Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal Item Sidebraze 300 mils 16 Au Combolid % of Combolid 92 4 4 Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package % of Ceramic Weight (g) 1.93E-01 8.40E-03 8.40E-03 2.10E-01 PPM 125699 5465 5465 136630 Weight (g) 9.55 E-03 2.45 E-03 1.20 E-02 PPM Weight (g) PPM 6213 1594 7807 1.158 Ceramic Al2O3 Cr2O3 SiO2 TiO2 Cao MgO Subtotal 90.5 3.9 3.5 1.0 0.6 0.5 7.34 E-01 3.16 E-02 2.84 E-02 8.11 E-03 4.87 E-03 4.06 E-03 8.11 E-01 477524 20578 18468 5277 3166 2638 527651 Metallization Tungsten Molybdenum Subtotal 96.61 3.39 4.44 E-02 1.56 E-03 4.60 E-02 28914 1015 29928 Lead Iron Nickel Manganese Cobalt Subtotal 58 40.7 0.8 0.5 1.48 E-01 1.04 E-01 2.04 E-03 1.28 E-03 2.55 E-01 96226 67524 1327 830 165908 85 15 1.02 E-02 1.80 E-03 1.20 E-02 6636 1171 7807 93.89 5.36 0.7 0.05 9.39 E-03 5.36 E-04 7.00 E-05 5.00 E-06 1.00 E-02 6109 349 46 3 6506 92 8 9.20 E-03 8.00 E-04 1.00 E-02 5986 520 6506 rail weight= 0.09676 0.94 Ag-Au ( base metal) Silver Copper Subtotal Nickel Plating ( 1st coating) Nickel Palladium Boron Lead Subtotal Nickel Plating ( 2nd layer) Nickel Cobalt Subtotal Item External Leadframe Plating % of External Plating 100 Weight (g) 1.00 E-02 PPM Item Bond Wires % of Wire 100 Weight (g) 7.40 E-02 PPM Item Chip 1 % of Chip 100 Weight (g) 1.30 E-02 PPM Weight (g) 5.92 E-02 1.48 E-02 7.40 E-02 PPM Gold Aluminum Si Item Silver Filler Cyanate ester resin Die Attach Paste % of Die Attach Paste 80 20 1.186 1.54E+00 0.05 0.04 0.046 0.26 0.22 0.255 0.01 0.01 0.012 0.01 0.01 0.010 0.01 0.01 0.010 0.01 0.010 48146 8458 0.0012 38517 9629 48146 1.3871 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 1.08924 8.36 E-01 6506 PPM 1000000 0.811 1.64034 Package Totals Weight (g) 1.54E+00 0.7 Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal Item Al2O3 Iron Nickel Cr2O3 SiO2 Tungsten TiO2 CaO Ag MgO Gold Cu Co Mo Subtotal Item Aluminum Item Si Item Tin Lead Subtotal Item Silver Filler Cyanate ester resin Subtotal Sidebraze 300 mils 16 SnPb Combolid % of Combolid 92 4 4 Weight (g) 1.78E-01 7.76E-03 7.76E-03 1.94E-01 PPM 101696 4422 4422 110539 Weight (g) 9.55 E-03 2.45 E-03 1.20 E-02 PPM 5441 1396 6837 0.012 Weight (g) 8.84 E-01 7.24 E-02 5.58 E-02 3.80 E-02 3.47 E-02 2.87 E-02 9.87 E-03 5.97 E-03 5.40 E-03 4.94 E-03 1.84 E-03 1.15 E-04 2.30 E-04 1.15 E-04 1.14 E+00 PPM 503672 41275 31790 21651 19754 16353 5625 3401 3074 2813 1047 65 131 65 650718 1.148 Bond Wires % of Wire 100 Weight (g) 7.00 E-03 PPM 3989 0.007 Chip % of Chip 100 Weight (g) 1.30 E-02 PPM 7407 0.013 External Leadframe Plating % of Plating Weight (g) 63 2.36 E-01 37 1.38 E-01 3.74 E-01 PPM 134254 78848 213102 0.374 PPM 5926 1481 7407 0.013 Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package % of Ceramic 77.0 6.3 4.9 3.3 3.0 2.5 0.9 0.5 0.5 0.4 0.2 0.01 0.02 0.01 Die Attach Paste % of Die Attach Paste 80 20 Weight (g) 1.04 E-02 2.60 E-03 1.30 E-02 0.194 0.03306 Package Totals Weight (g) 1.76E+00 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary