Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal PGA 100 Pb-free Combolid % of Combolid 92.0 4.0 4.0 Weight (g) 4.05E-01 1.76E-02 1.76E-02 4.40E-01 4.40E-01 PPM 41101 1787 1787 44675 Weight (g) 1.43 E-02 3.68 E-03 1.80 E-02 1.80 E-02 PPM 1454 373 1828 % of Ceramic 90.50 3.90 3.50 1.00 0.60 0.50 Weight (g) 7.24 E+00 3.12 E-01 2.80 E-01 8.00 E-02 4.80 E-02 4.00 E-02 PPM 735115 31679 28430 8123 4874 4061 % of Metallization 99.37 0.63 % of Pin 54.0 29.0 17.0 % of Coating 1 85.0 15.0 % of Coating 2 92.0 8.0 Weight (g) 5.12 E-01 3.24 E-03 Weight (g) 3.65 E-01 1.96 E-01 1.15 E-01 Weight (g) 6.38 E-02 1.13 E-02 Weight (g) 3.13 E-02 2.72 E-03 9.30 E+00 PPM 51961 329 PPM 37010 19876 11651 PPM 6473 1142 PPM 3176 276 944176 Bond Wires % of Wire 100.0 Weight (g) 2.00 E-02 PPM 2031 Chip % of Chip 100.0 Weight (g) 2.58 E-02 PPM 2620 Weight (g) 7.20 E-03 1.80 E-03 9.00 E-03 PPM 731 183 914 External Pin Coating/Plating % of Plating Weight (g) 100.0 3.70 E-02 PPM 3757 Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package Item Ceramics Al2O3 Cr2O3 SiO2 TiO2 CaO MgO Metallization Tungsten Molybdenum Pin Iron Nickel Cobalt Coating 1 Ag Cu Coating 2 Nickel Cobalt Subtotal Item Aluminum Item Si Item Silver Filler Cyanate ester resin Subtotal Item Gold Die Attach Paste % of Die Attach Paste 80.0 20.0 9.00 E-03 Package Totals Weight (g) PPM 9.85 E+00 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 7/3/2008