Materials Declaration Package Body Size Lead Count Option LCC 28 Pb free- (Au) Combolid Item % of Combolid Weight (g) PPM Kovar 92 3.96E-01 347602 Nickel 4 1.72E-02 15113 Gold 4 1.72E-02 15113 4.30E-01 377829 Subtotal Lid Frame % of Lid Frame Weight (g) Gold 79.58 1.59E-02 13985 Sn 20.42 8.78E-02 77153 1.04E-01 91138 Item Subtotal PPM Ceramic Package Item % of Ceramic Weight (g) 90.5 PPM Ceramics 4.73E-01 415173 SiO2 3.5 1.83E-02 16056 CaO 0.6 3.13E-03 2753 MgO 0.5 2.61E-03 Al2O3 TiO2 Cr2O3 2294 1 5.22E-03 4588 3.9 2.04E-02 17891 5.22E-01 458754 100 2.93E-02 25745 92 3.93E-03 3451 8 6.93E-04 609 4.62E-03 4059 7328 Subtotal Pattern Tungsten Nickel Plating Nickel Cobalt Subtotal Au Coating Gold 99.9975 8.34E-03 Thallium 0.0025 2.09E-07 0 8.34E-03 7328 5.64E-01 495887 Subtotal Total Bond Wires Item Aluminum % of Wire Weight (g) 100 1.00E-03 PPM 879 Chip Item Si % of Chip Weight (g) 100 1.90E-02 PPM 16695 Die Attach Paste Item % of Die Attach Paste Weight (g) PPM 14059 Silver Filler 80 1.60E-02 Cyanate ester resin 20 4.00E-03 3515 2.00 E-02 17573 Subtotal Package Totals Weight (g) 1.14 E+00 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size Lead Count Option LCC 28 SnPb Combolid Item % of Combolid Weight (g) PPM Kovar 92 3.96E-01 322774 Nickel 4 1.72E-02 14034 Gold 4 1.72E-02 14034 4.30E-01 350842 Subtotal Lid Frame % of Lid Frame Weight (g) Gold 79.58 1.59E-02 12986 Sn 20.42 8.78E-02 71642 1.04E-01 84628 Item Subtotal PPM Ceramic Package Item % of Ceramic Weight (g) 90.5 PPM Ceramics 4.73E-01 385518 SiO2 3.5 1.83E-02 14910 CaO 0.6 3.13E-03 2556 MgO 0.5 2.61E-03 Al2O3 TiO2 Cr2O3 2130 1 5.22E-03 4260 3.9 2.04E-02 16614 5.22E-01 425987 100 2.68E-02 21900 92 4.25E-03 3468 8 3.70E-04 302 4.62E-03 3770 6805 Subtotal Pattern Tungsten Nickel Plating Nickel Cobalt Subtotal Au Coating Gold 99.9975 8.34E-03 Thallium 0.0025 2.09E-07 0 8.34E-03 6805 5.62E-01 458462 Subtotal Total Bond Wires Item Aluminum % of Wire Weight (g) 100 1.00E-03 PPM 816 Chip Item Si % of Chip Weight (g) 100 1.90E-02 PPM 15502 Die Attach Paste Item % of Die Attach Paste Weight (g) PPM 13055 Silver Filler 80 1.60E-02 Cyanate ester resin 20 4.00E-03 3264 2.00E-02 16318 Subtotal External Leadframe Plating Item % of Plating Weight (g) Tin 63 5.67E-02 46262 Lead 37 3.33E-02 27170 9.00E-02 73432 Subtotal PPM Package Totals Weight (g) PPM 1.23E+00 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary