TN12, TS12 and TYNx12 Series Sensitive and Standard 12 A SCRS Main features A Symbol Value Unit IT(RMS) 12 A G K A A VDRM/VRRM 600 to 1000 V IGT 0.2 to 15 mA K A K A G G D2PAK (TN12-G) DPAK (TN12-B / TS12-B) Description Available either in sensitive (TS12) or standard (TN12 / TYN) gate triggering levels, the 12 A SCR series is suitable to fit all modes of control, found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits. K A K G IPAK (TN12-H / TS12-H) A G TO-220AB (TYNx12RG) Order codes Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space area. March 2007 A A Rev 6 Part Numbers Marking TN1215-x00B TN1215x00 TN1215-x00B-TR TN1215x00 TN1215-x00G TN1215x00G TN1215-x00G-TR TN1215x00G TN1215-x00H TN1215x00 TS1220-x00B TS1220x00 TS1220-x00B-TR TS1220x00 TS1220-x00H TS1220x00 TYNx12RG TYNx12 TYNx12TRG TYNx12T 1/12 www.st.com 12 Characteristics TN12, TS12 and TYNx12 Series 1 Characteristics Table 1. Absolute ratings (limiting values) Value Symbol IT(RMS) Parameter TN12-G TYN12 TN12-B/H TS12-B/H Unit RMS on-state current (180° conduction angle) Tc = 105° C 12 A IT(AV) Average on-state current (180° conduction angle) Tc = 105° C 8 A ITSM Non repetitive surge peak on-state current tp = 8.3 ms I²t Value for fusing tp = 10 ms Tj = 25° C dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Tj = 125° C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125° C 4 A Tj = 125° C 1 W - 40 to + 150 - 40 to + 125 °C 5 V I²t PG(AV) Tstg Tj VRGM Table 2. Average gate power dissipation VGT 145 115 140 110 98 60 A Storage junction temperature range Operating junction temperature range Maximum peak reverse gate voltage (for TN12 and TYN12 only) A2S Sentitive electrical characteristics (Tj = 25° C, unless otherwise specified) Symbol IGT tp = 10 ms Tj = 25° C Test Conditions RL = 140 Ω VD = 12 V RL = 3.3 kΩ RGK = 220 Ω Unit MAX. 200 µA MAX. 0.8 V MIN. 0.1 V MIN. 8 V VGD VD = VDRM VRG IRG = 10 µA IH IT = 50 mA RGK = 1 kΩ MAX. 5 mA IL IG = 1 mA RGK = 1 kΩ MAX. 6 mA Tj = 125° C MIN. 5 V/µs Tj = 25° C MAX. 1.6 V RGK = 220 Ω Tj = 125° C TS1220 dV/dt VD = 65 % VDRM VTM ITM = 24 A Vt0 Threshold voltage Tj = 125° C MAX. 0.85 V Rd Dynamic resistance Tj = 125° C MAX. 30 mΩ 5 µA 2 mA IDRM IRRM 2/12 tp = 380 µs VDRM = VRRM RGK = 220 Ω Tj = 25° C Tj = 125° C MAX. TN12, TS12 and TYNx12 Series Table 3. Characteristics Standard electrical characteristics (Tj = 25° C, unless otherwise specified) TN1215 Symbol TYN Test Conditions Unit B/H IGT VGT VGD VD = VDRM RL = 3.3 kΩ IH IT = 500 mA Gate open IL IG = 1.2 IGT dV/dt VD = 67 % VDRM VTM ITM = 24 A Vt0 Rd IDRM IRRM Tj = 125° C Gate open x12 MIN. 2 0.5 2 MAX. 15 5 15 MAX. 1.3 V MIN. 0.2 V MAX. 40 30 15 30 mA MAX. 80 60 30 60 mA 40 200 V/µs Tj =125° C MIN. Tj = 25° C MAX. 1.6 V Threshold voltage Tj = 125° C MAX. 0.85 V Dynamic resistance Tj = 125° C MAX. 30 mΩ 5 µA 2 mA tp = 380 µs Tj = 25° C VDRM = VRRM Table 4. x12T mA RL = 33 Ω VD = 12 V G 200 MAX. Tj = 125° C Thermal resistance Symbol Parameter Junction to case (DC) Rth(j-c) (1) S = 0.5 cm² S(1) = 1 cm² Value Unit 1.3 ° C/W DPAK 70 D2PAK 45 IPAK 100 TO-220AB 60 ° C/W Junction to ambient (DC) Rth(j-a) 1. S = Copper surface under tab Figure 1. Maximum average power Figure 2. dissipation versus average on-state current P(W) Average and D.C. on-state current versus case temperature IT(AV)(A) 12 14 11 D.C. α = 180° 12 10 9 10 8 α = 180° 7 8 6 6 5 4 3 4 360° 2 2 1 IT(AV)(A) 0 0 1 2 3 4 Tcase(°C) α 5 6 7 0 8 9 0 25 50 75 100 125 3/12 Characteristics Figure 3. TN12, TS12 and TYNx12 Series Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK) Figure 4. IT(AV)(A) Relative variation of thermal impedance junction to case versus pulse duration K=[Zth(j-c)/Rth(j-c)] 3.0 1.0 2.5 D.C. 2.0 0.5 D2PAK 1.5 α = 180° DPAK 1.0 0.2 0.5 tp(s) Tamb(°C) 0.0 0 25 50 75 100 125 0.1 1E-3 1E-2 Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board for DPAK) Figure 5. K=[Zth(j-a)/Rth(j-a)] 1E-1 1E+0 Relative variation of gate trigger current and holding current versus junction temperature for TS12 series IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 1.00 2.0 1.8 1.6 IGT DPAK 1.4 1.2 D2PAK 0.10 1.0 TO-220AB / IPAK IH & IL RGK = 1kΩ 0.8 0.6 0.4 0.2 tp(s) 1E-2 1E-1 Tj(°C) 0.0 0.01 1E+0 1E+1 1E+2 -40 5E+2 Figure 8. Relative variation of gate trigger current and holding current versus junction temperature for TN12 and TYNx12 series Figure 7. -20 0 20 60 80 100 120 140 Relative variation of holding current versus gate-cathode resistance (typical values) for TS12 series IH[RGK] / IH[RGK=1kΩ] IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 5.0 2.4 Tj = 25°C 4.5 2.2 2.0 4.0 IGT 1.8 3.5 1.6 3.0 1.4 1.2 2.5 1.0 2.0 IH & IL 0.8 0.6 1.5 0.4 1.0 0.2 Tj(°C) 0.5 40 0.0 1E-2 RGK(kΩ) 0.0 -40 4/12 40 -20 0 20 60 80 100 120 140 1E-1 1E+0 1E+1 TN12, TS12 and TYNx12 Series Figure 9. Characteristics Relative variation of dV/dt immunity Figure 10. Relative variation of dV/dt immunity versus gate-cathode resistance versus gate-cathode capacitance (typical values) for TS12 series (typical values) for TS12 series dV/dt[CGK] / dV/dt[RGK=220Ω] dV/dt[RGK] / dV/dt[RGK=220Ω] 4.0 10.0 Tj = 125°C VD = 0.67 x VDRM VD = 0.67 x VDRM Tj = 125°C RGK = 220Ω 3.5 3.0 2.5 2.0 1.0 1.5 1.0 0.5 RGK(kΩ) 0.1 CGK(nF) 0.0 0 200 400 600 800 1000 1200 0 25 50 75 100 125 150 Figure 11. Surge peak on-state current versus Figure 12. Non-repetitive surge peak on-state number of cycles current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of I²t ITSM(A) 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 ITSM(A), I2t (A2s) 2000 Tj initial = 25°C ITSM 1000 tp=10ms TN12 / TYN12 TN12 / TYN12 One cycle Non repetitive Tj initial=25°C TS12 dI/dt limitation TS12 TN12 / TYN12 100 I2t TS12 Repetitive TC=105°C Number of cycles tp(ms) 10 1 10 100 1000 0.01 0.10 1.00 10.00 Figure 13. On-state characteristics (maximum Figure 14. Thermal resistance junction to values) ambient versus copper surface under tab (epoxy printed circuit board FR4, copper thickness: 35 µm) (DPAK and D2PAK) Rth(j-a)(°C/W) ITM(A) 100 200 Tj max.: Vt0=0.85V Rd=30mΩ 100 80 60 Tj=max DPAK 10 40 Tj=25°C D2PAK 20 S(cm²) VTM(V) 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 2 4 6 8 10 12 14 16 18 20 5/12 Ordering information scheme 2 TN12, TS12 and TYNx12 Series Ordering information scheme Figure 15. TN12 series TN 12 15 - 600 B (-TR) Standard SCR series Current 12 = 12 A Sensitivity 15 = 15 mA Voltage 600 = 600 V 800 = 800 V 1000 = 1000 V Package B = DPAK G = D2PAK H = IPAK Packing mode Blanck = Tube -TR = Tape and Reel (DPAK and D2PAK) Figure 16. TS12 series TS 12 20 - 600 B (-TR) Sensitive SCR series Current 12 = 12 A Sensitivity 20 = 200 µA Voltage 600 = 600 V 700 = 700 V Package B = DPAK H = IPAK Packing mode Blanck = Tube -TR = Tape and Reel Figure 17. TYNx12 series TYN Standard SCR series Voltage 6 = 600 V 8 = 800 V 10 = 1000 V Current 12 = 12 A Sensitivity Blanck = 15 mA T = 5 mA Packing mode RG = Tube 6/12 6 12 T RG TN12, TS12 and TYNx12 Series Table 5. Package information Product selector Voltage (xxx) Part Numbers 600 V 3 700 V 800 V Sensitivity Package 1000 V TN1215-xxxB X X 15 mA DPAK TN1215-xxxG X X 15 mA D2PAK TN1215-xxxH X X 15 mA IPAK TS1220-xxxB X 0.2 mA DPAK TS1220-xxxH X 0.2 mA IPAK TYNx12 X X X 15 mA TO-220AB TYNx12T X X X 5 mA TO-220AB X Package information ● Epoxy meets UL94, V0 Table 6. TO-220AB dimensions Dimensions Ref. Millimeters Min. A ØI 15.20 a1 C B b2 L F A I4 Typ. Max. Inches Min. Typ. 15.90 0.598 3.75 Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 l3 c2 a1 l2 a2 M b1 e c1 M 2.60 0.102 7/12 Package information TN12, TS12 and TYNx12 Series Table 7. IPAK dimensions Dimensions Ref. Millimeters Min. A E C2 B2 L Typ. Max. 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A3 0.70 1.30 0.027 0.051 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 0.95 0.037 0.30 0.035 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.019 0.023 D 6 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 B3 L1 B A1 V1 e B5 e G 2.28 0.090 C A3 G 4.40 H 8/12 Min. 2.20 B5 D Max. A B3 L2 H Typ. Inches 4.60 0.173 16.10 0.181 0.634 L 9 9.40 0.354 0.370 L1 0.8 1.20 0.031 0.047 L2 0.80 V1 10° 1 0.031 0.039 10° TN12, TS12 and TYNx12 Series Table 8. Package information DPAK dimensions Dimensions Ref. E A B2 C2 L2 Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 D R H L4 A1 B G R C A2 0.60 MIN. V2 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 18. DPAK footprint dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 9/12 Package information Table 9. TN12, TS12 and TYNx12 Series D2PAK dimensions Dimensions Ref. Millimeters Min. A E C2 L2 D L L3 Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 C 0.45 0.60 0.017 0.024 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 1.40 0.048 0.055 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 0° 0.016 8° 0° 8° Figure 19. D2PAK footprint dimensions (in millimeters) 16.90 10.30 5.08 1.30 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 10/12 TN12, TS12 and TYNx12 Series 4 Ordering information Ordering information Ordering type(1) Marking(1) Package Weight Base qty Delivery mode TN1215-x00B TN1215x00 DPAK 0.3 g 75 Tube TN1215-x00B-TR TN1215x00 DPAK 0.3 g 2500 Tape and reel TN1215-x00G TN1215x00G D2PAK 1.5 g 50 Tube 2 TN1215-x00G-TR TN1215x00G D PAK 1.5 g 1000 Tape and reel TN1215-x00H TN1215x00 IPAK 0.3 g 75 Tube TS1220-x00B TS1220x00 DPAK 0.3 g 75 Tube TS1220-x00B-TR TS1220x00 DPAK 0.3 g 2500 Tape and reel TS1220-x00H TS1220x00 IPAK 0.3 g 75 Tube TYNx12RG TYNx12 TO-220AB 2.3 g 50 Tube TYNx12TRG TYNx12T TO-220AB 2.3 g 50 Tube 1. x (6, 7, 8, 10) depends upon voltage 5 Revision history Date Revision Description of Changes Sep-2000 3 Last update. 25-Mar-2005 4 TO-220AB delivery mode changed from bulk to tube. 14-Oct-2005 5 Changed sensitivity values in Table 5 for TYNx12 (30 to 15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK statement. 08-Mar-2007 6 Reformatted to current standard. Figure 15: TN12 series product name corrected. Figure 16: TS12 series product name corrected. 11/12 TN12, TS12 and TYNx12 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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