Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal Item Sidebraze 600 mils 24 Au Combolid % of Combolid 92 4 4 Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package % of Ceramic Weight (g) 3.05E-01 1.32E-02 1.32E-02 3.31E-01 PPM 183645 7985 7985 199614 Weight (g) 2.23 E-02 5.72 E-03 2.80 E-02 PPM 13438 3448 16886 Weight (g) PPM Ceramic Al2O3 Cr2O3 SiO2 TiO2 Cao MgO Subtotal 90.5 3.9 3.5 1.0 0.6 0.5 8.51 E-01 3.67 E-02 3.29 E-02 9.40 E-03 5.64 E-03 4.70 E-03 9.40 E-01 513026 22108 19841 5669 3401 2834 566880 Metallization Tungsten Molybdenum Subtotal 96.61 3.39 4.83 E-02 1.70 E-03 5.00 E-02 29131 1022 30153 Lead Iron Nickel Manganese Cobalt Subtotal 58 40.7 0.8 0.5 1.51 E-01 1.06 E-01 2.08 E-03 1.30 E-03 2.60 E-01 90942 63816 1254 784 156797 85 15 8.50 E-03 1.50 E-03 1.00 E-02 5126 905 6031 93.89 5.36 0.7 0.05 9.39 E-03 5.36 E-04 7.00 E-05 5.00 E-06 1.00 E-02 5662 323 42 3 6031 92 8 9.20 E-03 8.00 E-04 1.00 E-02 5548 482 6031 Ag-Cu ( base metal) Silver Copper Subtotal Nickel Plating ( 1st coating) Nickel Palladium Boron Lead Subtotal Nickel Plating ( 2nd layer) Nickel Cobalt Subtotal Item Gold External Leadframe Plating % of External Plating 100 Weight (g) 1.00 E-02 PPM 6031 Item Bond Wires % of Wire 100 Weight (g) 1.30 E-03 PPM Item Chip % of Chip 100 Weight (g) 6.70 E-03 PPM 4041 Weight (g) 9.60 E-04 2.40 E-04 1.20 E-03 PPM Aluminum Si Item Silver Filler Cyanate ester resin Die Attach Paste % of Die Attach Paste 80 20 784 579 145 724 Package Totals Weight (g) 1.66E+00 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size Lead Count Option Item Kovar Nickel Gold Subtotal Item Gold Sn Subtotal Item Al2O3 Iron Nickel Chromium SiO2 Tungsten CaO MgO Ag Co Gold Cu Subtotal Sidebraze 600 mils 24 SnPb Combolid % of Combolid 92 4 4 Lid Frame % of Lid Frame 79.58 20.42 Ceramic Package % of Ceramic 77.97 6.31 4.86 3.60 3.20 2.00 0.60 0.50 0.50 0.20 0.16 0.10 Weight (g) 3.05E-01 1.32E-02 1.32E-02 3.31E-01 PPM 125986 5478 5478 136941 Weight (g) 2.23 E-02 5.72 E-03 2.80 E-02 PPM Weight (g) 1.57 E+00 1.27 E-01 9.82 E-02 7.27 E-02 6.46 E-02 4.04 E-02 1.21 E-02 1.01 E-02 1.01 E-02 4.04 E-03 3.23 E-03 2.02 E-03 2.02 E+00 PPM 651605 52733 40616 30086 26743 16714 5014 4179 4179 1671 1337 836 835712 9219 2365 11584 Item Bond Wires % of Wire 100 Weight (g) 1.20 E-03 PPM Aluminum Item Weight (g) 6.70 E-03 PPM Si Chip % of Chip 100 Item Sn Pb Subtotal Item Silver Filler Cyanate ester resin Subtotal External Leadframe Plating % of Plating Weight (g) 63 1.83 E-02 37 1.07 E-02 2.90 E-02 Die Attach Paste % of Die Attach Paste 80 20 Weight (g) 9.60 E-04 2.40 E-04 1.20 E-03 Package Totals Weight (g) 2.42E+00 496 2772 PPM 7559 4439 11998 PPM 397 99 496 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary