Si7866DP Datasheet

Si7866DP
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
FEATURES
D
D
D
D
PRODUCT SUMMARY
VDS (V)
20
rDS(on) (W)
ID (A)
0.0025 @ VGS = 10 V
29
0.00375 @ VGS = 4.5 V
25
TrenchFETr Power MOSFET
Low rDS(on)
PWM (Qgd and Rg) Optimized
100% Rg Tested
APPLICATIONS
D Low-Side MOSFET in Synchronous Buck
DC/DC Converters in Desktops
D Low Output Voltage Synchronous Rectifier
PowerPAKr SO-8
D
S
6.15 mm
5.15 mm
1
S
2
S
3
G
4
G
D
8
D
7
D
6
D
S
5
N-Channel MOSFET
Bottom View
Ordering Information: Si7866DP-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current (10 ms Pulse Width)
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
18
25
IDM
Continuous Source Current (Diode Conduction)a
V
29
ID
14
A
60
4.5
1.6
5.4
1.9
3.4
1.2
TJ, Tstg
Unit
W
_C
-55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Case (Drain)
Steady State
Steady State
RthJA
RthJC
Typical
Maximum
18
23
50
65
1.0
1.5
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71848
S-31727—Rev. C, 18-Aug-03
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Si7866DP
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 mA
0.8
IGSS
Typ
Max
Unit
2.1
V
VDS = 0 V, VGS = "20 V
"100
nA
VDS = 16 V, VGS = 0 V
1
VDS = 16 V, VGS = 0 V, TJ = 55_C
5
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS w 5 V, VGS = 10 V
rDS(on)
Forward Transconductancea
Diode Forward Voltagea
mA
30
A
VGS = 10 V, ID = 29 A
0.0020
0.0025
VGS = 4.5 V, ID = 25 A
0.0026
0.00375
gfs
VDS = 6 V, ID = 29 A
95
VSD
IS = 4.5 A, VGS = 0 V
0.68
1.1
40
60
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
nC
15
11
1.2
1.8
td(on)
70
100
tr
60
90
105
160
55
85
65
100
Rise Time
Turn-Off Delay Time
VDS = 10 V, VGS = 4.5 V, ID = 29 A
0.5
VDD = 10 V, RL = 10 W
ID ^ 1 A, VGEN = 4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = 2.9 A, di/dt = 100 A/ms
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
60
60
VGS = 10 thru 3 V
50
I D - Drain Current (A)
I D - Drain Current (A)
50
40
30
20
10
40
30
TC = 125_C
20
25_C
10
-55_C
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VGS - Gate-to-Source Voltage (V)
Document Number: 71848
S-31727—Rev. C, 18-Aug-03
Si7866DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
8000
0.004
6400
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
On-Resistance vs. Drain Current
0.005
VGS = 4.5 V
0.003
VGS = 10 V
0.002
Ciss
4800
3200
Coss
0.001
1600
0.000
0
Crss
0
10
20
30
40
50
60
0
4
ID - Drain Current (A)
Gate Charge
16
20
On-Resistance vs. Junction Temperature
2.0
VDS = 10 V
ID = 29 A
4.8
VGS = 10 V
ID = 29 A
1.8
r DS(on) - On-Resistance ( W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
12
VDS - Drain-to-Source Voltage (V)
6.0
3.6
2.4
1.2
1.6
1.4
1.2
1.0
0.8
0.0
0
12
24
36
48
0.6
-50
60
-25
0
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.010
r DS(on) - On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
0.008
0.006
ID = 29 A
0.004
0.002
0.000
1
0.00
25
TJ - Junction Temperature (_C)
60
I S - Source Current (A)
8
0.2
0.4
0.6
0.8
VSD - Source-to-Drain Voltage (V)
Document Number: 71848
S-31727—Rev. C, 18-Aug-03
1.0
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
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Si7866DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
200
160
ID = 250 mA
Power (W)
V GS(th) Variance (V)
0.2
-0.0
-0.2
-0.4
120
80
40
-0.6
-50
-25
0
25
50
75
100
125
150
0
0.001
0.01
TJ - Temperature (_C)
0.1
1
10
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 50_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 - 4
10 - 3
10 - 2
10 - 1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10 - 4
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10 - 3
10 - 2
10 - 1
Square Wave Pulse Duration (sec)
1
10
Document Number: 71848
S-31727—Rev. C, 18-Aug-03
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Document Number: 91000
Revision: 18-Jul-08
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