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Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
PGA
100
Pb-free
Combolid
% of Combolid
92.0
4.0
4.0
Weight (g)
4.05E-01
1.76E-02
1.76E-02
4.40E-01
4.40E-01
PPM
41101
1787
1787
44675
Weight (g)
1.43 E-02
3.68 E-03
1.80 E-02
1.80 E-02
PPM
1454
373
1828
% of Ceramic
90.50
3.90
3.50
1.00
0.60
0.50
Weight (g)
7.24 E+00
3.12 E-01
2.80 E-01
8.00 E-02
4.80 E-02
4.00 E-02
PPM
735115
31679
28430
8123
4874
4061
% of Metallization
99.37
0.63
% of Pin
54.0
29.0
17.0
% of Coating 1
85.0
15.0
% of Coating 2
92.0
8.0
Weight (g)
5.12 E-01
3.24 E-03
Weight (g)
3.65 E-01
1.96 E-01
1.15 E-01
Weight (g)
6.38 E-02
1.13 E-02
Weight (g)
3.13 E-02
2.72 E-03
9.30 E+00
PPM
51961
329
PPM
37010
19876
11651
PPM
6473
1142
PPM
3176
276
944176
Bond Wires
% of Wire
100.0
Weight (g)
2.00 E-02
PPM
2031
Chip
% of Chip
100.0
Weight (g)
2.58 E-02
PPM
2620
Weight (g)
7.20 E-03
1.80 E-03
9.00 E-03
PPM
731
183
914
External Pin Coating/Plating
% of Plating
Weight (g)
100.0
3.70 E-02
PPM
3757
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
Item
Ceramics
Al2O3
Cr2O3
SiO2
TiO2
CaO
MgO
Metallization
Tungsten
Molybdenum
Pin
Iron
Nickel
Cobalt
Coating 1
Ag
Cu
Coating 2
Nickel
Cobalt
Subtotal
Item
Aluminum
Item
Si
Item
Silver Filler
Cyanate ester resin
Subtotal
Item
Gold
Die Attach Paste
% of Die Attach Paste
80.0
20.0
9.00 E-03
Package Totals
Weight (g)
PPM
9.85 E+00
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
7/3/2008