TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3051 Series SP3051 Series 6V 20A Diode Array RoHS Pb GREEN The SP3051 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb 20A of current per IEC61000-4-5 (tP=8/20µs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins. Features • E SD, IEC61000-4-2, ±30kV contact, ±30kV air • EFT, IEC61000-4-4, 40A (5/50ns) • Lightning, IEC61000-4-5, 20A (8/20μs) Pinout GND VCC I/O 2 I/O 3 Applications • • • • Functional Block Diagram 6 5 • • • • LCD/PDP TVs Monitors Notebooks 10/100/1000 Ethernet Firewire Set Top Boxes Flat Panel Displays Portable Medical Unused Application Examples TX + 10/100 Ethernet PHY Unused TX + USB Dual Port Protection 1 RT TX - USB RX + Controller RT 2 5 3 4 CT D+ VCC R GND 75 CT VBUS T D+ D- CT RJ45 Unused TX + RX + USB Port GND 10/100/1000 Ethernet Protection TX - Unused 75 VBUS75 RT GND 10/100/1000 Ethernet PHY USB Port RX RX + D- Unused VCC 3 VBUS SP3051-04HTG CT 75 2 TX - VBUS 6 SP3051-04HTG VBUS RX - 1 RJ45 10/100 Ethernet Differential Protection 4 To Twisted-Pair Network I/O 4 Unused TX + TX - 1 6 2 5 3 4 RX + RX - SP3051-04HTG Unused To Twisted-Pair Network I/O 1 • L ow capacitance of 3.8pF (TYP) per I/O • Low leakage current of 0.5μA (MAX) at 5V • Small SOT23-6 (JEDEC MO-178AB) packaging Unused 75 75 75 75 RX VCC VCC Life Support Note: Not Intended for Use in Life Support or Life Saving Applications GND The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 1 Revision: May 1, 2013 SP3051 Series SP3051 Description TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3051 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Units IPP Peak Current (tp=8/20μs) 20 A PPK Peak Pulse Power (tp=8/20μs) 400 W TOP Operating Temperature -40 to125 °C TSTOR Storage Temperature -55 to 150 °C 1 Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Symbol Test Conditions VRWM IR ≤ 1µA VR IR = 1mA ILEAK VR=5V Breakdown Voltage Reverse Leakage Current Min Typ Clamp Voltage VC RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-GND Diode Capacitance1 CI/O-I/O V V 0.1 0.5 µA 2 9.0 10.5 V IPP=10A, tp=8/20µs, I/O to GND 11.5 15.0 V IPP=20A, tp=8/20µs, I/O to GND 14.3 17.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.3 2 2 Dynamic Resistance Units 6.0 8.0 IPP=1A, tp=8/20µs, I/O to GND 1 Max Ω IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV Reverse Bias=0V 3.8 4.2 pF Vcc=5V, Reverse Bias=2.5V 1.7 2.0 pF Reverse Bias=0V 2.0 pF Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform shown on page 3. Capacitance vs. Reverse Voltage Clamping Voltage vs. Peak Pulse Current 5.0 15.0 Clamp Voltage (VC) Capacitance (pF) 4.0 Vcc=0V 3.0 Vcc=5V Vcc=3.3V 2.0 1.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 0.0 5.0 1 Bias Voltage (V) SP3051 Series 10.0 5 10 15 20 Peak Pulse Current -IPP (A) 2 Revision: May 1, 2013 ©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3051 Series Product Characteristics 110% 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 20% Notes : 10% 1. All dimensions are in millimeters SP3051 Pulse Waveform 2. Dimensions include solder plating. 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 3. Dimensions are exclusive of mold flash & metal burr. Time (μs) 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. 6. All specifications comply to JEDEC Spec MO-178AB Issue C Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Y* 4 Y*4 G= Green Product Series ©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Number of Channels Assembly Site (Varies) T= Tape & Reel Number of Channels Time Part Marking System SP 3051 – 04 H T G Series Critical Zone TL to TP Ramp-up TL TS(max) 25 Part Numbering System TVS Diode Arrays (SPA® Diodes) tP TP Temperature Reflow Condition Package H: SOT23-6 Ordering Information Part Number Package Marking Min. Order Qty. SP3051-04HTG SOT23-6 YH4 3000 3 Revision: May 1, 2013 SP3051 Series TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SP3051 Series Package Dimensions — SOT23-6 Package SOT23 Pins 6 JEDEC MO-178AB Millimeters Min Max Inches Min Max Notes A 0.900 1.450 0.035 0.057 - A1 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref e1 1.9 Ref 0.0748 Ref L 0.30 0.012 8º 0º 6 N Recommended Solder Pad Layout 0.600 a - 0.023 6 0º 4,5 6 8º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - M Notes: 1. Dimensioning and tolerancing Per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Foot length L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. P R O Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 14.4mm ACCESS HOLE 13mm 180mm 4.0mm 1.5mm DIA. HOLE 2.0mm 1.75mm CL 8mm 4.0mm 60mm GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. SOT-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED SP3051 Series COVER TAPE 4 Revision: May 1, 2013 PIN 1 ©2013 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information.