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Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
Item
Al2O3
Iron
Nickel
Chromium
SiO2
Co,Ag,Cu,MgO,CaO
Tungsten
Gold
Subtotal
Item
Aluminum
Item
Si
Item
Tin
Lead
Subtotal
Item
Silver Filler
Cyanate ester resin
Subtotal
Sidebraze
300 mils
14
SnPb
Combolid
% of Combolid
92
4
4
Weight (g)
1.63E-01
7.08E-03
7.08E-03
1.77E-01
PPM
125791
5469
5469
136730
Weight (g)
1.19 E-02
3.06 E-03
1.50 E-02
PPM
9221
2366
11587
0.015
Weight (g)
8.19 E-01
6.71 E-02
5.17 E-02
3.52 E-02
3.21 E-02
3.06 E-02
2.66 E-02
1.70 E-03
1.06 E+00
PPM
632880
51863
39945
27206
24822
23671
20548
1315
822251
1.064
Bond Wires
% of Wire
100
Weight (g)
1.20 E-03
PPM
Chip 1
% of Chip
100
Weight (g)
6.70 E-03
PPM
5176
0.0067
Weight (g)
1.83 E-02
1.07 E-02
2.90 E-02
PPM
14113
8289
22402
0.029
Weight (g)
9.60 E-04
2.40 E-04
1.20 E-03
PPM
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
% of Ceramic
77.0
6.3
4.9
3.3
3.0
2.9
2.5
0.2
Solder
% of Solder
63
37
Die Attach Paste
% of Die Attach Paste
80
20
0.177
0.0012
927
0.0012
742
185
927
Package Totals
Weight (g)
1.29E+00
PPM
1000000
1.2941
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
Item
Sidebraze
300 mils
14
Pb-free
Combolid
% of Combolid
92
4
4
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
% of Ceramic
Weight (g)
1.63E-01
7.08E-03
7.08E-03
1.77E-01
PPM
117396
5104
5104
127604
Weight (g)
1.19 E-02
3.06 E-03
1.50 E-02
PPM
8606
2208
10814
Weight (g)
PPM
Ceramic
Al2O3
Cr2O3
SiO2
TiO2
Cao
MgO
Subtotal
90.5
3.9
3.5
1.0
0.6
0.5
7.57 E-01
3.26 E-02
2.93 E-02
8.36 E-03
5.02 E-03
4.18 E-03
8.36 E-01
545440
23505
21094
6027
3616
3013
602696
Metallization
Tungsten
Molybdenum
Subtotal
96.61
3.39
4.83 E-02
1.70 E-03
5.00 E-02
34824
1222
36046
Lead
Iron
Nickel
Manganese
Cobalt
Subtotal
58
40.7
0.8
0.5
1.51 E-01
1.06 E-01
2.08 E-03
1.30 E-03
2.60 E-01
108716
76289
1500
937
187441
85
15
8.50 E-03
1.50 E-03
1.00 E-02
6128
1081
7209
93.89
5.36
0.7
0.05
9.39 E-03
5.36 E-04
7.00 E-05
5.00 E-06
1.00 E-02
6769
386
50
4
7209
92
8
9.20 E-03
8.00 E-04
1.00 E-02
6633
577
7209
Weight (g)
1.00 E-02
PPM
7209
Ag-Au ( base metal)
Silver
Copper
Subtotal
Nickel Plating ( 1st coating)
Nickel
Palladium
Boron
Lead
Subtotal
Nickel Plating ( 2nd layer)
Nickel
Cobalt
Subtotal
Item
Gold
External Leadframe Plating
% of External Plating
100
Item
Bond Wires
% of Wire
100
Weight (g)
1.20 E-03
PPM
865
Item
Chip 1
% of Chip
100
Weight (g)
6.70 E-03
PPM
4830
Weight (g)
9.60 E-04
2.40 E-04
1.20 E-03
PPM
692
173
865
Aluminum
Si
Item
Silver Filler
Cyanate ester resin
Die Attach Paste
% of Die Attach Paste
80
20
Package Totals
Weight (g)
1.39E+00
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary