present or absent
Present
Unprivileged/Privileged support
Present or absent
Absent(1)
Memory Protection Unit
Not present or 8-region
Not present
Reset all registers
Present or absent
Absent
Instruction fetch width
16-bit only or mostly 32-bit
32-bit
Note:
1.
All software run in privileged mode only
The ARM Cortex-M0+ core has two bus interfaces:
z
Single 32-bit AMBA®-3 AHB-Lite™ system interface that provides connections to peripherals and all
system memory, including flash and RAM
z
Single 32-bit I/O port bus interfacing to the PORT with one-cycle loads and stores
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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7.
Packaging Information
7.1
Thermal Considerations
7.1.1
Thermal Resistance Data
Table 6-1 on page 13 summarizes the thermal resistance data depending on the package.
Table 7-1.
7.1.2
Thermal Resistance Data
Package Type
θJA
θJC
Units
24-pin QFN
61.7
25.4
°C/W
14-pin SOIC
58.5
26.3
°C/W
Junction Temperature
The average chip-junction temperature, TJ, in °C can be obtained from the following:
Equation 1
T J = T A + ( P D × θ JA )
Equation 2
T J = T A + ( P D × ( θ HEATSINK + θ JC ) )
where:
z
θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 6-1 on page 13.
z
θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in Table 6-1 on page
13.
z
θHEATSINK = cooling device thermal resistance (°C/W), provided in the device datasheet.
z
PD = device power consumption (W).
z
TA = ambient temperature (°C).
From the Equation 1, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary
or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting
average chip-junction temperature TJ in °C.
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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7.2
Package Drawings
7.2.1
24-pin QFN
Table 7-2.
Device and Package Maximum Weight
44
mg
Table 7-3.
Package Characteristics
Moisture Sensitivity Level
Table 7-4.
MSL3
Package Reference
JEDEC Drawing Reference
MO-220
JESD97 Classification
E3
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Table 7-5.
7.2.2
14-pin SOIC
Table 7-6.
Device and Package Maximum Weight
230
mg
Table 7-7.
Package Characteristics
Moisture Sensitivity Level
Table 7-8.
MSL3
Package Reference
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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JEDEC Drawing Reference
MS-012
JESD97 Classification
E3
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7.3
Soldering Profile
The following table gives the recommended soldering profile from J-STD-20.
Profile Feature
Green Package
Average Ramp-up Rate (217°C to peak)
3°C/s max
Preheat Temperature 175°C +/-25°C
150-200°C
Time Maintained Above 217°C
60-150s
Time within 5°C of Actual Peak Temperature
30s
Peak Temperature Range
260°C
Ramp-down Rate
6°C/s max
Time 25°C to Peak Temperature
8 minutes max
A maximum of three reflow passes is allowed per component.
___REV___373875
Atmel | SMART SAM D09 [DATASHEET SUMMARY]
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Table of Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1. Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
2.2
SAM D09C – 14-pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
SAM D09D – 24-pin QFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1
4.2
SAM D09C 14-pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SAM D09D 24-pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Product Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6. Processor And Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.1
Cortex M0+ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7. Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7.1
7.2
7.3
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
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