Si7892DP Datasheet

Si7892DP
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (W)
ID (A)
0.0045 @ VGS = 10 V
25
0.006 @ VGS = 4.5 V
22
D TrenchFETr Power MOSFET
D New Low Thermal Resistance PowerPAKr
Package with Low 1.07-mm Profile
D Low Gate Charge
D 100% Rg Tested
APPLICATIONS
D Synchronous Rectifier
PowerPAK SO-8
D
S
6.15 mm
5.15 mm
1
S
2
S
3
G
4
G
D
8
D
7
D
6
D
S
5
N-Channel MOSFET
Bottom View
Ordering Information: Si7892DP-T1
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current (10 ms Pulse Width)
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
15
20
IDM
Continuous Source Current (Diode Conduction)a
V
25
ID
12
A
60
4.5
1.6
5.4
1.9
3.4
1.2
TJ, Tstg
Unit
W
_C
-55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
18
23
50
65
1.0
1.5
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71773
S-31727—Rev. B, 18-Aug-03
www.vishay.com
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Si7892DP
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
VGS(th)
VDS = VGS, ID = 250 mA
1.0
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 24 V, VGS = 0 V
1
VDS = 24 V, VGS = 0 V, TJ = 55_C
5
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS w 5 V, VGS = 10 V
rDS(on)
Forward Transconductancea
Diode Forward Voltagea
V
nA
mA
30
A
VGS = 10 V, ID = 25 A
0.0037
0.0045
VGS = 4.5 V, ID = 22 A
0.0048
0.006
gfs
VDS = 15 V, ID = 25 A
80
VSD
IS = 4.5 A, VGS = 0 V
0.75
1.2
25
35
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
nC
6.7
9.7
0.5
17
tr
10
20
65
130
35
60
50
80
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
W
2.4
td(on)
Rise Time
Turn-Off Delay Time
VDS = 15 V, VGS = 4.5 V, ID = 25 A
IF = 2.9 A, di/dt = 100 A/ms
30
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
60
50
VGS = 10 thru 4 V
40
I D - Drain Current (A)
I D - Drain Current (A)
50
40
3V
30
20
10
TC = 125_C
20
25_C
10
-55_C
0
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
30
5
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
Document Number: 71773
S-31727—Rev. B, 18-Aug-03
Si7892DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
4000
0.008
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
0.010
0.006
VGS = 4.5 V
VGS = 10 V
0.004
3000
Ciss
2000
Coss
1000
0.002
Crss
0.000
0
0
10
20
30
40
50
60
0
6
ID - Drain Current (A)
Gate Charge
24
30
On-Resistance vs. Junction Temperature
1.8
VDS = 15 V
ID = 25 A
8
r DS(on) - On-Resistance ( W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
18
VDS - Drain-to-Source Voltage (V)
10
6
4
2
VGS = 10 V
ID = 25 A
1.6
1.4
1.2
1.0
0.8
0
0
10
20
30
40
50
0.6
-50
60
-25
0
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
TJ = 150_C
TJ = 25_C
0.016
0.012
0.008
ID = 25 A
0.004
0.000
1
0.00
50
0.020
r DS(on) - On-Resistance ( W )
10
25
TJ - Junction Temperature (_C)
60
I S - Source Current (A)
12
0.2
0.4
0.6
0.8
VSD - Source-to-Drain Voltage (V)
Document Number: 71773
S-31727—Rev. B, 18-Aug-03
1.0
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
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Si7892DP
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.6
200
0.4
160
ID = 250 mA
-0.0
Power (W)
V GS(th) Variance (V)
0.2
-0.2
-0.4
120
80
-0.6
40
-0.8
-1.0
-50
-25
0
25
50
75
100
125
150
0
0.001
0.01
TJ - Temperature (_C)
0.1
1
10
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 50_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 - 4
10 - 3
10 - 2
10 - 1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
Single Pulse
0.05
0.02
0.01
10 - 4
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4
10 - 3
10 - 2
10 - 1
Square Wave Pulse Duration (sec)
1
10
Document Number: 71773
S-31727—Rev. B, 18-Aug-03
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Document Number: 91000
Revision: 18-Jul-08
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