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Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
Item
Sidebraze
300 mils
16
Au
Combolid
% of Combolid
92
4
4
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
% of Ceramic
Weight (g)
1.93E-01
8.40E-03
8.40E-03
2.10E-01
PPM
125699
5465
5465
136630
Weight (g)
9.55 E-03
2.45 E-03
1.20 E-02
PPM
Weight (g)
PPM
6213
1594
7807
1.158
Ceramic
Al2O3
Cr2O3
SiO2
TiO2
Cao
MgO
Subtotal
90.5
3.9
3.5
1.0
0.6
0.5
7.34 E-01
3.16 E-02
2.84 E-02
8.11 E-03
4.87 E-03
4.06 E-03
8.11 E-01
477524
20578
18468
5277
3166
2638
527651
Metallization
Tungsten
Molybdenum
Subtotal
96.61
3.39
4.44 E-02
1.56 E-03
4.60 E-02
28914
1015
29928
Lead
Iron
Nickel
Manganese
Cobalt
Subtotal
58
40.7
0.8
0.5
1.48 E-01
1.04 E-01
2.04 E-03
1.28 E-03
2.55 E-01
96226
67524
1327
830
165908
85
15
1.02 E-02
1.80 E-03
1.20 E-02
6636
1171
7807
93.89
5.36
0.7
0.05
9.39 E-03
5.36 E-04
7.00 E-05
5.00 E-06
1.00 E-02
6109
349
46
3
6506
92
8
9.20 E-03
8.00 E-04
1.00 E-02
5986
520
6506
rail weight= 0.09676
0.94
Ag-Au ( base metal)
Silver
Copper
Subtotal
Nickel Plating ( 1st coating)
Nickel
Palladium
Boron
Lead
Subtotal
Nickel Plating ( 2nd layer)
Nickel
Cobalt
Subtotal
Item
External Leadframe Plating
% of External Plating
100
Weight (g)
1.00 E-02
PPM
Item
Bond Wires
% of Wire
100
Weight (g)
7.40 E-02
PPM
Item
Chip 1
% of Chip
100
Weight (g)
1.30 E-02
PPM
Weight (g)
5.92 E-02
1.48 E-02
7.40 E-02
PPM
Gold
Aluminum
Si
Item
Silver Filler
Cyanate ester resin
Die Attach Paste
% of Die Attach Paste
80
20
1.186
1.54E+00
0.05
0.04
0.046
0.26
0.22
0.255
0.01
0.01
0.012
0.01
0.01
0.010
0.01
0.01
0.010
0.01
0.010
48146
8458
0.0012
38517
9629
48146
1.3871
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
1.08924
8.36 E-01
6506
PPM
1000000
0.811
1.64034
Package Totals
Weight (g)
1.54E+00
0.7
Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
Item
Al2O3
Iron
Nickel
Cr2O3
SiO2
Tungsten
TiO2
CaO
Ag
MgO
Gold
Cu
Co
Mo
Subtotal
Item
Aluminum
Item
Si
Item
Tin
Lead
Subtotal
Item
Silver Filler
Cyanate ester resin
Subtotal
Sidebraze
300 mils
16
SnPb
Combolid
% of Combolid
92
4
4
Weight (g)
1.78E-01
7.76E-03
7.76E-03
1.94E-01
PPM
101696
4422
4422
110539
Weight (g)
9.55 E-03
2.45 E-03
1.20 E-02
PPM
5441
1396
6837
0.012
Weight (g)
8.84 E-01
7.24 E-02
5.58 E-02
3.80 E-02
3.47 E-02
2.87 E-02
9.87 E-03
5.97 E-03
5.40 E-03
4.94 E-03
1.84 E-03
1.15 E-04
2.30 E-04
1.15 E-04
1.14 E+00
PPM
503672
41275
31790
21651
19754
16353
5625
3401
3074
2813
1047
65
131
65
650718
1.148
Bond Wires
% of Wire
100
Weight (g)
7.00 E-03
PPM
3989
0.007
Chip
% of Chip
100
Weight (g)
1.30 E-02
PPM
7407
0.013
External Leadframe Plating
% of Plating
Weight (g)
63
2.36 E-01
37
1.38 E-01
3.74 E-01
PPM
134254
78848
213102
0.374
PPM
5926
1481
7407
0.013
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
% of Ceramic
77.0
6.3
4.9
3.3
3.0
2.5
0.9
0.5
0.5
0.4
0.2
0.01
0.02
0.01
Die Attach Paste
% of Die Attach Paste
80
20
Weight (g)
1.04 E-02
2.60 E-03
1.30 E-02
0.194
0.03306
Package Totals
Weight (g)
1.76E+00
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary