Data Sheet

Freescale Semiconductor
Technical Data
Document Number: MMG3004NT1
Rev. 9, 10/2014
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
MMG3004NT1
Broadband High Linearity Amplifier
The MMG3004NT1 is a general purpose amplifier that is internally
prematched and designed for a broad range of Class A, small--signal, high
linearity, general purpose applications. It is suitable for applications with
frequencies from 400 to 2200 MHz such as cellular, PCS, WLL, PHS,
VHF, UHF, UMTS and general small--signal RF.
400--2200 MHz, 17 dB
27 dBm
InGaP HBT GPA
Features
 Frequency: 400--2200 MHz
 P1dB: 27 dBm @ 2140 MHz
 Small--Signal Gain: 17 dB @ 2140 MHz
 Third Order Output Intercept Point: 44 dBm @ 2140 MHz
 Single 5 V Supply
 Internally Prematched to 50 Ohms
 In Tape and Reel. T1 Suffix = 1,000 Units, 16 mm Tape Width, 13--inch Reel.
PQFN 5  5
Table 1. Typical Performance (1)
Table 2. Maximum Ratings
Rating
Symbol
900
MHz
1960
MHz
2140
MHz
Unit
Small--Signal Gain
(S21)
Gp
19.5
16.5
17
dB
Input Return Loss
(S11)
IRL
--7.5
--8
--8
dB
Output Return Loss
(S22)
ORL
--10
--12
--12
dB
Power Output @ 1dB
Compression
P1dB
27
27
27
dBm
Third Order Output
Intercept Point
OIP3
44
44
44
dBm
Characteristic
Symbol
Value
Unit
Supply Voltage
VDC
6
V
Supply Current
IDC
400
mA
RF Input Power
Pin
18
dBm
Storage Temperature Range
Tstg
--65 to +150
C
Junction Temperature
TJ
150
C
1. VDC = 5 Vdc, TA = 25C, 50 ohm system, application circuit
tuned for specified frequency.
Table 3. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 90C, 5 Vdc, 260 mA, no RF applied
Symbol
Value (2)
Unit
RJC
23.2
C/W
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
 Freescale Semiconductor, Inc., 2005--2011, 2014. All rights reserved.
RF Device Data
Freescale Semiconductor, Inc.
MMG3004NT1
1
Table 4. Electrical Characteristics (VDC = 5 Vdc, 2140 MHz, TA = 25C, 50 ohm system, in Freescale Application Circuit)
Symbol
Min
Typ
Max
Unit
Small--Signal Gain (S21)
Characteristic
Gp
15
17
—
dB
Input Return Loss (S11)
IRL
—
--8
—
dB
Output Return Loss (S22)
ORL
—
--12
—
dB
Power Output @ 1dB Compression
P1dB
—
27
—
dBm
Third Order Output Intercept Point
OIP3
—
44
—
dBm
Noise Figure
NF
—
3.4
—
dB
Supply Current
IDC
215
250
275
mA
Supply Voltage
VDC
—
5
—
V
Table 5. Functional Pin Description
Name
Pin
Number
RFin
2, 3, 4
RFout/
VCC
10, 11, 12
VCC
14
Collector voltage supply.
VBA
16
Bias voltage supply.
GND
Backside
Center
Metal
VBA N.C. VCC
Description
RF input for the power amplifier. This pin is DC--coupled and
requires a DC--blocking series capacitor.
RF output for the power amplifier. This pin is DC--coupled
and requires a DC--blocking series capacitor.
The center metal base of the PQFN package provides both
DC and RF ground as well as heat sink contact for the
power amplifier.
N.C.
1
RFin
16
15
14
13
N.C.
2
12
RFout/VCC
RFin
3
11
RFout/VCC
RFin
4
10
RFout/VCC
N.C.
5
9
N.C.
6
7
8
N.C. N.C. N.C.
(Top View)
Figure 1. Pin Connections
Table 6. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD22--A114)
1B
Machine Model (per EIA/JESD22--A115)
A
Charge Device Model (per JESD22--C101)
III
Table 7. Moisture Sensitivity Level
Test Methodology
Per JESD22--A113, IPC/JEDEC J--STD--020
Rating
Package Peak Temperature
Unit
3
260
C
MMG3004NT1
2
RF Device Data
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
ICC, COLLECTOR CURRENT (mA)
300
250
200
150
100
50
N.C.
1
RFin
VBA N.C. VCC
16 15 14
13
N.C.
2
12
RFout/VCC
RFin
3
11
RFout/VCC
RFin
4
10
RFout/VCC
N.C.
5
9
N.C.
6
8
N.C. N.C. N.C.
VCC = 5 Vdc
0
0
7
1
2
4
3
(Top View)
5
Pin Connections
VBA, BIAS VOLTAGE (V)
106
55
50
210 mA
45
IDC = 250 mA
MTTF (YEARS)
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
Figure 2. Collector Current versus Bias Voltage
at Pin 16
40
165 mA
35
30
105
104
VDC = 5 Vdc
f1 = 2140 MHz
f2 = 2141 MHz
25
103
20
5
10
15
20
25
Pout, OUTPUT POWER (dBm)
NOTE: Supply current is varied under external resistor control. Peak
power is not reduced at any listed current. Similar results can be
obtained for other frequency bands.
30
120
125
130
135
140
145
150
TJ, JUNCTION TEMPERATURE (C)
NOTE: The MTTF is calculated with VDC = 5 Vdc, IDC = 250 mA
Figure 4. MTTF versus Junction Temperature
Figure 3. Third Order Output Intercept Point
versus Output Power and Supply Current
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
3
50 OHM APPLICATION CIRCUIT: 900 MHz
VSUPPLY
R2
R1
C4
C3
C5
1
RF
INPUT
Z1
Z2
Z3
Z4
Z5
L2
C1
C7
C8
15
14
Current Mirror
2
13
Z6
11
DUT
4
6
7
0.140 x 0.028 Microstrip
0.060 x 0.028 Microstrip
0.192 x 0.028 Microstrip
0.055 x 0.028 Microstrip
0.084 x 0.028 Microstrip
C6
L1
12
3
5
Z1, Z11
Z2, Z10
Z3
Z4
Z5
16
Z8
Z7
Z6
Z7
Z8
Z9
PCB
Z10
L3
Z11
C2
10
8
Z9
RF
OUTPUT
C9
C10
9
0.089 x 0.028 Microstrip
0.051 x 0.028 Microstrip
0.055 x 0.028 Microstrip
0.112 x 0.028 Microstrip
Isola FR408, 0.014, r = 3.7
Figure 5. 50 Ohm Test Circuit Schematic
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
15 pF Chip Capacitors
ECUV1H150JCV
Panasonic
C3, C5
0.01 F Chip Capacitors
C0603C103J5RAC
Kemet
C4, C6
0.1 F Chip Capacitors
C0603C104J5RAC
Kemet
C7, C8
2.2 pF Chip Capacitors
06035J2R2BS
AVX
C9, C10
1.8 pF Chip Capacitors
06035J1R8BS
AVX
L1
33 nH Chip Inductor
LL1608--FSL33NJ
Toko
L2, L3
3.9 nH Chip Inductors
LL1608--FSL3N9S
Toko
R1
22 , 1/10 W Chip Resistor
CRCW060322R0FKEA
Vishay
R2
0 , 1/10 W Chip Resistor
CRCW06030000FKEA
Vishay
MMG3004NT1
4
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 900 MHz
VBA
VSUPPLY
R2
R1
C5
C6
C3
C4
RFin
RFout
L1
L2
C1
C7
C8
L3
C9
C10
C2
MMG3004/5 Rev. 3
Figure 6. 50 Ohm Test Circuit Component Layout
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
5
50 OHM TYPICAL CHARACTERISTICS: 900 MHz
0
20
IRL, INPUT RETURN LOSS (dB)
Gp, SMALL--SIGNAL GAIN (dB)
21
TC = 25C
--40C
19
85C
18
--2
--4
--6
TC = 85C
--8
VDC = 5 Vdc
17
840
870
900
930
--10
840
960
Figure 8. Input Return Loss (S11) versus
Frequency
960
P1dB, 1 dB COMPRESSION POINT (dBm)
29
TC = --40C
--9
25C
--11
85C
--13
VDC = 5 Vdc
870
900
930
28
TC = 25C
85C
--40C
27
26
VDC = 5 Vdc
25
840
960
870
900
930
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
Figure 9. Output Return Loss (S22) versus
Frequency
Figure 10. P1dB versus Frequency
47
960
10
45
8
TC = 25C
43
--40C
41
85C
NF, NOISE FIGURE (dB)
ORL, OUTPUT RETURN LOSS (dB)
930
Figure 7. Small--Signal Gain (S21) versus
Frequency
--15
840
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
900
f, FREQUENCY (MHz)
--7
37
840
870
25C
f, FREQUENCY (MHz)
--5
39
--40C
VDC = 5 Vdc
TC = 85C
4
--40C
25C
2
VDC = 5 Vdc
1 MHz Tone Spacing
870
6
VDC = 5 Vdc
900
930
960
0
840
870
900
930
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
Figure 11. Third Order Output Intercept
Point versus Frequency
Figure 12. Noise Figure versus Frequency
960
MMG3004NT1
6
RF Device Data
Freescale Semiconductor, Inc.
--30
VDC = 5 Vdc, f = 900 MHz
Single--Carrier IS--95, 9 Channel Forward
750 kHz Measurement Offset
30 kHz Measurement Bandwidth
--35
--40
--45
TC = 85C
--50
25C
--40C
--55
19
21
23
25
27
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
50 OHM TYPICAL CHARACTERISTICS: 900 MHz
VDC = 5 Vdc, f = 900 MHz
Single--Carrier IS--95, 9 Channel Forward
885 kHz Measurement Offset
30 kHz Measurement Bandwidth
--40
--50
--60
TC = 85C
--70
25C
--40C
--80
17
19
21
23
25
27
Pout, OUTPUT POWER (dBm)
Pout, OUTPUT POWER (dBm)
Figure 13. IS--95 Adjacent Channel Power Ratio
versus Output Power
Figure 14. IS--95 Adjacent Channel Power Ratio
versus Output Power
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
7
50 OHM APPLICATION CIRCUIT: 1900--2200 MHz
VSUPPLY
R2
R1
C3
C4
C5
16
1
RF
INPUT
Z1
Z2
Z3
Z4
C1
C7
C8
14
Current Mirror
2
13
Z5
11
DUT
4
6
7
0.140 x 0.028 Microstrip
0.060 x 0.028 Microstrip
0.259 x 0.028 Microstrip
0.080 x 0.028 Microstrip
Z6
Z5
Z6
Z7
PCB
Z7
Z8
Z9
RF
OUTPUT
C2
10
8
C6
L1
12
3
5
Z1, Z9
Z2, Z8
Z3
Z4
15
C9
C10
9
0.049 x 0.028 Microstrip
0.036 x 0.028 Microstrip
0.254 x 0.028 Microstrip
Isola FR408, 0.014, r = 3.7
Figure 15. 50 Ohm Test Circuit Schematic
Table 9. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
15 pF Chip Capacitors
ECUV1H150JCV
Panasonic
C3, C5
0.01 F Chip Capacitors
C0603C103J5RAC
Kemet
C4, C6
0.1 F Chip Capacitors
C0603C104J5RAC
Kemet
C7, C10
0.5 pF Chip Capacitors
06035J0R5BS
AVX
C8
2.7 pF Chip Capacitor
06035J2R7BS
AVX
C9
0.8 pF Chip Capacitor
06035J0R8BS
AVX
L1
33 nH Chip Inductor
LL1608--FSL33NJ
Toko
R1
22 , 1/10 W Chip Resistor
CRCW060322R0FKEA
Vishay
R2
0 , 1/10 W Chip Resistor
CRCW06030000FKEA
Vishay
MMG3004NT1
8
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 1900--2200 MHz
VSUPPLY
VBA
R2
R1
C5
C6
C3
C4
RFin
C1
RFout
L1
C7
C8
C9
C10
C2
MMG3004/5 Rev. 3
Figure 16. 50 Ohm Test Circuit Component Layout
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
9
50 OHM TYPICAL CHARACTERISTICS: 1900--2200 MHz
--5
17
IRL, INPUT RETURN LOSS (dB)
Gp, SMALL--SIGNAL GAIN (dB)
18
TC = 25C
16
85C
15
--40C
14
13
1960
2020
2080
2140
25C
Figure 17. Small--Signal Gain (S21) versus
Frequency
Figure 18. Input Return Loss (S11) versus
Frequency
1960
2140
2200
P1dB, 1 dB COMPRESSION POINT (dBm)
29
--9
--11
TC = --40C
--13
85C
VDC = 5 Vdc
--15
1900
1960
25C
2020
2080
2140
28
TC = --40C
27
25C
VDC = 5 Vdc
25
1900
2200
85C
26
1960
2020
2080
2140
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
Figure 19. Output Return Loss (S22) versus
Frequency
Figure 20. P1dB versus Frequency
47
10
45
8
TC = 25C
43
--40C
41
37
1900
--40C
--9
2020
2080
f, FREQUENCY (MHz)
--7
39
TC = 85C
f, FREQUENCY (MHz)
NF, NOISE FIGURE (dB)
ORL, OUTPUT RETURN LOSS (dB)
--8
--10
1900
2200
--5
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
--7
VDC = 5 Vdc
VDC = 5 Vdc
12
1900
--6
85C
VDC = 5 Vdc
1 MHz Tone Spacing
1960
6
4
TC = 85C
2
--40C
VDC = 5 Vdc
2020
2080
2140
2200
2200
0
1900
1960
2020
2080
25C
2140
f, FREQUENCY (MHz)
f, FREQUENCY (MHz)
Figure 21. Third Order Output Intercept
Point versus Frequency
Figure 22. Noise Figure versus Frequency
2200
MMG3004NT1
10
RF Device Data
Freescale Semiconductor, Inc.
--30
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
50 OHM TYPICAL CHARACTERISTICS: 1900--2200 MHz
VDC = 5 Vdc, f = 1960 MHz
Single--Carrier IS--95, 9 Channel Forward
750 kHz Measurement Offset
30 kHz Measurement Bandwidth
--35
--40
--45
--50
--40C
TC = 85C
25C
--55
19
21
23
25
27
VDC = 5 Vdc, f = 1960 MHz
Single--Carrier IS--95, 9 Channel Forward
885 kHz Measurement Offset
30 kHz Measurement Bandwidth
--40
--50
--60
TC = 85C
--70
25C
--40C
--80
17
19
21
23
25
27
Pout, OUTPUT POWER (dBm)
Figure 23. IS--95 Adjacent Channel Power Ratio
versus Output Power
Figure 24. IS--95 Adjacent Channel Power Ratio
versus Output Power
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
Pout, OUTPUT POWER (dBm)
--20
--30
--40
TC = --40C
85C
--50
25C
--60
VDC = 5 Vdc, f = 2140 MHz
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF)
--70
16
18
20
22
24
26
Pout, OUTPUT POWER (dBm)
Figure 25. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
11
50 OHM TYPICAL CHARACTERISTICS
Table 10. Common Emitter S--Parameters (VDC = 5 Vdc, TA = 25C, 50 Ohm System)
S11
S21
S12
S22
f
MHz
|S11|

|S21|

|S12|

|S22|

400
0.62780
--155.59
7.75028
138.19
0.01341
--20.61
0.73308
177.59
425
0.64110
--156.56
7.52200
135.93
0.01318
--18.49
0.73263
177.05
450
0.65775
--157.61
7.40177
133.81
0.01297
--16.33
0.73058
176.51
475
0.67009
--158.60
7.20037
131.68
0.01282
--14.50
0.72961
176.03
500
0.68313
--159.63
7.05567
129.69
0.01265
--12.50
0.72804
175.54
525
0.69585
--160.59
6.91538
127.76
0.01255
--10.52
0.72718
175.02
550
0.70558
--161.46
6.69940
125.72
0.01251
--8.66
0.72650
174.46
575
0.71811
--162.43
6.60437
123.98
0.01243
--6.84
0.72500
173.90
600
0.72694
--163.35
6.42427
122.18
0.01240
--5.19
0.72458
173.43
625
0.73704
--164.30
6.29327
120.47
0.01238
--3.35
0.72338
172.92
650
0.74634
--165.20
6.17990
118.78
0.01241
--1.68
0.72241
172.43
675
0.75277
--166.03
5.99028
117.13
0.01246
--0.10
0.72250
171.98
700
0.76214
--166.98
5.91391
115.54
0.01249
1.32
0.72135
171.44
725
0.76874
--167.82
5.76815
114.00
0.01254
2.86
0.72103
170.97
750
0.77561
--168.72
5.64770
112.56
0.01262
4.27
0.72003
170.51
775
0.78327
--169.54
5.56291
111.09
0.01272
5.73
0.71950
170.03
800
0.78772
--170.26
5.40401
109.64
0.01285
7.01
0.71888
169.54
825
0.79476
--171.12
5.33575
108.25
0.01299
8.22
0.71803
169.01
850
0.79893
--171.88
5.21557
106.88
0.01314
9.31
0.71838
168.59
875
0.80421
--172.62
5.09417
105.61
0.01326
10.44
0.71707
168.13
900
0.80983
--173.40
5.04484
104.35
0.01340
11.44
0.71668
167.64
925
0.81256
--174.09
4.90083
102.95
0.01357
12.52
0.71611
167.14
950
0.81780
--174.81
4.83208
101.78
0.01377
13.37
0.71547
166.62
975
0.82118
--175.53
4.75850
100.63
0.01398
14.40
0.71514
166.17
1000
0.82354
--176.19
4.64462
99.41
0.01421
15.20
0.71375
165.68
1025
0.82863
--176.93
4.59813
98.27
0.01449
15.97
0.71292
165.18
1050
0.82994
--177.51
4.47959
97.05
0.01482
16.45
0.71160
164.72
1075
0.83369
--178.12
4.41800
96.02
0.01512
16.27
0.71100
164.34
1100
0.83728
--178.76
4.36819
95.02
0.01522
16.04
0.71111
163.96
1125
0.83914
--179.35
4.25589
93.92
0.01522
16.13
0.71104
163.46
1150
0.84333
--179.99
4.21812
92.91
0.01532
16.71
0.71144
162.96
1175
0.84582
179.42
4.14782
91.86
0.01540
17.23
0.71102
162.41
1200
0.84730
178.80
4.07433
90.84
0.01549
17.85
0.71091
161.96
1225
0.85017
178.20
4.03089
89.88
0.01563
18.56
0.71058
161.46
1250
0.85104
177.63
3.94928
88.92
0.01581
19.15
0.70945
160.92
1275
0.85363
177.01
3.91182
87.97
0.01603
19.78
0.70911
160.44
1300
0.85515
176.48
3.84948
86.97
0.01623
20.21
0.70802
159.92
1325
0.85660
175.94
3.79124
86.09
0.01644
20.62
0.70758
159.44
1350
0.85919
175.39
3.75583
85.18
0.01665
21.10
0.70645
158.93
1375
0.85982
174.86
3.68725
84.24
0.01685
21.41
0.70534
158.44
1400
0.86102
174.26
3.65116
83.37
0.01708
21.83
0.70492
157.95
1425
0.86270
173.77
3.60736
82.44
0.01733
22.12
0.70407
157.43
1450
0.86382
173.26
3.55564
81.56
0.01754
22.31
0.70310
156.95
1475
0.86525
172.73
3.51922
80.69
0.01778
22.70
0.70185
156.45
(continued)
MMG3004NT1
12
RF Device Data
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
Table 10. Common Emitter S--Parameters (VDC = 5 Vdc, TA = 25C, 50 Ohm System) (continued)
S11
S21
S12
S22
f
MHz
|S11|

|S21|

|S12|

|S22|

1500
0.86447
171.75
3.49706
79.68
0.01815
22.78
0.69775
156.18
1525
0.86543
171.19
3.46774
78.76
0.01841
22.92
0.69678
155.64
1550
0.86646
170.67
3.42587
77.92
0.01868
23.04
0.69558
155.13
1575
0.86663
170.18
3.38624
77.08
0.01889
23.19
0.69453
154.61
1600
0.86864
169.65
3.35249
76.23
0.01916
23.38
0.69264
154.06
1625
0.86848
169.14
3.31471
75.38
0.01940
23.47
0.69185
153.54
1650
0.86907
168.58
3.28145
74.52
0.01966
23.55
0.69110
153.02
1675
0.86995
168.06
3.24680
73.68
0.01990
23.70
0.68960
152.47
1700
0.86908
167.55
3.21301
72.89
0.02016
23.85
0.68912
152.02
1725
0.87075
166.99
3.17917
72.07
0.02043
23.94
0.68700
151.51
1750
0.87075
166.48
3.14872
71.28
0.02072
23.94
0.68638
151.05
1775
0.87095
165.94
3.11816
70.46
0.02101
24.02
0.68533
150.57
1800
0.87210
165.38
3.08624
69.66
0.02127
24.02
0.68377
150.09
1825
0.87206
164.86
3.05732
68.88
0.02156
24.07
0.68284
149.66
1850
0.87291
164.26
3.02693
68.07
0.02183
24.07
0.68136
149.22
1875
0.87225
163.73
2.99956
67.29
0.02214
24.03
0.68073
148.79
1900
0.87269
163.18
2.97218
66.53
0.02241
24.07
0.67941
148.37
1925
0.87341
162.62
2.94317
65.76
0.02272
24.05
0.67817
147.93
1950
0.87288
162.11
2.91922
65.01
0.02300
24.10
0.67684
147.54
1975
0.87403
161.54
2.88985
64.24
0.02333
23.99
0.67500
147.15
2000
0.87359
160.98
2.86616
63.49
0.02366
23.91
0.67393
146.75
2025
0.87242
160.38
2.84227
62.70
0.02397
23.80
0.67298
146.42
2050
0.87347
159.78
2.81763
61.98
0.02429
23.70
0.67159
146.04
2075
0.87337
159.25
2.79570
61.26
0.02465
23.66
0.67018
145.69
2100
0.87327
158.66
2.77239
60.53
0.02498
23.49
0.66901
145.36
2125
0.87318
158.11
2.75232
59.81
0.02536
23.32
0.66790
145.01
2150
0.87233
157.55
2.73039
59.07
0.02571
23.11
0.66702
144.69
2175
0.87291
156.95
2.70958
58.40
0.02602
22.93
0.66610
144.37
2200
0.87284
156.41
2.69236
57.69
0.02636
22.73
0.66519
144.03
2225
0.87305
155.87
2.67297
57.01
0.02672
22.55
0.66417
143.67
2250
0.87252
155.28
2.65614
56.29
0.02709
22.23
0.66378
143.30
2275
0.87193
154.76
2.63741
55.58
0.02744
22.01
0.66344
142.95
2300
0.87178
154.15
2.62034
54.89
0.02777
21.74
0.66387
142.57
2325
0.87159
153.64
2.60593
54.19
0.02812
21.52
0.66363
142.19
2350
0.87191
153.13
2.59024
53.50
0.02850
21.34
0.66365
141.75
2375
0.87202
152.60
2.57507
52.78
0.02891
21.08
0.66346
141.32
2400
0.87117
152.09
2.55841
52.08
0.02926
20.77
0.66342
140.87
2425
0.87077
151.53
2.54515
51.37
0.02967
20.45
0.66386
140.39
2450
0.87026
151.02
2.53215
50.65
0.03007
20.15
0.66405
139.92
2475
0.87003
150.54
2.51806
49.95
0.03047
19.77
0.66432
139.41
2500
0.86985
150.02
2.50328
49.24
0.03087
19.40
0.66490
138.85
2525
0.86940
149.49
2.49003
48.49
0.03126
18.98
0.66538
138.34
2550
0.86918
148.98
2.47736
47.77
0.03167
18.61
0.66582
137.78
2575
0.86921
148.48
2.46415
47.02
0.03208
18.11
0.66531
137.21
(continued)
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
13
50 OHM TYPICAL CHARACTERISTICS
Table 10. Common Emitter S--Parameters (VDC = 5 Vdc, TA = 25C, 50 Ohm System) (continued)
S11
S21
S12
S22
f
MHz
|S11|

|S21|

|S12|

|S22|

2600
0.86804
147.97
2.45098
46.28
0.03246
17.66
0.66588
136.62
2625
0.86808
147.46
2.43657
45.54
0.03287
17.21
0.66553
136.01
2650
0.86755
146.99
2.42271
44.82
0.03328
16.67
0.66525
135.46
2675
0.86741
146.47
2.41111
44.06
0.03360
16.15
0.66520
134.87
2700
0.86769
145.97
2.39656
43.31
0.03402
15.56
0.66461
134.26
2725
0.86693
145.47
2.38409
42.57
0.03438
15.04
0.66448
133.68
2750
0.86730
144.92
2.37136
41.82
0.03473
14.40
0.66407
133.13
2775
0.86724
144.42
2.35811
41.07
0.03504
13.77
0.66312
132.57
2800
0.86702
143.87
2.34590
40.30
0.03530
13.25
0.66208
132.00
2825
0.86694
143.37
2.33197
39.55
0.03566
12.69
0.66088
131.39
2850
0.86602
142.83
2.32062
38.80
0.03594
12.05
0.66087
130.80
2875
0.86701
142.28
2.30727
38.05
0.03623
11.45
0.65952
130.25
2900
0.86649
141.70
2.29559
37.30
0.03650
10.82
0.65833
129.72
2925
0.86653
141.16
2.28517
36.51
0.03678
10.22
0.65713
129.15
2950
0.86661
140.59
2.27190
35.74
0.03700
9.61
0.65548
128.55
2975
0.86565
140.01
2.26115
34.97
0.03725
9.07
0.65458
127.97
3000
0.86627
139.42
2.24868
34.20
0.03747
8.51
0.65272
127.41
MMG3004NT1
14
RF Device Data
Freescale Semiconductor, Inc.
2.2 x 2.2
1.35
0.6
2.6
5.3
0.8
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE BACKSIDE CENTER
METAL GROUND LANDING PATTERN.
3. REFER TO FREESCALE APPLICATION NOTE AN2467 FOR
ADDITIONAL PQFN PCB GUIDELINES.
Figure 26. Recommended Mounting Configuration
M004N
YYWW
Figure 27. Product Marking
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
15
PACKAGE DIMENSIONS
MMG3004NT1
16
RF Device Data
Freescale Semiconductor, Inc.
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
17
MMG3004NT1
18
RF Device Data
Freescale Semiconductor, Inc.
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
 AN1955: Thermal Measurement Methodology of RF Power Amplifiers
 AN3100: General Purpose Amplifier and MMIC Biasing
 AN3778: PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation
Software
 .s2p File
Development Tools
 Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to
Software & Tools on the part’s Product Summary page to download the respective tool.
FAILURE ANALYSIS
At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In
cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third
party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
2
Mar. 2007
Description
 Replaced Case Outline 1543--02 with updated 1543--03, Issue C, pp. 1, 16--18
 Added VCC callout to Pin Connections 10, 11, and 12 in Fig. 1, Pin Connections, p. 3
 Updated Part Numbers in Table 8, Component Designations and Values, 900 MHz, to RoHS compliant part
numbers, p. 5
 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 5, 50 Ohm Test Circuit Component
Layout, 900 MHz, p. 6
 Removed IDC value due to its variability over temperature, Figs. 12--13, IS--95 Adjacent Channel Power Ratio
versus Output Power, 900 MHz, p. 8
 Updated Part Numbers in Table 9, Component Designations and Values, 1900--2200 MHz, to RoHS compliant
part numbers, p. 9
 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 15, 50 Ohm Test Circuit Component
Layout, 1900--2200 MHz, p. 10
 Removed IDC value due to its variability over temperature, Figs. 22--23, IS--95 Adjacent Channel Power Ratio
versus Output Power, 1900--2200 MHz, and Fig. 24, Single--Carrier W--CDMA Adjacent Channel Power Ratio
versus Output Power, 1900--2200 MHz, p. 12
 Replaced Table 10, S--Parameters, pp. 13--15
 Added Product Documentation and Revision History, p. 19
3
Mar. 2008
 Corrected Tape and Reel information from 12 mm, 7--inch Reel to 16 mm, 13--inch Reel, p. 1
 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1

Corrected Fig. 24, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 12
 Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected frequency
values from GHz to MHz, pp. 13, 14, 15
4
June 2009
 Replaced Case Outline 1543--03, Issue C, with 1543--04, Issue D, pp. 1, 17--19. Corrected I/O dimension from
0.95--1.2 mm to 0.925--1.175 mm.
 Corrected temperature at which ThetaJC is measured from 25C to 88C, Thermal Characteristics table, p. 1
 Replaced Figs. 12 and 22, IS--95 Adjacent Channel Power Ratio versus Output Power, with revised graphs,
pp. 8, 12
(continued)
MMG3004NT1
RF Device Data
Freescale Semiconductor, Inc.
19
REVISION HISTORY (continued)
Revision
Date
5
May 2010
Description
 Changed Thermal Characteristics table values for Thermal Resistance from 33 to 23.2 as a result of an
improvement made in the thermal measurement method. IDC changed from 250 mA to 260 mA and TC
changed from 88C to 90C , p. 1
 Added new Fig. 3, Third Order Output Intercept Point versus Output Power and Supply Current, p. 4
 Added AN3778, PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat
Dissipation, Application Notes, p. 20
 Added .s2p File availability to Product Software, p. 20
6
Sept. 2010
 Modified data sheet to reflect slight IDC and Gain performance shift. Specification change allows recentering
for new GaAs Fab devices as described in Product and Process Change Notification number, PCN14154, p. 2
7
Jan. 2011
 Corrected temperature at which ThetaJC is measured from 25C to 90C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF
signal applied, p. 1
 Removed IDC bias callout from Table 10, Common Emitter S--Parameters heading as bias is not a controlled
value, pp. 13--15
 Added Printed Circuit Boards availability to Development Tools, p. 20
8
Oct. 2011
 Updated Small--Signal Gain performance to align with production test, p. 1
 Table 6, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD ratings
are characterized during new product development but are not 100% tested during production. ESD ratings
provided in the data sheet are intended to be used as a guideline when handling ESD sensitive devices, p. 3
9
Oct. 2014
 Added Fig. 27, Product Marking, p. 15
 Added Failure Analysis information, p. 19
MMG3004NT1
20
RF Device Data
Freescale Semiconductor, Inc.
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MMG3004NT1
Document
Number:
RF Device
DataMMG3004NT1
Rev.
9, 10/2014
Freescale
Semiconductor, Inc.
21