Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal Item Sidebraze 300 mils 20 Au Combolid % of Combolid 92 4 4 Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package % of Ceramic Weight (g) 2.76E-01 1.20E-02 1.20E-02 3.00E-01 PPM 169211 7357 7357 183925 Weight (g) 2.55 E-02 6.53 E-03 3.20 E-02 PPM 15613 4006 19619 Weight (g) PPM Ceramic Al2O3 Cr2O3 SiO2 TiO2 Cao MgO Subtotal 90.5 3.9 3.5 1.0 0.6 0.5 8.51 E-01 3.67 E-02 3.29 E-02 9.40 E-03 5.64 E-03 4.70 E-03 9.40 E-01 521550 22476 20170 5763 3458 2881 576298 Metallization Tungsten Molybdenum Subtotal 96.61 3.39 4.83 E-02 1.70 E-03 5.00 E-02 29615 1039 30654 Lead Iron Nickel Manganese Cobalt Subtotal 58 40.7 0.8 0.5 1.51 E-01 1.06 E-01 2.08 E-03 1.30 E-03 2.60 E-01 92453 64876 1275 797 159402 85 15 8.50 E-03 1.50 E-03 1.00 E-02 5211 920 6131 93.89 5.36 0.7 0.05 9.39 E-03 5.36 E-04 7.00 E-05 5.00 E-06 1.00 E-02 5756 329 43 3 6131 92 8 9.20 E-03 8.00 E-04 1.00 E-02 5640 490 6131 Ag-Cu ( base metal) Silver Copper Subtotal Nickel Plating ( 1st coating) Nickel Palladium Boron Lead Subtotal Nickel Plating ( 2nd layer) Nickel Cobalt Subtotal Item Gold External Leadframe Plating % of External Plating 100 Weight (g) 1.00 E-02 PPM 6131 Item Bond Wires % of Wire 100 Weight (g) 1.20 E-03 PPM Item Chip 1 % of Chip 100 Weight (g) 6.70 E-03 PPM 4108 Weight (g) 9.60 E-04 2.40 E-04 1.20 E-03 PPM Aluminum Si Item Silver Filler Cyanate ester resin Die Attach Paste % of Die Attach Paste 80 20 736 589 147 736 Package Totals Weight (g) 1.63E+00 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal Item Al2O3 Iron Nickel Cr2O3 SiO2 Co,Ag,Cu,MgO,CaO Tungsten Gold Subtotal Sidebraze 300 mils 20 SnPb Combolid % of Combolid 92 4 4 Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package % of Ceramic 77.0 6.3 4.9 3.3 3.0 2.9 2.5 0.2 Weight (g) 1.43E-01 6.20E-03 6.20E-03 1.55E-01 PPM 74116 3222 3222 80561 Weight (g) 2.55 E-02 6.53 E-03 3.20 E-02 PPM 13236 3396 16632 Weight (g) 1.29 E+00 1.05 E-01 8.12 E-02 5.53 E-02 5.04 E-02 4.81 E-02 4.18 E-02 2.67 E-03 1.67 E+00 PPM 668347 54770 42184 28730 26213 24998 21700 1389 867983 Item Bond Wires % of Wire 100 Weight (g) 1.00 E-02 PPM 5198 Item Chip % of Chip 100 Weight (g) 8.00 E-03 PPM 4158 Weight (g) 1.83 E-02 1.07 E-02 2.90 E-02 PPM 9496 5577 15073 Weight (g) 1.60 E-02 4.00 E-03 2.00 E-02 PPM 8316 2079 10395 Aluminum Si Item Tin Lead Subtotal Item Silver Filler Cyanate ester resin Subtotal External Leadframe Plating % of Plating 63 37 Die Attach Paste % of Die Attach Paste 80 20 Package Totals Weight (g) PPM 1.92E+00 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary