SUM60N04-12LT Datasheet

SUM60N04-12LT
Vishay Siliconix
Temperature Sensing MOSFET, N-Channel 40-V (D-S)
FEATURES
PRODUCT SUMMARY
V(BR)DSS (V)
40
rDS(on) (Ω)
ID (A)
0.009 at VGS = 10 V
60a
0.012 at VGS = 4.5 V
60
Notes:
a. Package Limited.
DESCRIPTION
The SUM60N04-12LT is a 40 V N-Channel, 15 mΩ logic
level MOSFET in a 5-lead D2PAK package built on the
Vishay Siliconix proprietary high-cell density TrenchFET
technology.
Two anti-parallel electrically isolated poly-silicon diodes are
used to sense the temperature changes in the MOSFET.
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Temperature-Sense Diodes for Thermal Shutdown
Available
TrenchFET® Power MOSFET
RoHS*
175 °C Maximum Junction Temperature
COMPLIANT
ESD Protected: 2000 V
Logic-Level Low On-Resistance
Avalanche Rated
Low Gate Charge
Fast Turn-On Time
100 % Rg Tested
5 Lead D2PAK
APPLICATIONS
• Industrial
The gate of the MOSFET is protected from high voltage
transients by two back-to-back poly-silicon zener diodes.
FUNCTIONAL BLOCK DIAGRAM AND PIN CONFIGURATION
D2Pak
TO-263, 5 Leads
D
T1
1 2 3 4 5
D1
G
D2
T2
G T1 D T2 S
S
Ordering Information: SUM60N04-12LT
SUM60N04-12LT-E3 (Lead (Pb)-free)
N-Channel MOSFET
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 71620
S-80272-Rev. C, 11-Feb-08
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SUM60N04-12LT
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
40
Gate-Source Voltage
VGS
± 20
IG
50
VGS Clamp Current
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 100 °C
Avalanche Current
ID
60
50
125
VSA
100
Source-to-Cathode Voltage
VSC
100
Maximum Power Dissipationa
Operating Junction and Storage Temperature Range
TC = 25 °C
d
TA = 25 °C
PD
mA
A
50
IAR
EAR
L = 0.1 mH
V
a
Source-to-Anode Voltage
Repetitive Avalanche Energy
Unit
mJ
V
110
3.75
W
TJ, Tstg
- 55 to 175
°C
Unit
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Limit
Junction-to-Ambientd
RthJA
40
Junction-to-Case
RthJC
1.35
°C/W
Notes:
a. Package limited.
b. Duty Cycle ≤ 1 %.
c. See SOA curve for voltage derating.
d. When Mounted on 1" square PCB FR4.
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Document Number: 71620
S-80272-Rev. C, 11-Feb-08
SUM60N04-12LT
Vishay Siliconix
MOSFET SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
V(BR)DSS
VGS = 0 V, ID = 1 mA
40
Typ.
Max.
Unit
V
Static
Drain-Source Breakdown Voltage
VGS Clamp Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
VGS
VDS = 0 V, IG = 20 µA
10
20
VGS(th)
VDS = VGS, IDS = 1 mA
1
2
IGSS
VDS = 0 V, VGS = ± 5 V
± 250
VDS = 40 V, VGS = 0 V
1
VDS = 40 V, VGS = 0 V, TJ = 125 °C
50
IDSS
VDS = 40 V, VGS = 0 V, TJ = 175 °C
rDS(on)
0.0075
0.0135
VGS = 10 V, ID = 20 A, TJ = 175 °C
0.018
VGS = 4.5 V, ID = 20 A
Sense Diode Forward Voltage
0.009
VGS = 10 V, ID = 20 A, TJ = 125 °C
VFD1
µA
250
VGS = 10 V, ID = 20 A
Drain-Source On-State Resistancea
nA
0.0095
Ω
0.012
IF = 250 µA
675
735
VFD2
IF = 250 µA
675
735
Sense Diode Forward Voltage Increase
ΔVF
From IF = 125 µA to IF = 250 µA
25
50
Forward Transconductancea
gfs
VDS = 15 V, ID = 20 A
35
mV
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Charge
c
Gate-Drain Chargec
51
VDS = 20 V, VGS = 10 V, ID = 25 A
Fall Timec
td(off)
70
nC
5.5
12
1.2
td(on)
tr
c
pF
560
210
Rg
c
Rise Timec
Turn-Off Delay Time
VGS = 0 V, VDS = 25 V, f = 1 MHz
Qgd
Gate Resistance
Turn-On Delay Time
Qgs
1920
VDD = 20 V, RL = 0.8 Ω
ID ≅ 25 A, VGEN = 10 V, Rg = 2.5 Ω
tf
Source-Drain Diode Ratings and Characteristics TC = 25
4.1
20
40
70
120
35
70
20
40
IS
60
ISM
240
Forward Voltagea
VSD
IF = 60 A, VGS = 0 V
trr
IF = 60 A, di/dt = 100 A/µs
Reverse Recovery Time
ns
°Cb
Pulsed Current
Continuous Current
Ω
40
A
1.4
V
60
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 71620
S-80272-Rev. C, 11-Feb-08
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SUM60N04-12LT
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
250
200
VGS = 10 thru 7 V
TC = - 55 °C
6V
160
I D - Drain Current (A)
I D - Drain Current (A)
200
5V
150
100
4V
50
125 °C
120
80
40
1, 2 V
3V
0
0
0
2
4
6
8
10
0
1
2
3
5
6
7
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
8
0.018
TC = - 55 °C
r DS(on) - On-Resistance (Ω)
0.015
60
25 °C
125 °C
40
20
0.012
VGS = 4.5 V
VGS = 10 V
0.009
0.006
0.003
0.000
0
0
20
40
60
80
0
100
20
40
ID - Drain Current (A)
60
80
100
120
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
3000
15
V GS - Gate-to-Source Voltage (V)
2500
Ciss
C - Capacitance (pF)
4
VDS - Drain-to-Source Voltage (V)
80
g fs - Transconductance (S)
25 °C
2000
1500
1000
Coss
Crss
500
VGS = 20 V
ID = 25 A
12
9
6
3
0
0
0
8
16
24
32
VDS - Drain-to-Source Voltage (V)
Capacitance
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4
40
0
15
30
45
60
75
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 71620
S-80272-Rev. C, 11-Feb-08
SUM60N04-12LT
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2.0
100
VGS = 10 V
ID = 20 A
TJ = 150 °C
I S - Source Current (A)
r DS(on) - On-Resistance
(Normalized)
1.6
1.2
0.8
TJ = 25 °C
10
0.4
0.0
- 50
1
- 25
0
25
50
75
100
125
150
175
0
0.3
TJ - Junction Temperature (°C)
0.9
1.2
1.4
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Junction Temperature
300
60
ID = 1 mA
100
V(BR)DSS (V)
IAV (A) at TJ = 25 °C
I Dav (A)
0.6
10
IAV (A) at TJ = 150 °C
50
40
1
30
- 50
0.1
0.00001
0.0001
0.01
0.001
tin (s)
0.1
1
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Drain-Source Breakdown vs.
Junction Temperature
Avalanche Current vs. Time
1.0
2000
0.8
1600
IF (µA) at 25 °C
1200
0.6
I F (µ A)
V F (V)
VF (V) at IF = 250 µA
VF (V) at IF = 125 µA
0.4
800
0.2
400
0.0
- 50
- 25
0
25
50
75
100
125
150
175
0
0.0
0.2
0.4
0.6
0.8
TJ - Junction Temperature (°C)
VF (V)
Sense Diode Forward Voltage vs. Temperature
Sense Diode Forward Voltage
Document Number: 71620
S-80272-Rev. C, 11-Feb-08
1.0
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SUM60N04-12LT
Vishay Siliconix
TYPICAL CHARACTERISTICS OF G-S CLAMPING DIODES 25 °C, unless otherwise noted
10
1
10-1
IG (mA) at 150 °C
I G (mA)
10-2
10-3
IG (mA) at 25 °C
10-4
10-5
10-6
10-7
0
4
8
12
20
16
VGS (V)
Gate-Source Voltage vs. Gate Current
THERMAL RATINGS
500
75
10 µs
I D - Drain Current (A)
I D - Drain Current (A)
60
45
30
100
Limited
by rDS(on)*
100 µs
10
1 ms
TC = 25 °C
Single Pulse
15
1
0.1
0
0
25
50
75
100
125
150
175
TC - Case Temperature (°C)
1
* VGS
Maximum Avalanche and Drain Current
vs. Case Temperature
10 ms
100 ms
DC
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -5
10 -4
10 -3
10-2
10 -1
1
3
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
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Document Number: 71620
S-80272-Rev. C, 11-Feb-08
SUM60N04-12LT
Vishay Siliconix
APPLICATIONS
+5V
R1
180 kΩ
1%
C3
0.1 µF
R5, 18 kΩ
IC1, LMV321
C1
560 pF
R7
10 kΩ
1%
R6, 560 Ω
-
Gate
Output
Signal
+
R4, 560 kΩ, 1 %
R3, 18 kΩ
INPUT
R2
22 kΩ
1%
SUM60N04-12LT
C2
0.1 µF
Signal Ground
Power Ground
Figure 1.
The SUM60N04-12LT provides a non-committed diode to
allow temperature sensing of the actual MOSFET chip. The
addition of one simple comparator and a few other
components is all that is required to implement a
temperature protected MOSFET. Since it has a very tight
tolerance on forward voltage, the forward voltage of the
diode can be used to provide to shutdown signal. The diode
forward voltage falls to around 0.4 V with a bias current of
250 µA when the MOSFET chip is close to the maximum
permitted temperature value. The external comparator used
to detect over temperature can also be used as a driver stage
for the MOSFET, meaning that the on/off input is logic
compatible, and can be driven from a logic gate.
A typical circuit is shown in Figure 1. Here a LMV321
operational amplifier is used to drive the MOSFET, and as a
comparator to when the maximum junction temperature is
reached. The circuit will turn on once more when the chip has
cooled to approximately 110 °C, and can cycle on and off
until the fault is cleared or the power is removed. This circuit
has assumed a 5 V rail is available, but the circuit could
easily be adapted for a 12 V rail, for example.
The LMV321 op amp was selected to give reasonable output
current to drive the MOSFET at a reasonable price. The
SC-70 package means that the protection circuit uses very
little board space. However the limited output current means
that it can only be used in slow switching applications, where
one microsecond switching time and limited dv/dt immunity
can be accepted. For PWM and other faster applications, a
buffer should be added to drive the MOSFET, or the
schematic in Figure 2 used to give fast switching speed.
Document Number: 71620
S-80272-Rev. C, 11-Feb-08
The reference voltage for the trip point is derived from the 5 V
rail, which should have reasonable voltage accuracy and
stability (± 0.5 V). A voltage reference could be added if
required, but the circuit is only intended to make the
MOSFET invulnerable to drastic faults that might otherwise
cause it to fail, not to give a precise shutdown point. 1 %
resistors are used to provide a reference voltage of 0.545 V,
giving a nominal rising trip point of around 155 °C, allowing
for the hysteresis drop over R7.
A 560 pF capacitor across the inputs of the comparator
provides some noise immunity and gives a response time of
around a micro second, just faster than the switching speed
of the MOSFET in this circuit (faster response has
diminishing returns as the turn-off time is fixed). This does
have a side effect of introducing such a delay at turn-on. If
this is an issue (although if this delay is an issue, the
switching time should be reviewed also), a separate driver
could be added using a comparator for over temperature
detection only as shown in Figure 2. The diode is then left
biased whenever the power is applied to the load and there
is no turn-on delay. In a very noisy environment C1 should be
increased and additional capacitors may also be required
from each input of the comparator to ground and on the logic
input.
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SUM60N04-12LT
Vishay Siliconix
would also allow a lower sourcing capability in the logic
circuit providing the on/off signal and therefore should be
used if input current requirements become a problem.
The bias current of 250 µA nominal is derived from the input
signal. In this manner, a simple comparator can be used as
a driver for normal on/off operation and a fault detector
circuit. The circuit used to provide the input signal must
therefore be able to source 0.25 mA with no significant
voltage drop.
With the input high, bias current flows and as long as the
forward voltage of the diode is higher than 0.465 V, the
comparator output is high and the MOSFET is on. If the
forward voltage of the diode drops below 0.465 V, the
comparator output goes low and the MOSFET is turned off.
The gate drive voltage can also be used as an output signal
(if required) for logic to interpret and to signify that there is a
fault. Note the cathode of the sensing diode should NOT be
connected directly to the source of the MOSFET as the noise
introduced by high currents in the source loop could affect
operation of the sensing circuit. A separate signal ground
should be used and connect to power ground at one point
only.
The LMV321 can provide a output current of 60 mA typical,
which provides reasonable switching time for non-PWM
applications. A 560 Ω resistor is added in series to protect the
op amp and to prevent instability, but will result in switching
times of several micro seconds. A lower value may be
possible depending on layout, but may violate conditions
recommended by the op amp manufacturer.
Hysteresis is added by means of a resistor network around
the comparator. Approximately 40 °C hysteresis is added
using the components shown. This hysteresis could be
reduced if necessary by increasing the value of R4. Another
means of implementing hysteresis is to use the output of the
comparator to provide some of the bias current for the
sensing diode. When the comparator output is low (tripped/
off), the bias current is reduced by, say, 150 µA, causing the
forward voltage to drop by around 50 mV. This concept
A variation on this schematic is shown in Figure 2. Here a low
cost comparator (again in a SOT-23 or SC-70) is used to
provide a fault output signal only. The diode bias current is
taken from the 5 V. In this manner the diode bias is applied
at all times, so the noise filtering capacitor, C1 will not
introduce a turn-on delay. The fault output signal could be
used to enable the gate driver as shown, or fed to larger
monitoring circuit to shutdown the MOSFET.
+5V
C2
0.1 µF
R1
180 kΩ
1%
C3
0.1 µF
R5
10 kΩ
DRIVER
IN
IC1, LMV331
R6
10 kΩ
1%
ENABLE
-
+
R4, 560 kΩ, 1 %
R3, 18 kΩ
R2
22 kΩ
1%
SUB60N04-15LT
C1
560 pF
Signal Ground
Power Ground
Figure 2.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?71620.
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Document Number: 71620
S-80272-Rev. C, 11-Feb-08
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Revision: 02-Oct-12
1
Document Number: 91000