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Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
Item
Sidebraze
300 mils
20
Au
Combolid
% of Combolid
92
4
4
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
% of Ceramic
Weight (g)
2.76E-01
1.20E-02
1.20E-02
3.00E-01
PPM
169211
7357
7357
183925
Weight (g)
2.55 E-02
6.53 E-03
3.20 E-02
PPM
15613
4006
19619
Weight (g)
PPM
Ceramic
Al2O3
Cr2O3
SiO2
TiO2
Cao
MgO
Subtotal
90.5
3.9
3.5
1.0
0.6
0.5
8.51 E-01
3.67 E-02
3.29 E-02
9.40 E-03
5.64 E-03
4.70 E-03
9.40 E-01
521550
22476
20170
5763
3458
2881
576298
Metallization
Tungsten
Molybdenum
Subtotal
96.61
3.39
4.83 E-02
1.70 E-03
5.00 E-02
29615
1039
30654
Lead
Iron
Nickel
Manganese
Cobalt
Subtotal
58
40.7
0.8
0.5
1.51 E-01
1.06 E-01
2.08 E-03
1.30 E-03
2.60 E-01
92453
64876
1275
797
159402
85
15
8.50 E-03
1.50 E-03
1.00 E-02
5211
920
6131
93.89
5.36
0.7
0.05
9.39 E-03
5.36 E-04
7.00 E-05
5.00 E-06
1.00 E-02
5756
329
43
3
6131
92
8
9.20 E-03
8.00 E-04
1.00 E-02
5640
490
6131
Ag-Cu ( base metal)
Silver
Copper
Subtotal
Nickel Plating ( 1st coating)
Nickel
Palladium
Boron
Lead
Subtotal
Nickel Plating ( 2nd layer)
Nickel
Cobalt
Subtotal
Item
Gold
External Leadframe Plating
% of External Plating
100
Weight (g)
1.00 E-02
PPM
6131
Item
Bond Wires
% of Wire
100
Weight (g)
1.20 E-03
PPM
Item
Chip 1
% of Chip
100
Weight (g)
6.70 E-03
PPM
4108
Weight (g)
9.60 E-04
2.40 E-04
1.20 E-03
PPM
Aluminum
Si
Item
Silver Filler
Cyanate ester resin
Die Attach Paste
% of Die Attach Paste
80
20
736
589
147
736
Package Totals
Weight (g)
1.63E+00
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
Item
Al2O3
Iron
Nickel
Cr2O3
SiO2
Co,Ag,Cu,MgO,CaO
Tungsten
Gold
Subtotal
Sidebraze
300 mils
20
SnPb
Combolid
% of Combolid
92
4
4
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
% of Ceramic
77.0
6.3
4.9
3.3
3.0
2.9
2.5
0.2
Weight (g)
1.43E-01
6.20E-03
6.20E-03
1.55E-01
PPM
74116
3222
3222
80561
Weight (g)
2.55 E-02
6.53 E-03
3.20 E-02
PPM
13236
3396
16632
Weight (g)
1.29 E+00
1.05 E-01
8.12 E-02
5.53 E-02
5.04 E-02
4.81 E-02
4.18 E-02
2.67 E-03
1.67 E+00
PPM
668347
54770
42184
28730
26213
24998
21700
1389
867983
Item
Bond Wires
% of Wire
100
Weight (g)
1.00 E-02
PPM
5198
Item
Chip
% of Chip
100
Weight (g)
8.00 E-03
PPM
4158
Weight (g)
1.83 E-02
1.07 E-02
2.90 E-02
PPM
9496
5577
15073
Weight (g)
1.60 E-02
4.00 E-03
2.00 E-02
PPM
8316
2079
10395
Aluminum
Si
Item
Tin
Lead
Subtotal
Item
Silver Filler
Cyanate ester resin
Subtotal
External Leadframe Plating
% of Plating
63
37
Die Attach Paste
% of Die Attach Paste
80
20
Package Totals
Weight (g)
PPM
1.92E+00
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary