STMICROELECTRONICS BTA08-600C

BTA08, BTB08
T810, T835
Snubberless™, logic level and standard 8 A Triacs
Features
A2
■
On-state rms current, IT(RMS) 8 A
■
Repetitive peak off-state voltage, VDRM/VRRM
600 to 800 V
■
G
A1
Triggering gate current, IGT (Q1) 5 to 50 mA
Description
A1 A2
A1
A2
G
G
Available either in through-hole or surface-mount
packages, the BTA08, BTB08 and T8 triac series
is suitable for general purpose AC switching. They
can be used as an ON/OFF function in
applications such as static relays, heating
regulation, induction motor starting circuits... or
for phase control operation in light dimmers,
motor speed controllers,...
D2PAK
Logic level versions are designed to interface
directly with low power drivers such as
microcontrollers.
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at 2500
VRMS) complying with UL standards (file ref.:
E81734).
IPAK
(T8-H)
(T8-G)
A2
A1 A2
G
DPAK
(T8-B)
The snubberless versions (BTA/BTB...W and T8
series) are specially recommended for use on
inductive loads, thanks to their high commutation
performances.
March 2010
A2
A2
A2
A1
A2
G
TO-220AB Insulated
(BTA08)
Doc ID 7472 Rev 7
A1
A2
G
TO-220AB
(BTB08)
1/12
www.st.com
12
Characteristics
BTA08, BTB08 and T8 Series
1
Characteristics
Table 1.
Absolute maximum ratings
Symbol
IT(RMS)
Parameter
Value
Unit
8
A
IPAK/D2PAK/DPAK/
Tc = 110 °C
TO-220AB
On-state rms current (full sine wave)
TO-220AB Ins.
Tc = 100 °C
Non repetitive surge peak on-state current
(full cycle, Tj initial = 25 °C)
F = 50 Hz
t = 20 ms
80
F = 60 Hz
t = 16.7 ms
84
I²t value for fusing
tp = 10 ms
dI/dt
Critical rate of rise of on-state current IG = 2
x IGT ,
tr ≤ 100 ns
F = 120 Hz
IGM
Peak gate current
tp = 20 µs
ITSM
I²t
PG(AV)
Tstg
Tj
Table 2.
A
Average gate power dissipation
36
A ²s
Tj = 125 °C
50
A/µs
Tj = 125 °C
4
A
Tj = 125 °C
1
W
- 40 to + 150
- 40 to + 125
°C
Storage junction temperature range
Operating junction temperature range
Electrical characteristics (Tj = 25 °C, unless otherwise specified)
Snubberless and logic level (3 quadrants)
T8
Symbol
Test conditions
BTA08 / BTB08
Quadrant
Unit
T810 T835
IGT (1)
VGT
VD = 12 V RL = 30 Ω
VGD
VD = VDRM RL = 3.3 kΩ
Tj = 125 °C
IH (2)
IT = 100 mA
IL
IG = 1.2 IGT
dV/dt (2)
(dI/dt)c
(2)
2/12
CW
BW
5
10
35
50
MAX.
I - II - III
MAX.
1.3
V
I - II - III
MIN.
0.2
V
I - III
35
SW
I - II - III
MAX.
10
TW
15
35
10
15
35
50
25
50
10
25
50
70
30
60
15
30
60
80
40
400
20
40
400
1000
5.4
-
3.5
5.4
-
-
2.8
-
1.5
2.98
-
-
-
4.5
-
-
4.5
7
MAX.
II
VD = 67 %VDRM gate open
Tj = 125 °C
(dV/dt)c = 0.1 V/µs
Tj = 125 °C
(dV/dt)c = 10 V/µs
Tj = 125 °C
Without snubber
Tj = 125 °C
MIN.
MIN.
mA
mA
mA
Doc ID 7472 Rev 7
V/µs
A/ms
BTA08, BTB08 and T8 Series
Table 3.
Characteristics
Standard (4 quadrants)
BTA08 / BTB08
Symbol
IGT (1)
Test conditions
Quadrant
VD = 12 V, RL = 33 Ω
VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C
IH (2)
IT = 500 mA
IL
IG = 1.2 IGT
Table 4.
MAX.
1.3
V
ALL
MIN.
0.2
V
25
50
40
50
80
100
MAX.
(dI/dt)c = 5.3 A/ms
mA
mA
mA
II
Tj = 125 °C
MIN.
200
400
V/µs
Tj = 125 °C
MIN.
5
10
V/µs
Value
Unit
Static characteristics
Symbol
VTM (1)
50
100
ALL
MAX.
dV/dt (2) VD = 67 %VDRM gate open
(2)
25
50
MAX.
I - III - IV
(dV/dt)c
B
I - II - III
IV
VGT
VGD
Unit
C
Test conditions
ITM = 11 A, tp = 380 µs
Tj = 25 °C
MAX.
1.55
V
Vt0
(2)
Threshold voltage
Tj = 125 °C
MAX.
0.85
V
Rd
(2)
Dynamic resistance
Tj = 125 °C
MAX.
50
mΩ
5
µA
1
mA
Value
Unit
IDRM
IRRM
Tj = 25 °C
VDRM = VRRM
MAX.
Tj = 125 °C
1. minimum IGT is guaranted at 5% of IGT max.
2. for both polarities of A2 referenced to A1.
Table 5.
Thermal resistance
Symbol
Rth(j-c)
Rth(j-a)
Parameter
IPAK / D2PAK / DPAK / TO-220AB
1.6
TO-220AB Insulated
2.5
S = 1 cm²
D2PAK
45
S = 0.5 cm²
DPAK
70
TO-220AB / TO-220AB Insulated
60
IPAK
100
Junction to case (AC)
°C/W
°C/W
Junction to ambient
S = Copper surface under tab.
Doc ID 7472 Rev 7
3/12
Characteristics
Figure 1.
BTA08, BTB08 and T8 Series
Maximum power dissipation versus Figure 2.
rms on-state current (full cycle)
P(W)
On-state rms current versus case
temperature (full cycle)
IT(RMS)(A)
10
10
9
9
8
8
7
7
6
6
5
5
4
4
3
3
2
2
1
BTB / T8
BTA
1
IT(RMS)(A)
TC(°C)
0
0
0
1
Figure 3.
2
3
4
5
6
7
0
8
On-state rms current versus
ambient temperature (full cycle)
25
Figure 4.
IT(RMS)(A)
50
75
100
125
Relative variation of thermal
impedance versus pulse
duration
K=[Zth/Rth]
3.5
1E+0
printed circuit board FR4, copper thickness: 35 µm
3.0
Zth(j-c)
D2PAK
(S=1CM2)
DPAK/IPAK
Zth(j-a)
2.5
1E-1
TO-220AB/D2PAK
Zth(j-a)
2.0
DPAK
(S=0.5CM2)
1.5
1E-2
1.0
0.5
tp(s)
TC(°C)
1E-3
0.0
0
25
Figure 5.
50
75
100
1E-3
125
On-state characteristics
(maximum values)
Figure 6.
ITM(A)
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
Surge peak on-state current
versus number of cycles
ITSM(A)
100
90
Tj max.
Vto = 0.85V
Rd = 50 mΩ
Tj = Tj max.
80
70
t=20ms
60
One cycle
Non repetitive
Tj initial=25°C
50
10
Tj = 25°C.
40
Repetitive
TC=110°C
30
20
10
VTM(V)
1
0.5
4/12
Number of cycles
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1
Doc ID 7472 Rev 7
10
100
1000
BTA08, BTB08 and T8 Series
Figure 7.
Characteristics
Non-repetitive surge peak on-state
current for a sinusoidal
2
Figure 8.
2
Relative variation of gate trigger
current
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
ITSM(A), I t (A s)
2.5
1000
Tj initial=25°C
holding current and latching current
versus junction temperature (typical values)
2.0
IGT
dI/dt limitation:
50A/µs
ITSM
1.5
360°
100
IH & IL
1.0
α
I2t
0.5
pulse with width tp < 10 ms and corresponding value of I2t
tp(ms)
10
0.01
0.10
Figure 9.
1.00
Tj(°C)
0.0
-40
10.00
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
-20
0
20
40
60
80
100
120
140
Figure 10. Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
2.2
2.0
Standard types
Snubberless and Logic level types
TW
1.8
1.8
1.6
1.6
C
1.4
1.4
1.2
T835/CW/BW
1.2
1.0
B
1.0
0.8
T810/SW
0.6
0.8
0.4
0.2
0.6
(dV/dt)c (V/µs)
0.0
(dV/dt)c (V/µs)
0.4
0.1
1.0
10.0
100.0
Figure 11. Relative variation of critical rate of
decrease of main current versus
junction temperature
0.1
1.0
10.0
100.0
Figure 12. DPAK and D2PAK thermal resistance
junction to ambient versus copper
surface under tab
Rth(j-a)(°C/W)
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
100
6
printed circuit board FR4, copper thickness: 35 µm
90
5
80
70
4
60
DPAK
50
3
40
2
30
D2PAK
20
1
S(cm²)
10
Tj(°C)
0
0
0
25
50
75
100
125
0
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4
8
12
16
20
24
28
32
36
40
5/12
Package information
2
BTA08, BTB08 and T8 Series
Package information
●
Epoxy meets UL94, V0
●
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6.
D2PAK dimensions
Dimensions
Ref.
Millimeters
Min.
A
E
C2
L2
D
L
L3
Typ.
Inches
Max.
Min.
Typ.
Max.
A
4.30
4.60
0.169
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.25
C
0.45
0.60
0.017
0.024
C2
1.21
1.36
0.047
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28
0.192
0.208
L
15.00
15.85 0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
1.40
0.048 0.055
A1
B2
R
C
B
G
A2
2mm min.
FLAT ZONE
V2
R
V2
0.40
0°
8°
Figure 13. Footprint (dimensions in mm)
16.90
10.30
5.08
1.30
8.90
6/12
Doc ID 7472 Rev 7
3.70
0.016
0°
8°
BTA08, BTB08 and T8 Series
Table 7.
Package information
DPAK dimensions
Dimensions
Ref.
E
A
B2
C2
L2
Millimeters
Inches
Min.
Max.
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
D
R
H
L4
A1
B
G
R
C
A2
0.60 MIN.
V2
L2
0.80 typ.
0.031 typ.
L4
0.60
1.00
0.023
0.039
V2
0°
8°
0°
8°
Figure 14. Footprint (dimensions in mm)
6.7
3
3
1.6
2.3
6.7
2.3
1.6
Doc ID 7472 Rev 7
7/12
Package information
BTA08, BTB08 and T8 Series
Table 8.
IPAK dimensions
Dimensions
Ref.
Millimeters
Min.
A
E
C2
B2
L
Typ.
Max.
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A3
0.70
1.30
0.027
0.051
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
0.95
0.037
0.30
0.035
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.019
0.023
D
6
6.20
0.236
0.244
E
6.40
6.60
0.252
0.260
B3
L1
B
A1
V1
e
B5
e
G
2.28
0.090
C
A3
G
4.40
H
8/12
Min.
2.20
B5
D
Max.
A
B3
L2
H
Typ.
Inches
Doc ID 7472 Rev 7
4.60
0.173
16.10
0.181
0.634
L
9
9.40
0.354
0.370
L1
0.8
1.20
0.031
0.047
L2
0.80
V1
10°
1
0.031 0.039
10°
BTA08, BTB08 and T8 Series
Package information
TO-220AB (NIns. and Ins. 20-up) dimensions
Dimensions
Ref.
Millimeters
Min.
A
15.20
a1
C
B
ØI
Typ.
Max.
Inches
Min.
Typ.
15.90 0.598
3.75
Max.
0.625
0.147
a2
13.00
14.00 0.511
0.551
B
10.00
10.40 0.393
0.409
b1
0.61
0.88
0.024
0.034
b2
1.23
1.32
0.048
0.051
C
4.40
4.60
0.173
0.181
c1
0.49
0.70
0.019
0.027
c2
2.40
2.72
0.094
0.107
e
2.40
2.70
0.094
0.106
F
6.20
6.60
0.244
0.259
ØI
3.75
3.85
0.147
0.151
I4
15.80 16.40 16.80 0.622 0.646 0.661
L
2.65
2.95
0.104
0.116
l2
1.14
1.70
0.044
0.066
l3
1.14
1.70
0.044
0.066
b2
L
F
A
I4
l3
c2
a1
l2
a2
M
b1
c1
e
M
Doc ID 7472 Rev 7
2.60
0.102
9/12
Ordering information
3
BTA08, BTB08 and T8 Series
Ordering information
Figure 15. Ordering information scheme (BTA08 and BTB08 series)
BT A 08 - 600 BW (RG)
Triac series
Insulation
A = insulated
B = non insulated
Current
08 = 8A
Voltage
600 = 600V
800 = 800V
Sensitivity and type
B = 50mA Standard
C = 25mA Standard
SW = 10mA Logic Level
BW = 50mA Snubberless
CW = 35mA Snubberless
TW = 5mA Logic Level
Packing mode
RG = Tube
Figure 16. Ordering information scheme (T8 series)
T 8 10 - 600 B (-TR)
Triac series
Current
8 = 8A
Sensitivity
10 = 10 mA
35 = 35 mA
Voltage
600 = 600 V
800 = 800 V
Package
B = DPAK
H = IPAK
G = D2PAK
R = I2PAK
Packing mode
Blanck = Tube
-TR = Tape and reel
Table 9.
Product Selector
Voltage (xxx)
Part Number
Sensitivity
Package
800 V
BTA/BTB08-xxxB
X
X
50 mA
Standard
TO-220AB
BTA/BTB08-xxxBW
X
X
50 mA
Snubberless
TO-220AB
BTA/BTB08-xxxC
X
X
25 mA
Standard
TO-220AB
BTA/BTB08-xxxCW
X
X
35 mA
Snubberless
TO-220AB
BTA/BTB08-xxxSW
X
X
10 mA
Logic level
TO-220AB
BTA/BTB08-xxxTW
X
X
5 mA
Logic Level
TO-220AB
T810-xxxG
X
X
10 mA
Logic Level
D2PAK
T810-xxxH
X
X
10 mA
Logic Level
IPAK
T835-xxxB
X
X
35 mA
Snubberless
DPAK
T835-xxxG
X
X
35 mA
Snubberless
D2PAK
T835-xxxH
X
X
35 mA
Snubberless
IPAK
BTB: non insulated TO-220AB package
10/12
Type
600 V
Doc ID 7472 Rev 7
BTA08, BTB08 and T8 Series
4
Ordering information
Ordering information
Table 10.
Ordering information
Order code
Marking
Package
Weight
BTA/BTB08-xxxyzRG
BTA/BTB08-xxxyz
TO-220AB
2.3 g
T8yy-xxxG
T8yyxx
D2PAK
1.5 g
T8yy-xxxG-TR
T8yyxx
T8yy-xxxB
T8yyxx
DPAK
T8yy-xxxB-TR
T8yyxx
T8yy-xxxH
T8yyxx
IPAK
Base qty Delivery mode
50
Tube
50
Tube
1000
Tape and reel
75
Tube
2500
Tape and reel
75
Tube
0.3 g
0.4 g
xxx = voltage, yy = sensitivity, z = type
5
Revision history
Table 11.
Document revision history
Date
Revision
Changes
Apr-2002
5A
13-Feb-2006
6
TO-220AB delivery mode changed from bulk to tube.
ECOPACK statement added.
10-Mar-2010
7
Updated ECOPACK statement and Figure 16.
Last update.
Doc ID 7472 Rev 7
11/12
BTA08, BTB08 and T8 Series
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Doc ID 7472 Rev 7