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Materials Declaration
Package
Body Size
Lead Count
Option
LCC
28
Pb free- (Au)
Combolid
Item
% of Combolid
Weight (g)
PPM
Kovar
92
3.96E-01
347602
Nickel
4
1.72E-02
15113
Gold
4
1.72E-02
15113
4.30E-01
377829
Subtotal
Lid Frame
% of Lid Frame
Weight (g)
Gold
79.58
1.59E-02
13985
Sn
20.42
8.78E-02
77153
1.04E-01
91138
Item
Subtotal
PPM
Ceramic Package
Item
% of Ceramic
Weight (g)
90.5
PPM
Ceramics
4.73E-01
415173
SiO2
3.5
1.83E-02
16056
CaO
0.6
3.13E-03
2753
MgO
0.5
2.61E-03
Al2O3
TiO2
Cr2O3
2294
1
5.22E-03
4588
3.9
2.04E-02
17891
5.22E-01
458754
100
2.93E-02
25745
92
3.93E-03
3451
8
6.93E-04
609
4.62E-03
4059
7328
Subtotal
Pattern
Tungsten
Nickel Plating
Nickel
Cobalt
Subtotal
Au Coating
Gold
99.9975
8.34E-03
Thallium
0.0025
2.09E-07
0
8.34E-03
7328
5.64E-01
495887
Subtotal
Total
Bond Wires
Item
Aluminum
% of Wire
Weight (g)
100
1.00E-03
PPM
879
Chip
Item
Si
% of Chip
Weight (g)
100
1.90E-02
PPM
16695
Die Attach Paste
Item
% of Die Attach Paste
Weight (g)
PPM
14059
Silver Filler
80
1.60E-02
Cyanate ester resin
20
4.00E-03
3515
2.00 E-02
17573
Subtotal
Package Totals
Weight (g)
1.14 E+00
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
Lead Count
Option
LCC
28
SnPb
Combolid
Item
% of Combolid
Weight (g)
PPM
Kovar
92
3.96E-01
322774
Nickel
4
1.72E-02
14034
Gold
4
1.72E-02
14034
4.30E-01
350842
Subtotal
Lid Frame
% of Lid Frame
Weight (g)
Gold
79.58
1.59E-02
12986
Sn
20.42
8.78E-02
71642
1.04E-01
84628
Item
Subtotal
PPM
Ceramic Package
Item
% of Ceramic
Weight (g)
90.5
PPM
Ceramics
4.73E-01
385518
SiO2
3.5
1.83E-02
14910
CaO
0.6
3.13E-03
2556
MgO
0.5
2.61E-03
Al2O3
TiO2
Cr2O3
2130
1
5.22E-03
4260
3.9
2.04E-02
16614
5.22E-01
425987
100
2.68E-02
21900
92
4.25E-03
3468
8
3.70E-04
302
4.62E-03
3770
6805
Subtotal
Pattern
Tungsten
Nickel Plating
Nickel
Cobalt
Subtotal
Au Coating
Gold
99.9975
8.34E-03
Thallium
0.0025
2.09E-07
0
8.34E-03
6805
5.62E-01
458462
Subtotal
Total
Bond Wires
Item
Aluminum
% of Wire
Weight (g)
100
1.00E-03
PPM
816
Chip
Item
Si
% of Chip
Weight (g)
100
1.90E-02
PPM
15502
Die Attach Paste
Item
% of Die Attach Paste
Weight (g)
PPM
13055
Silver Filler
80
1.60E-02
Cyanate ester resin
20
4.00E-03
3264
2.00E-02
16318
Subtotal
External Leadframe Plating
Item
% of Plating
Weight (g)
Tin
63
5.67E-02
46262
Lead
37
3.33E-02
27170
9.00E-02
73432
Subtotal
PPM
Package Totals
Weight (g)
PPM
1.23E+00
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary