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Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
Item
Sidebraze
600 mils
24
Au
Combolid
% of Combolid
92
4
4
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
% of Ceramic
Weight (g)
3.05E-01
1.32E-02
1.32E-02
3.31E-01
PPM
183645
7985
7985
199614
Weight (g)
2.23 E-02
5.72 E-03
2.80 E-02
PPM
13438
3448
16886
Weight (g)
PPM
Ceramic
Al2O3
Cr2O3
SiO2
TiO2
Cao
MgO
Subtotal
90.5
3.9
3.5
1.0
0.6
0.5
8.51 E-01
3.67 E-02
3.29 E-02
9.40 E-03
5.64 E-03
4.70 E-03
9.40 E-01
513026
22108
19841
5669
3401
2834
566880
Metallization
Tungsten
Molybdenum
Subtotal
96.61
3.39
4.83 E-02
1.70 E-03
5.00 E-02
29131
1022
30153
Lead
Iron
Nickel
Manganese
Cobalt
Subtotal
58
40.7
0.8
0.5
1.51 E-01
1.06 E-01
2.08 E-03
1.30 E-03
2.60 E-01
90942
63816
1254
784
156797
85
15
8.50 E-03
1.50 E-03
1.00 E-02
5126
905
6031
93.89
5.36
0.7
0.05
9.39 E-03
5.36 E-04
7.00 E-05
5.00 E-06
1.00 E-02
5662
323
42
3
6031
92
8
9.20 E-03
8.00 E-04
1.00 E-02
5548
482
6031
Ag-Cu ( base metal)
Silver
Copper
Subtotal
Nickel Plating ( 1st coating)
Nickel
Palladium
Boron
Lead
Subtotal
Nickel Plating ( 2nd layer)
Nickel
Cobalt
Subtotal
Item
Gold
External Leadframe Plating
% of External Plating
100
Weight (g)
1.00 E-02
PPM
6031
Item
Bond Wires
% of Wire
100
Weight (g)
1.30 E-03
PPM
Item
Chip
% of Chip
100
Weight (g)
6.70 E-03
PPM
4041
Weight (g)
9.60 E-04
2.40 E-04
1.20 E-03
PPM
Aluminum
Si
Item
Silver Filler
Cyanate ester resin
Die Attach Paste
% of Die Attach Paste
80
20
784
579
145
724
Package Totals
Weight (g)
1.66E+00
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
Lead Count
Option
Item
Kovar
Nickel
Gold
Subtotal
Item
Gold
Sn
Subtotal
Item
Al2O3
Iron
Nickel
Chromium
SiO2
Tungsten
CaO
MgO
Ag
Co
Gold
Cu
Subtotal
Sidebraze
600 mils
24
SnPb
Combolid
% of Combolid
92
4
4
Lid Frame
% of Lid Frame
79.58
20.42
Ceramic Package
% of Ceramic
77.97
6.31
4.86
3.60
3.20
2.00
0.60
0.50
0.50
0.20
0.16
0.10
Weight (g)
3.05E-01
1.32E-02
1.32E-02
3.31E-01
PPM
125986
5478
5478
136941
Weight (g)
2.23 E-02
5.72 E-03
2.80 E-02
PPM
Weight (g)
1.57 E+00
1.27 E-01
9.82 E-02
7.27 E-02
6.46 E-02
4.04 E-02
1.21 E-02
1.01 E-02
1.01 E-02
4.04 E-03
3.23 E-03
2.02 E-03
2.02 E+00
PPM
651605
52733
40616
30086
26743
16714
5014
4179
4179
1671
1337
836
835712
9219
2365
11584
Item
Bond Wires
% of Wire
100
Weight (g)
1.20 E-03
PPM
Aluminum
Item
Weight (g)
6.70 E-03
PPM
Si
Chip
% of Chip
100
Item
Sn
Pb
Subtotal
Item
Silver Filler
Cyanate ester resin
Subtotal
External Leadframe Plating
% of Plating
Weight (g)
63
1.83 E-02
37
1.07 E-02
2.90 E-02
Die Attach Paste
% of Die Attach Paste
80
20
Weight (g)
9.60 E-04
2.40 E-04
1.20 E-03
Package Totals
Weight (g)
2.42E+00
496
2772
PPM
7559
4439
11998
PPM
397
99
496
PPM
1000000
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary