PIC16(L)F151X/152X PIC16(L)F151X/152X Memory Programming Specification This document includes the programming specifications for the following devices: 1.1.2 LOW-VOLTAGE ICSP PROGRAMMING • PIC16F1512 • PIC16LF1512 • PIC16F1513 • PIC16LF1513 • PIC16F1516 • PIC16LF1516 In Low-Voltage ICSP™ mode, these devices can be programmed using a single VDD source in the operating range. The MCLR/VPP pin does not have to be brought to a different voltage, but can instead be left at the normal operating voltage. • PIC16F1517 • PIC16LF1517 1.1.2.1 • PIC16F1518 • PIC16LF1518 • PIC16F1519 • PIC16LF1519 • PIC16F1526 • PIC16LF1526 • PIC16F1527 • PIC16LF1527 1.0 OVERVIEW The PIC16(L)F151X/152X devices can be programmed using either the high-voltage In-Circuit Serial Programming™ (ICSP™) method or the lowvoltage ICSP™ method. 1.1 1.1.1 Hardware Requirements HIGH-VOLTAGE ICSP PROGRAMMING In High-Voltage ICSP™ mode, these devices require two programmable power supplies; one for VDD and one for the MCLR/VPP pin. 2010-2011 Microchip Technology Inc. Single-Supply ICSP Programming The LVP bit in Configuration Word 2 enables singlesupply (low-voltage) ICSP programming. The LVP bit defaults to a ‘1’ (enabled) from the factory. The LVP bit may only be programmed to ‘0’ by entering the HighVoltage ICSP mode, where the MCLR/VPP pin is raised to VIHH. Once the LVP bit is programmed to a ‘0’, only the High-Voltage ICSP mode is available and only the High-Voltage ICSP mode can be used to program the device. Note 1: The High-Voltage ICSP mode is always available, regardless of the state of the LVP bit, by applying VIHH to the MCLR/ VPP pin. 2: While in Low-Voltage ICSP mode, MCLR is always enabled, regardless of the MCLRE bit, and the port pin can no longer be used as a general purpose input. Advance Information DS41442B-page 1 PIC16(L)F151X/152X 1.2 Pin Utilization Five pins are needed for ICSP™ programming. The pins are listed in Table 1-1 and Table 1-2. TABLE 1-1: Pin Name PIN DESCRIPTIONS DURING PROGRAMMING – PIC16(L)F1526 AND PIC16(L)F1527 During Programming Function Pin Type RB6 ICSPCLK I RB7 ICSPDAT I/O RG5/MCLR/VPP VDD VSS Legend: Note 1: Pin Description Clock Input – Schmitt Trigger Input Data Input/Output – Schmitt Trigger Input (1) Program Mode Select/Programming Power Supply VDD P Power Supply VSS P Ground Program/Verify mode P I = Input, O = Output, P = Power The programming high voltage is internally generated. To activate the Program/Verify mode, high voltage needs to be applied to MCLR input. Since the MCLR is used for a level source, MCLR does not draw any significant current. TABLE 1-2: Pin Name RB6 RB7 PIN DESCRIPTIONS DURING PROGRAMMING – PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516, PIC16(L)F1517, PIC16(L)F1518 and PIC16(L)F1519 During Programming Function Pin Type ICSPCLK I Pin Description Clock Input – Schmitt Trigger Input ICSPDAT I/O Data Input/Output – Schmitt Trigger Input Program/Verify mode P(1) Program Mode Select/Programming Power Supply VDD VDD P Power Supply VSS VSS P Ground RE3/MCLR/VPP Legend: Note 1: I = Input, O = Output, P = Power The programming high voltage is internally generated. To activate the Program/Verify mode, high voltage needs to be applied to MCLR input. Since the MCLR is used for a level source, MCLR does not draw any significant current. DS41442B-page 2 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X 2.0 DEVICE PINOUTS The pin diagrams for the PIC16(L)F151X/152X family are shown in Figure 2-1 through Figure 2-7. The pins that are required for programming are listed in Table 1-1 and shown in bold lettering in the pin diagrams. FIGURE 2-1: 28-PIN SPDIP, SOIC, SSOP DIAGRAM FOR PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516 AND PIC16(L)F1518 SPDIP, SOIC, SSOP 1 28 RB7/ICSPDAT RA0 2 27 RB6/ICSPCLK VPP/MCLR/RE3 3 26 RB5 4 25 RA3 5 24 RB4 RB3 RA4 6 RA5 VSS RA7 7 8 9 PIC16(L)F1512 PIC16(L)F1513 PIC16(L)F1516 PIC16(L)F1518 RA1 RA2 23 RB2 22 21 RB1 20 VDD RB0 19 VSS RC7 RA6 10 RC0 11 18 RC1 12 17 RC6 RC2 13 16 RC5 RC3 14 15 RC4 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 3 PIC16(L)F151X/152X FIGURE 2-2: 28-PIN UQFN DIAGRAM FOR PIC16(L)F1512, PIC16(L)F1513, PIC16(L)F1516 AND PIC16(L)F1518 28 27 26 25 24 23 22 RA1 RA0 RE3/MCLR/VPP RB7/ICSPDAT RB6/ICSPCLK RB5 RB4 UQFN PIC16(L)F1512 PIC16(L)F1513 PIC16(L)F1516 PIC16(L)F1518 8 9 10 11 12 13 14 1 2 3 4 5 6 7 21 20 19 18 17 16 15 RB3 RB2 RB1 RB0 VDD VSS RC7 RC0 RC1 RC2 RC3 RC4 RC5 RC6 RA2 RA3 RA4 RA5 VSS RA7 RA6 DS41442B-page 4 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X FIGURE 2-3: 40-PIN PDIP DIAGRAM FOR PIC16(L)F1517 AND PIC16(L)F1519 PDIP FIGURE 2-4: VPP/MCLR/RE3 1 40 RB7/ICSPDAT/ICDDAT RA0 2 39 RB6/ICSPCLK/ICDCLK RA1 3 38 RB5 RA2 4 37 RB4 36 RA4 6 35 RB2 RA5 7 34 RB1 RE0 8 33 RB0 RE1 9 32 VDD RE2 10 31 VSS VDD 11 30 RD7 29 RD6 PIC16(L)F1519 5 PIC16(L)F1517 RA3 RB3 VSS 12 RA7 13 28 RD5 RA6 14 27 RD4 RC0 15 26 RC7 RC1 16 25 RC6 RC2 17 24 RC5 RC3 18 23 RC4 RD0 19 22 RD3 RD1 20 21 RD2 40-PIN UQFN DIAGRAM FOR PIC16(L)F1517 AND PIC16(L)F1519 40 39 38 37 36 35 34 33 32 31 RC6 RC5 RC4 RD3 RD2 RD1 RD0 RC3 RC2 RC1 UQFN 1 2 3 4 5 6 7 8 9 10 PIC16(L)F1517 PIC16(L)F1519 30 29 28 27 26 25 24 23 22 21 RC0 RA6 RA7 VSS VDD RE2 RE1 RE0 RA5 RA4 RB3 RB4 RB5 ICDCLK/ICSPCLK/RB6 ICDDAT/ICSPDAT/RB7 VPP/MCLR/RE3 RA0 RA1 RA2 RA3 11 12 13 14 15 16 17 18 19 20 RC7 RD4 RD5 RD6 RD7 VSS VDD RB0 RB1 RB2 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 5 PIC16(L)F151X/152X FIGURE 2-5: 44-PIN TQFP DIAGRAM FOR PIC16(L)F1517 AND PIC16(L)F1519 PIC16(L)F1517 PIC16(L)F1519 33 32 31 30 29 28 27 26 25 24 23 12 13 14 15 16 17 18 19 20 21 22 1 2 3 4 5 6 7 8 9 10 11 NC RC0 RA6 RA7 VSS VDD RE2 RE1 RE0 RA5 RA4 NC NC RB4 RB5 ICDCLK/ICSPCLK/RB6 ICDDAT/ICSPDAT/RB7 VPP/MCLR/RE3 RA0 RA1 RA2 RA3 RC7 RD4 RD5 RD6 RD7 VSS VDD RB0 RB1 RB2 RB3 44 43 42 41 40 39 38 37 36 35 34 RC6 RC5 RC4 RD3 RD2 RD1 RD0 RC3 RC2 RC1 NC TQFP DS41442B-page 6 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X FIGURE 2-6: 64-PIN QFN DIAGRAM FOR PIC16(L)F1526 AND PIC16(L)F1527 RD0 VDD VSS RD1 RD2 RD3 RD4 RD5 RD6 RD7 RE2 RE3 RE4 RE5 RE6 RE7 QFN 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RE1 RE0 RG0 RG1 RG2 RG3 VPP/MCLR/RG5 RG4 VSS VDD RF7 RF6 RF5 RF4 RF3 RF2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PIC16(L)F1526 PIC16(L)F1527 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 RB0 RB1 RB2 RB3 RB4 RB5 RB6/ICSPCLK/ICDCLK VSS RA6 RA7 VDD RB7/ICSPDAT/ICDDAT RC5 RC4 RC3 RC2 RF1 RF0 AVDD AVSS RA3 RA2 RA1 RA0 VSS VDD RA5 RA4 RC1 RC0 RC6 RC7 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 FIGURE 2-7: 64-PIN TQFP DIAGRAM FOR PIC16(L)F1526 AND PIC16(L)F1527 RD0 VDD VSS RD1 RD2 RD3 RD4 RD5 RD6 RD7 RE2 RE3 RE4 RE5 RE6 RE7 TQFP 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RE1 RE0 RG0 RG1 RG2 RG3 VPP/MCLR/RG5 RG4 VSS VDD RF7 RF6 RF5 RF4 RF3 RF2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PIC16(L)F1526 PIC16(L)F1527 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 RB0 RB1 RB2 RB3 RB4 RB5 RB6/ICSPCLK/ICDCLK VSS RA6 RA7 VDD RB7/ICSPDAT/ICDDAT RC5 RC4 RC3 RC2 RF1 VRF0 AVDD AVSS RA3 RA2 RA1 RA0 VSS VDD RA5 RA4 RC1 RC0 RC6 RC7 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 7 PIC16(L)F151X/152X 3.0 MEMORY MAP The memory for the PIC16(L)F151X/152X devices is broken into two sections: program memory and configuration memory. Only the size of the program memory changes between devices, the configuration memory remains the same. FIGURE 3-1: PIC16(L)F1512 PROGRAM MEMORY MAPPING 2 KW 0000h Implemented 07FFh Maps to 0-07FFh 8000h User ID Location 8001h User ID Location 8002h User ID Location 8003h User ID Location 8004h Reserved 8005h Reserved 8006h Device ID 8007h Configuration Word 1 8008h Configuration Word 2 8009h Calibration Word 1 800Ah Calibration Word 2 7FFFh 8000h Program Memory Implemented 8200h Maps to 8000-81FFh Configuration Memory FFFFh 800Bh-81FFh DS41442B-page 8 Reserved Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X FIGURE 3-2: PIC16(L)F1513 PROGRAM MEMORY MAPPING 4 KW 0000h Implemented 0FFFh Maps to 0-0FFFh 8000h User ID Location 8001h User ID Location 8002h User ID Location 8003h User ID Location 8004h Reserved 8005h Reserved 8006h Device ID 8007h Configuration Word 1 8008h Configuration Word 2 8009h Calibration Word 1 800Ah Calibration Word 2 7FFFh 8000h Program Memory Implemented 8200h Maps to 8000-81FFh Configuration Memory FFFFh 800Bh-81FFh 2010-2011 Microchip Technology Inc. Reserved Advance Information DS41442B-page 9 PIC16(L)F151X/152X FIGURE 3-3: PIC16(L)F1526, PIC16(L)F1516 AND PIC16(L)F1517 PROGRAM MEMORY MAPPING 8 KW 0000h Implemented 1FFFh Maps to 0-1FFFh 8000h User ID Location 8001h User ID Location 8002h User ID Location 8003h User ID Location 8004h Reserved 8005h Reserved 8006h Device ID 8007h Configuration Word 1 8008h Configuration Word 2 8009h Calibration Word 1 800Ah Calibration Word 2 7FFFh 8000h Program Memory Implemented 8200h Maps to 8000-81FFh Configuration Memory FFFFh 800Bh-81FFh DS41442B-page 10 Reserved Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X FIGURE 3-4: PIC16(L)F1527, PIC16(L)F1518 AND PIC16(L)F1519 PROGRAM MEMORY MAPPING 16KW 0000h Implemented 3FFFh Program Memory 8000h User ID Location 8001h User ID Location 8002h User ID Location 8003h User ID Location 8004h Reserved 8005h Reserved 8006h Device ID 8007h Configuration Word 1 8008h Configuration Word 2 8009h Calibration Word 1 800Ah Calibration Word 2 Maps to 0-3FFFh 7FFFh 8000h Implemented 8200h Maps to 8000-81FFh Configuration Memory FFFFh 800Bh-81FFh 2010-2011 Microchip Technology Inc. Reserved Advance Information DS41442B-page 11 PIC16(L)F151X/152X 3.1 User ID Location MPLAB® IDE only displays the 7 Least Significant bits (LSb) of each user ID location, the upper bits are not read. It is recommended that only the 7 LSbs be used if MPLAB IDE is the primary tool used to read these addresses. Note: A user may store identification information (user ID) in four designated locations. The user ID locations are mapped to 8000h-8003h. Each location is 14 bits in length. Code protection has no effect on these memory locations. Each location may be read with code protection enabled or disabled. 3.2 Device ID The device ID word is located at 8006h. This location is read-only and cannot be erased or modified. REGISTER 3-1: DEVICE ID: DEVICE ID REGISTER(1) R R R R R R DEV<8:3> bit 13 R R bit 8 R R R DEV<2:0> R R R REV<4:0> bit 7 bit 0 Legend: P = Programmable bit U = Unimplemented bit, read as ‘0’ R = Readable bit W = Writable bit ‘0’ = Bit is cleared -n = Value at POR ‘1’ = Bit is set x = Bit is unknown bit 13-5 DEV<8:0>: Device ID bits These bits are used to identify the part number. bit 4-0 REV<4:0>: Revision ID bits These bits are used to identify the revision. Note 1: This location cannot be written. DS41442B-page 12 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X TABLE 3-1: DEVICE ID VALUES DEVICE DEVICE ID VALUES DEV REV PIC16F1527 0001 0101 101 x xxxx PIC16F1526 0001 0101 100 x xxxx PIC16LF1527 0001 0101 111 x xxxx PIC16LF1526 0001 0101 110 x xxxx PIC16F1519 0001 0110 111 x xxxx PIC16F1518 0001 0110 110 x xxxx PIC16F1517 0001 0110 101 x xxxx PIC16F1516 0001 0110 100 x xxxx PIC16F1513 0001 0110 010 x xxxx PIC16F1512 0001 0111 000 x xxxx PIC16LF1519 0001 0111 111 x xxxx PIC16LF1518 0001 0111 110 x xxxx PIC16LF1517 0001 0111 101 x xxxx PIC16LF1516 0001 0111 100 x xxxx PIC16LF1513 0001 0111 010 x xxxx PIC16LF1512 0001 0111 001 x xxxx 3.3 Configuration Words There are two Configuration Words, Configuration Word 1 (8007h) and Configuration Word 2 (8008h). The individual bits within these Configuration Words are used to enable or disable device functions such as the Brown-out Reset, code protection and Power-up Timer. 3.4 Calibration Words The internal calibration values are factory calibrated and stored in Calibration Words 1 and 2 (8009h, 800Ah). The Calibration Words do not participate in erase operations. The device can be erased without affecting the Calibration Words. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 13 PIC16(L)F151X/152X REGISTER 3-2: CONFIGURATION WORD 1 R/P-1 R/P-1 R/P-1 FCMEN IESO CLKOUTEN R/P-1 R/P-1 BOREN<1:0> U-1 — bit 13 R/P-1 R/P-1 R/P-1 CP MCLRE PWRTE bit 8 R/P-1 R/P-1 R/P-1 WDTE<1:0> R/P-1 R/P-1 FOSC<2:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor is enabled 0 = Fail-Safe Clock Monitor is disabled bit 12 IESO: Internal External Switchover bit 1 = Internal/External Switchover mode is enabled 0 = Internal/External Switchover mode is disabled bit 11 CLKOUTEN: Clock Out Enable bit 1 = CLKOUT function is disabled. I/O or oscillator function on CLKOUT pin. 0 = CLKOUT function is enabled on CLKOUT pin bit 10-9 BOREN<1:0>: Brown-out Reset Enable bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the PCON register 00 = BOR disabled bit 8 Unimplemented: Read as ‘1’ bit 7 CP: Code Protection bit(2) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 6 MCLRE: MCLR/VPP Pin Function Select bit If LVP bit = 1: This bit is ignored. If LVP bit = 0: 1 = MCLR/VPP pin function is MCLR; Weak pull-up enabled. 0 = MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUA register. bit 5 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled bit 4-3 WDTE<1:0>: Watchdog Timer Enable bit 11 = WDT enabled 10 = WDT enabled while running and disabled in Sleep 01 = WDT controlled by the SWDTEN bit in the WDTCON register 00 = WDT disabled bit 2-0 FOSC<2:0>: Oscillator Selection bits 111 = ECH: External Clock, High-Power mode: on CLKIN pin 110 = ECM: External Clock, Medium-Power mode: on CLKIN pin 101 = ECL: External Clock, Low-Power mode: on CLKIN pin 100 = INTOSC oscillator: I/O function on OSC1 pin 011 = EXTRC oscillator: RC function on OSC1 pin 010 = HS oscillator: High-speed crystal/resonator on OSC2 pin and OSC1 pin 001 = XT oscillator: Crystal/resonator on OSC2 pin and OSC1 pin 000 = LP oscillator: Low-power crystal on OSC2 pin and OSC1 pin Note 1: 2: Enabling Brown-out Reset does not automatically enable Power-up Timer. The entire program memory will be erased when the code protection is turned off. DS41442B-page 14 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X REGISTER 3-3: CONFIGURATION WORD 2 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 U-1 LVP DEBUG LPBOR BORV STVREN — bit 13 bit 8 U-1 U-1 U-1 R/P-1 U-1 U-1 — — — VCAPEN(2) — — R/P-1 R/P-1 WRT<1:0> bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 LVP: Low-Voltage Programming Enable bit(1) 1 = Low-voltage programming enabled 0 = HV on MCLR/VPP must be used for programming bit 12 DEBUG: In-Circuit Debugger Mode bit 1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins 0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger bit 11 LPBOR: Low-Power BOR 1 = Low-Power BOR is disabled 0 = Low-Power BOR is enabled bit 10 BORV: Brown-out Reset Voltage Selection bit 1 = Brown-out Reset voltage (VBOR), low trip point selected 0 = Brown-out Reset voltage (VBOR), high trip point selected bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit 1 = Stack Overflow or Underflow will cause a Reset 0 = Stack Overflow or Underflow will not cause a Reset bit 8-5 Unimplemented: Read as ‘1’ bit 4 VCAPEN: Voltage Regulator Capacitor Enable bits(1) 0 = VCAP functionality is enabled on VCAP pin 1 = All VCAP pin functions are disabled bit 3-2 Unimplemented: Read as ‘1’ bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits 2 kW Flash memory (PIC16(L)F1512): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to 7FFh may be modified by PMCON control 01 = 000h to FFFh write-protected, 400h to 7FFh may be modified by PMCON control 00 = 000h to 7FFh write-protected, no addresses may be modified by PMCON control 4 kW Flash memory (PIC16(L)F1513): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to FFFh may be modified by PMCON control 01 = 000h to 7FFh write-protected, 800h to FFFh may be modified by PMCON control 00 = 000h to FFFh write-protected, no addresses may be modified by PMCON control 8 kW Flash memory (PIC16F/LF1516/1517/1526): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to 1FFFh may be modified by PMCON control 01 = 000h to FFFh write-protected, 1000h to 1FFFh may be modified by PMCON control 00 = 000h to 1FFFh write-protected, no addresses may be modified by PMCON control 16 kW Flash memory (PIC16F/LF1518/1519/1527): 11 = Write protection off 10 = 000h to 1FFh write-protected, 200h to 3FFFh may be modified by PMCON control 01 = 000h to 1FFFh write-protected, 2000h to 3FFFh may be modified by PMCON control 00 = 000h to 3FFFh write-protected, no addresses may be modified by PMCON control Note 1: 2: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP. Applies to PIC16F151X/152X devices only. On PIC16LF151X/152X, the VCAPEN bit is unimplemented. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 15 PIC16(L)F151X/152X 4.0 PROGRAM/VERIFY MODE In Program/Verify mode, the program memory and the configuration memory can be accessed and programmed in serial fashion. ICSPDAT and ICSPCLK are used for the data and the clock, respectively. All commands and data words are transmitted LSb first. Data changes on the rising edge of the ICSPCLK and latched on the falling edge. In Program/Verify mode both the ICSPDAT and ICSPCLK are Schmitt Trigger inputs. The sequence that enters the device into Program/Verify mode places all other logic into the Reset state. Upon entering Program/Verify mode, all I/Os are automatically configured as high-impedance inputs and the address is cleared. 4.1 High-Voltage Program/Verify Mode Entry and Exit There are two different methods of entering Program/ Verify mode via high-voltage: • VPP – First entry mode • VDD – First entry mode 4.1.1 VPP – FIRST ENTRY MODE To enter Program/Verify mode via the VPP-first method the following sequence must be followed: 1. 2. 3. Hold ICSPCLK and ICSPDAT low. All other pins should be unpowered. Raise the voltage on MCLR from 0V to VIHH. Raise the voltage on VDD FROM 0V to the desired operating voltage. The VPP-first entry prevents the device from executing code prior to entering Program/Verify mode. For example, when Configuration Word 1 has MCLR disabled (MCLRE = 0), the power-up time is disabled (PWRTE = 0), the internal oscillator is selected (FOSC = 100), and ICSPCLK and ICSPDAT pins are driven by the user application, the device will execute code. Since this may prevent entry, VPP-first entry mode is strongly recommended. See the timing diagram in Figure 8-2. 4.1.2 4.1.3 PROGRAM/VERIFY MODE EXIT To exit Program/Verify mode take MCLR to VDD or lower (VIL). See Figures 8-3 and 8-4. 4.2 Low-Voltage Programming (LVP) Mode The Low-Voltage Programming mode allows the PIC16(L)F151X/152X devices to be programmed using VDD only, without high voltage. When the LVP bit of Configuration Word 2 register is set to ‘1’, the lowvoltage ICSP programming entry is enabled. To disable the Low-Voltage ICSP mode, the LVP bit must be programmed to ‘0’. This can only be done while in the High-Voltage Entry mode. Entry into the Low-Voltage ICSP Program/Verify modes requires the following steps: 1. 2. MCLR is brought to VIL. A 32-bit key sequence is presented on ICSPDAT, while clocking ICSPCLK. The key sequence is a specific 32-bit pattern, '0100 1101 0100 0011 0100 1000 0101 0000' (more easily remembered as MCHP in ASCII). The device will enter Program/Verify mode only if the sequence is valid. The Least Significant bit of the Least Significant nibble must be shifted in first. Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be maintained. For low-voltage programming timing, see Figure 8-8 and Figure 8-9. Exiting Program/Verify mode is done by no longer driving MCLR to VIL. See Figure 8-8 and Figure 8-9. Note: To enter LVP mode, the LSB of the Least Significant nibble must be shifted in first. This differs from entering the key sequence on other parts. VDD – FIRST ENTRY MODE To enter Program/Verify mode via the VDD-first method the following sequence must be followed: 1. 2. 3. Hold ICSPCLK and ICSPDAT low. Raise the voltage on VDD from 0V to the desired operating voltage. Raise the voltage on MCLR from VDD or below to VIHH. The VDD-first method is useful when programming the device when VDD is already applied, for it is not necessary to disconnect VDD to enter Program/Verify mode. See the timing diagram in Figure 8-1. DS41442B-page 16 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X 4.3 Program/Verify Commands The PIC16(L)F151X/152X implements 10 programming commands; each six bits in length. The commands are summarized in Table 4-1. Commands that have data associated with them are specified to have a minimum delay of TDLY between the command and the data. After this delay 16 clocks are required to either clock in or clock out the 14-bit data word. The first clock is for the Start bit and the last clock is for the Stop bit. TABLE 4-1: COMMAND MAPPING Mapping Command Data/Note Binary (MSb … LSb) Hex Load Configuration x 0 0 0 0 0 00h 0, data (14), 0 Load Data For Program Memory x 0 0 0 1 0 02h 0, data (14), 0 Read Data From Program Memory x 0 0 1 0 0 04h 0, data (14), 0 Increment Address x 0 0 1 1 0 06h — Reset Address x 1 0 1 1 0 16h — Begin Internally Timed Programming x 0 1 0 0 0 08h — Begin Externally Timed Programming x 1 1 0 0 0 18h — End Externally Timed Programming x 0 1 0 1 0 0Ah — Bulk Erase Program Memory x 0 1 0 0 1 09h Internally Timed Row Erase Program Memory x 1 0 0 0 1 11h Internally Timed 4.3.1 LOAD CONFIGURATION The Load Configuration command is used to access the configuration memory (User ID Locations, Configuration Words, Calibration Words). The Load Configuration command sets the address to 8000h and loads the data latches with one word of data (see Figure 4-1). Note: The only way to get back to the program memory (address 0) is to exit Program/Verify mode or issue the Reset Address command after the configuration memory has been accessed by the Load Configuration command. After issuing the Load Configuration command, use the Increment Address command until the proper address to be programmed is reached. The address is then programmed by issuing either the Begin Internally Timed Programming or Begin Externally Timed Programming command. FIGURE 4-1: Externally timed writes are not supported for Configuration and Calibration bits. Any externally timed write to the Configuration or Calibration Word will have no effect on the targeted word. LOAD CONFIGURATION 1 2 3 4 5 2 1 6 15 16 TDLY ICSPCLK ICSPDAT 0 0 2010-2011 Microchip Technology Inc. 0 0 0 X 0 Advance Information LSb MSb 0 DS41442B-page 17 PIC16(L)F151X/152X 4.3.2 LOAD DATA FOR PROGRAM MEMORY The Load Data for Program Memory command is used to load one 14-bit word into the data latches. The word programs into program memory after the Begin Internally Timed Programming or Begin Externally Timed Programming command is issued (see Figure 4-2). FIGURE 4-2: LOAD DATA FOR PROGRAM MEMORY 1 2 4 3 5 2 1 6 16 15 TDLY ICSPCLK 0 ICSPDAT 4.3.3 1 0 0 0 0 X LSb MSb 0 READ DATA FROM PROGRAM MEMORY The Read Data from Program Memory command will transmit data bits out of the program memory map currently accessed, starting with the second rising edge of the clock input. The ICSPDAT pin will go into Output mode on the first falling clock edge, and it will revert to Input mode (high-impedance) after the 16th falling edge of the clock. If the program memory is code-protected (CP), the data will be read as zeros (see Figure 4-3). FIGURE 4-3: READ DATA FROM PROGRAM MEMORY 1 2 3 4 5 6 1 2 15 16 TDLY ICSPCLK ICSPDAT (from Programmer) 0 0 1 0 0 ICSPDAT (from device) X x Input DS41442B-page 18 Advance Information LSb MSb Output Input 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X 4.3.4 INCREMENT ADDRESS The address is incremented when this command is received. It is not possible to decrement the address. To reset this counter, the user must use the Reset Address command or exit Program/Verify mode and reenter it. If the address is incremented from address 7FFFh, it will wrap-around to location 0000h. If the address is incremented from FFFFh, it will wrap-around to location 8000h. FIGURE 4-4: INCREMENT ADDRESS Next Command 1 2 4 3 2 1 6 5 3 TDLY ICSPCLK 0 ICSPDAT 1 1 0 0 X X Address 4.3.5 X X Address + 1 RESET ADDRESS The Reset Address command will reset the address to 0000h, regardless of the current value. The address is used in program memory or the configuration memory. FIGURE 4-5: RESET ADDRESS Next Command 1 2 4 3 5 6 2 1 3 TDLY ICSPCLK ICSPDAT 0 Address 2010-2011 Microchip Technology Inc. 1 1 0 1 X N Advance Information X X X 0000h DS41442B-page 19 PIC16(L)F151X/152X 4.3.6 BEGIN INTERNALLY TIMED PROGRAMMING A Load Configuration or Load Data for Program Memory command must be given before every Begin Programming command. Programming of the addressed memory will begin after this command is received. An internal timing mechanism executes the write. The user must allow for the program cycle time, TPINT, for the programming to complete. The End Externally Timed Programming command is not needed when the Begin Internally Timed Programming is used to start the programming. The program memory address that is being programmed is not erased prior to being programmed. FIGURE 4-6: BEGIN INTERNALLY TIMED PROGRAMMING 1 2 5 4 3 Next Command 1 2 3 6 TPINT ICSPCLK ICSPDAT 4.3.7 0 0 0 0 1 X X X X BEGIN EXTERNALLY TIMED PROGRAMMING A Load Configuration or Load Data for Program Memory command must be given before every Begin Programming command. Programming of the addressed memory will begin after this command is received. To complete the programming the End Externally Timed Programming command must be sent in the specified time window defined by TPEXT (see Figure 4-7). Externally timed writes are not supported for Configuration and Calibration bits. Any externally timed write to the Configuration or Calibration Word will have no effect on the targeted word. FIGURE 4-7: BEGIN EXTERNALLY TIMED PROGRAMMING End Externally Timed Programming Command 1 2 4 3 5 6 2 1 3 TPEXT ICSPCLK ICSPDAT DS41442B-page 20 0 0 0 1 1 X Advance Information 0 1 0 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X 4.3.8 END EXTERNALLY TIMED PROGRAMMING This command is required after a Begin Externally Timed Programming command is given. This command must be sent within the time window specified by TPEXT after the Begin Externally Timed Programming command is sent. After sending the End Externally Timed Programming command, an additional delay (TDIS) is required before sending the next command. This delay is longer than the delay ordinarily required between other commands (see Figure 4-8). FIGURE 4-8: END EXTERNALLY TIMED PROGRAMMING 1 2 5 4 3 Next Command 2 1 3 6 TDIS ICSPCLK 4.3.9 1 0 ICSPDAT 0 1 1 BULK ERASE PROGRAM MEMORY X X X X After receiving the Bulk Erase Program Memory command the erase will not complete until the time interval, TERAB, has expired. The Bulk Erase Program Memory command performs two different functions dependent on the current state of the address. Note: Address 0000h-7FFFh: Program Memory is erased The code protection Configuration bit (CP) has no effect on the Bulk Erase Program Memory command. Configuration Words are erased Address 8000h-8008h: Program Memory is erased Configuration Words are erased User ID Locations are erased A Bulk Erase Program Memory command should not be issued when the address is greater than 8008h. FIGURE 4-9: BULK ERASE PROGRAM MEMORY 1 2 3 4 5 Next Command 2 1 3 6 TERAB ICSPCLK ICSPDAT 1 2010-2011 Microchip Technology Inc. 0 0 1 0 X Advance Information X X X DS41442B-page 21 PIC16(L)F151X/152X 4.3.10 ROW ERASE PROGRAM MEMORY The Row Erase Program Memory command will erase an individual row. Refer to Table 4-2 for row sizes of specific devices and the PC bits used to address them. If the program memory is code-protected the Row Erase Program Memory command will be ignored. When the address is 8000h-8008h the Row Erase Program Memory command will only erase the user ID locations regardless of the setting of the CP Configuration bit. After receiving the Row Erase Program Memory command the erase will not complete until the time interval, TERAR, has expired. TABLE 4-2: PROGRAMMING ROW SIZE AND LATCHES Devices PIC16(L)F151X/152X FIGURE 4-10: PC Row Size Number of Latches <15:5> 32 32 ROW ERASE PROGRAM MEMORY 1 2 5 4 3 Next Command 2 1 3 6 TERAR ICSPCLK ICSPDAT DS41442B-page 22 1 0 0 0 1 X Advance Information X X X 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X 5.0 PROGRAMMING ALGORITHMS The devices use internal latches to temporarily store the 14-bit words used for programming. Refer to Table 4-2 for specific latch information. The data latches allow the user to write the program words with a single Begin Externally Timed Programming or Begin Internally Timed Programming command. The Load Program Data or the Load Configuration command is used to load a single data latch. The data latch will hold the data until the Begin Externally Timed Programming or Begin Internally Timed Programming command is given. The data latches are aligned with the LSbs of the address. The PC’s address at the time the Begin Externally Timed Programming or Begin Internally Timed Programming command is given will determine which location(s) in memory are written. Writes cannot cross the physical boundary. For example, with the PIC16F1527, attempting to write from address 0002h0009h will result in data being written to 0008h-000Fh. If more than the maximum number of data latches are written without a Begin Externally Timed Programming or Begin Internally Timed Programming command, the data in the data latches will be overwritten. The following figures show the recommended flowcharts for programming. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 23 PIC16(L)F151X/152X FIGURE 5-1: DEVICE PROGRAM/VERIFY FLOWCHART Start Enter Programming Mode Bulk Erase Device Write Program Memory(1) Write User IDs Verify Program Memory Verify User IDs Write Configuration Words(2) Verify Configuration Words Exit Programming Mode Done Note 1: See Figure 5-2. 2: See Figure 5-5. DS41442B-page 24 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X FIGURE 5-2: PROGRAM MEMORY FLOWCHART Start Bulk Erase Program Memory(1, 2) Program Cycle(3) Read Data from Program Memory Data Correct? No Report Programming Failure Yes Increment Address Command No All Locations Done? Yes Done Note 1: This step is optional if device has already been erased or has not been previously programmed. 2: If the device is code-protected or must be completely erased, then Bulk Erase device per Figure 5-6. 3: See Figure 5-3 or Figure 5-4. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 25 PIC16(L)F151X/152X FIGURE 5-3: ONE-WORD PROGRAM CYCLE Program Cycle Load Data for Program Memory Begin Programming Command (Internally timed) Begin Programming Command (Externally timed)(1) Wait TPINT Wait TPEXT End Programming Command Wait TDIS Note 1: Externally timed writes are not supported for Configuration and Calibration bits. DS41442B-page 26 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X FIGURE 5-4: MULTIPLE-WORD PROGRAM CYCLE Program Cycle Load Data for Program Memory Latch 1 Increment Address Command Load Data for Program Memory Latch 2 Increment Address Command Load Data for Program Memory Latch n Begin Programming Command (Internally timed) Begin Programming Command (Externally timed) Wait TPINT Wait TPEXT End Programming Command Wait TDIS 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 27 PIC16(L)F151X/152X FIGURE 5-5: CONFIGURATION MEMORY PROGRAM FLOWCHART Start Load Configuration Bulk Erase Program Memory(1) One-word Program Cycle(2) (User ID) Read Data From Program Memory Command Data Correct? No Report Programming Failure Yes Increment Address Command No Address = 8004h? Yes Increment Address Command Increment Address Command Increment Address Command One-word Program Cycle(2) (Config. Word 1) Read Data From Program Memory Command Data Correct? No Report Programming Failure Yes Increment Address Command One-word Program Cycle(2) (Config. Word 2) Read Data From Program Memory Command Data Correct? No Report Programming Failure Yes Note 1: This step is optional if device is erased or not previously programmed. 2: See Figure 5-3. DS41442B-page 28 Advance Information Done 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X FIGURE 5-6: ERASE FLOWCHART Start Load Configuration Bulk Erase Program Memory Done Note: This sequence does not erase the Calibration Words. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 29 PIC16(L)F151X/152X 6.0 CODE PROTECTION 7.0 Code protection is controlled using the CP bit in Configuration Word 1. When code protection is enabled, all program memory locations (0000h-7FFFh) read as all ‘0’. Further programming is disabled for the program memory (0000h-7FFFh). HEX FILE USAGE The user ID locations and Configuration Words can be programmed and read out regardless of the code protection settings. In the hex file there are two bytes per program word stored in the Intel® INHX32 hex format. Data is stored LSB first, MSB second. Because there are two bytes per word, the addresses in the hex file are 2x the address in program memory. (Example: Configuration Word 1 is stored at 8007h on the PIC16(L)F151X/ 152X. In the hex file this will be referenced as 1000Eh1000Fh). 6.1 7.1 Program Memory Code protection is enabled by programming the CP bit in Configuration Word 1 register to ‘0’. The only way to disable code protection is to use the Bulk Erase Program Memory command. Configuration Word To allow portability of code, it is strongly recommended that the programmer is able to read the Configuration Words and user ID locations from the hex file. If the Configuration Words information was not present in the hex file, a simple warning message may be issued. Similarly, while saving a hex file, Configuration Words and user ID information should be included. 7.2 Device ID and Revision If a device ID is present in the hex file at 1000Ch1000Dh (8006h on the part), the programmer should verify the device ID (excluding the revision) against the value read from the part. On a mismatch condition the programmer should generate a warning message. DS41442B-page 30 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X 7.3 Checksum Computation The checksum is calculated by two different methods dependent on the setting of the CP Configuration bit. TABLE 7-1: CONFIGURATION WORD MASK VALUES Config. Word 1 Mask Config. Word 2 Mask PIC16F1512 3EFFh 3E13h PIC16F1513 3EFFh 3E13h PIC16F1516 3EFFh 3E13h PIC16F1517 3EFFh 3E13h PIC16F1518 3EFFh 3E13h PIC16F1519 3EFFh 3E13h PIC16LF1512 3EFFh 3E03h PIC16LF1513 3EFFh 3E03h PIC16LF1516 3EFFh 3E03h PIC16LF1517 3EFFh 3E03h PIC16LF1518 3EFFh 3E03h PIC16LF1519 3EFFh 3E03h PIC16F1526 3EFFh 3E13h PIC16F1527 3EFFh 3E13h PIC16LF1526 3EFFh 3E03h PIC16LF1527 3EFFh 3E03h Device 7.3.1 PROGRAM CODE PROTECTION DISABLED With the program code protection disabled, the checksum is computed by reading the contents of the PIC16(L)F151X/152X program memory locations and adding up the program memory data starting at address 0000h, up to the maximum user addressable location. Any Carry bit exceeding 16 bits are ignored. Additionally, the relevant bits of the Configuration Words are added to the checksum. All unimplemented Configuration bits are masked to ‘0’. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 31 PIC16(L)F151X/152X EXAMPLE 7-1: PIC16F1527 CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION DISABLED PIC16F1527, BLANK DEVICE Sum of Memory addresses 0000h-3FFFh(1) (2) C000h Configuration Word 1 3FFFh Configuration Word 1 mask(3) 3EFFh (2) Configuration Word 2 3FFFh Configuration Word 2 mask(3) 3E13h Checksum = C000h + (3FFFh and 3EFFh) + (3FFFh and 3E13h) = C000h + 3EFFh + 3E13h = 3D12h Note 1: 2: 3: Sum of memory addresses = (Total number of program memory address locations) x (3FFFh) = C000h, truncated to 16 bits. Configuration Word 1 and 2 = all bits are ‘1’; thus, code-protect is disabled. Configuration Word 1 and 2 Mask = all bits are set to ‘1’, except for unimplemented bits that are ‘0’. EXAMPLE 7-2: PIC16LF1527 CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION DISABLED PIC16LF1527, 00AAh AT FIRST AND LAST ADDRESS Sum of Memory addresses 0000h-3FFFh(1) (2) 4156h Configuration Word 1 3FFFh Configuration Word 1 mask(3) 3EFFh Configuration Word 2(2) 3FFFh Configuration Word 2 mask(4) Checksum 3E03h = 4156h + (3FFFh and 3EFFh) + (3FFFh and 3E03h) = 4156h + 3EFFh + 3E03h = BE58h Note 1: 2: 3: 4: Total number of Program memory address locations: 3FFFh + 1 = 4000h. Then, 4000h - 2 = 3FFEh. Thus, [(3FFEh x 3FFFh) + (2 x 00AAh)] = 4156h, truncated to 16 bits. Configuration Word 1 and 2 = all bits are ‘1’; thus, code-protect is disabled. Configuration Word 1 Mask = all Configuration Word bits are set to ‘1’, except for unimplemented bits that are ‘0’. On the PIC16LF1527 device, the VCAPEN bit is not implemented in Configuration Word 2; Thus, all unimplemented bits are ‘0’. DS41442B-page 32 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X 7.3.2 PROGRAM CODE PROTECTION ENABLED With the program code protection enabled, the checksum is computed in the following manner: The Least Significant nibble of each user ID is used to create a 16-bit value. The masked value of user ID location 8000h is the Most Significant nibble. This sum of user IDs is summed with the Configuration Words (all unimplemented Configuration bits are masked to ‘0’). EXAMPLE 7-3: PIC16F1527 CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION ENABLED PIC16F1527, BLANK DEVICE Configuration Word 1(2) 3F7Fh Configuration Word 1 mask(3) 3EFFh Configuration Word 2(2) 3FFFh Configuration Word 2 mask(3) 3E13h User ID (8000h)(1) 0006h (8001h)(1) 0007h User ID (8002h)(1) 0001h User ID User ID (8003h) (1) Sum of User IDs(4) 0002h = (0006h and 000Fh) << 12 + (0007h and 000Fh) << 8 + (0001h and 000Fh) << 4 + (0002h and 000Fh) = 6000h + 0700h + 0010h + 0002h = 6712h Checksum = (3F7Fh and 3EFFh) + (3FFFh and 3E13h) + Sum of User IDs = 3E7Fh +3713h + 6712h = DCA4h Note 1: 2: 3: 4: User ID values in this example are random values. Configuration Word 1 and 2 = all bits are ‘1’ except the code-protect enable bit. Configuration Word 1 and 2 Mask = all Configuration Word bits are set to ‘1’, except for unimplemented bits which read ‘0’. << = shift left, thus the LSb of the first user ID value is the MSb of the sum of user IDs and so on, until the LSb of the last user ID value becomes the LSb of the sum of user IDs. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 33 PIC16(L)F151X/152X EXAMPLE 7-4: PIC16LF1527 CHECKSUM COMPUTED WITH PROGRAM CODE PROTECTION ENABLED PIC16LF1527, 00AAh AT FIRST AND LAST ADDRESS Configuration Word 1(2) 3F7Fh Configuration Word 1 mask (3) Configuration Word 2(2) 3EFFh 3FFFh Configuration Word 2 mask (3), (5) 3E03h User ID (8000h)(1) 000Eh User ID (8001h)(1) 0008h User ID (8002h)(1) 0005h User ID (8003h) (1) Sum of User IDs(4) 0008h = (000Eh and 000Fh) << 12 + (0008h and 000Fh) << 8 + (0005h and 000Fh) << 4 + (0008h and 000Fh) = E000h + 0800h + 0050h + 0008h = E858h Checksum = (3F7Fh and 3EFFh) + (3FFFh and 3E03h) + Sum of User IDs = 3E7Fh +3E03h + E858h = 64DAh Note 1: 2: 3: 4: 5: User ID values in this example are random values. Configuration Word 1 and 2 = all bits are ‘1’ except the code-protect enable bit. Configuration Word 1 and 2 Mask = all Configuration Word bits are set to ‘1’, except for unimplemented bits which read ‘0’. << = shift left, thus the LSb of the first user ID value is the MSb of the sum of user IDs and so on, until the LSb of the last user ID value becomes the LSb of the sum of user IDs. On the PIC16LF1527 device, the VCAPEN bit is not implemented in Configuration Word 2; thus, all unimplemented bits are ‘0’. DS41442B-page 34 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X 8.0 ELECTRICAL SPECIFICATIONS Refer to device specific data sheet for absolute maximum ratings. TABLE 8-1: AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY MODE Standard Operating Conditions Production tested at 25°C AC/DC CHARACTERISTICS Sym. Characteristics Min. Typ. Max. Units 5.5 V 3.6 V VDDMAX VDDMAX V V VPEW VPBE Supply Voltages and Currents PIC16F151X 2.3 — PIC16F152X Supply Voltage (VDDMIN, VDDMAX) PIC16LF151X 1.8 — PIC16LF152X Read/Write and Row Erase operations VDDMIN — Bulk Erase operations 2.7 — IDDI Current on VDD, Idle — — 1.0 mA IDDP Current on VDD, Programming — — 3.0 mA VDD Conditions/Comments VPP IPP Current on MCLR/VPP — — 600 A VIHH High voltage on MCLR/VPP for Program/Verify mode entry 8.0 — 9.0 V TVHHR MCLR rise time (VIL to VIHH) for Program/Verify mode entry — — 1.0 s 0.8 VDD — — V — VDD-0.7 VDD-0.7 VDD-0.7 — 0.2 VDD V — — V — — VSS+0.6 VSS+0.6 VSS+0.6 V I/O pins VIH VIL (ICSPCLK, ICSPDAT, MCLR/VPP) input high level (ICSPCLK, ICSPDAT, MCLR/VPP) input low level ICSPDAT output high level VOH ICSPDAT output low level VOL Programming Mode Entry and Exit Programing mode entry setup time: ICSPCLK, TENTS 100 — — ICSPDAT setup time before VDD or MCLR Programing mode entry hold time: ICSPCLK, TENTH 250 — — ICSPDAT hold time after VDD or MCLR Serial Program/Verify TCKL Clock Low Pulse Width 100 — — Clock High Pulse Width 100 — — TCKH TDS Data in setup time before clock 100 — — TDH Data in hold time after clock 100 — — Clock to data out valid (during a 0 — 80 TCO Read Data command) Clock to data low-impedance (during a TLZD 0 — 80 Read Data command) Clock to data high-impedance (during a THZD 0 — 80 Read Data command) Data input not driven to next clock input (delay TDLY required between command/data or command/ 1.0 — — command) Bulk Erase cycle time — — 5 TERAB TERAR Row Erase cycle time — — 2.5 Note 1: Externally timed writes are not supported for Configuration and Calibration bits. 2010-2011 Microchip Technology Inc. Advance Information IOH = 3.5 mA, VDD = 5V IOH = 3 mA, VDD = 3.3V IOH = 2 mA, VDD = 1.8V IOH = 8 mA, VDD = 5V IOH = 6 mA, VDD = 3.3V IOH = 3 mA, VDD = 1.8V ns s ns ns ns ns ns ns ns s ms ms DS41442B-page 35 PIC16(L)F151X/152X TABLE 8-1: AC/DC CHARACTERISTICS TIMING REQUIREMENTS FOR PROGRAM/VERIFY Standard Operating Conditions Production tested at 25°C AC/DC CHARACTERISTICS Sym. Characteristics Internally timed programming operation time TPINT TPEXT Min. Typ. Max. Units — — 1.0 — — — 2.5 5 2.1 ms ms ms Externally timed programming pulse Time delay from program to compare 300 — — TDIS (HV discharge time) TEXIT Time delay when exiting Program/Verify mode 1 — — Note 1: Externally timed writes are not supported for Configuration and Calibration bits. 8.1 AC Timing Diagrams FIGURE 8-1: FIGURE 8-3: PROGRAMMING MODE ENTRY – VDD FIRST TENTS Conditions/Comments Program memory Configuration Words Note 1 s s PROGRAMMING MODE EXIT – VPP LAST TEXIT VIHH TENTH VPP VIHH VIL VPP VDD VIL ICSPDAT VDD ICSPCLK ICSPDAT ICSPCLK FIGURE 8-4: PROGRAMMING MODE EXIT – VDD LAST TEXIT FIGURE 8-2: PROGRAMMING MODE ENTRY – VPP FIRST TENTS VIHH VPP VIL VDD TENTH VIHH VPP VIL VDD ICSPDAT ICSPCLK ICSPDAT ICSPCLK DS41442B-page 36 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X FIGURE 8-5: CLOCK AND DATA TIMING TCKL TCKH ICSPCLK TDS TDH ICSPDAT as input TCO ICSPDAT as output TLZD ICSPDAT from input to output THZD ICSPDAT from output to input FIGURE 8-6: WRITE COMMAND-PAYLOAD TIMING TDLY 1 2 3 4 5 X X X X X 1 6 2 15 16 ICSPCLK ICSPDAT 0 LSb X 0 Next Command Payload Command FIGURE 8-7: MSb READ COMMAND-PAYLOAD TIMING TDLY 1 2 3 4 5 X ICSPDAT (from Programmer) X X X X 6 2 1 15 16 ICSPCLK X x ICSPDAT (from Device) Command 2010-2011 Microchip Technology Inc. Advance Information LSb MSb Payload 0 Next Command DS41442B-page 37 PIC16(L)F151X/152X FIGURE 8-8: LVP ENTRY (POWERED) VDD MCLR TENTS TENTH 33 clocks TCKH TCKL ICSPCLK TDH TDS LSb of Pattern 0 ICSPDAT FIGURE 8-9: MSb of Pattern 1 2 ... 31 LVP ENTRY (POWERING UP) VDD MCLR TENTH 33 Clocks TCKH TCKL ICSPCLK TDH TDS LSb of Pattern 0 ICSPDAT Note 1: 1 2 ... MSb of Pattern 31 Sequence matching can start with no edge on MCLR first. DS41442B-page 38 Advance Information 2010-2011 Microchip Technology Inc. PIC16(L)F151X/152X APPENDIX A: REVISION HISTORY Revision A (08/2010) Original release of this document. Revision B (09/2011) Added PIC16(L)F1512/1513 devices; Added new Figures 3-1 and 3-2; Updated Registers 3-1, 3-2 and 33 to new format; Updated Register 3-3 to add 2 kW and 4 kW Flash memory; Added Notes to Examples 7-1 to 7-4; Updated Table 8-1; Other minor corrections. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 39 PIC16(L)F151X/152X NOTES: DS41442B-page 40 Advance Information 2010-2011 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010-2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-61341-635-8 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2010-2011 Microchip Technology Inc. Advance Information DS41442B-page 41 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-330-9305 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS41442B-page 42 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Advance Information 08/02/11 2010-2011 Microchip Technology Inc.