TN805, TN815 TS820, TYN608 Sensitive and standard 8 A SCRs Features A A ■ On-state rms current, IT(RMS) 8 A ■ Repetitive peak off-state voltage, VDRM/VRRM 600 and 800 V ■ K G K Triggering gate current, IGT 0.2 to 15 mA G IPAK TS820-600H A Description A A K A G Available either in sensitive (TS8) or standard (TN8 / TYN) gate triggering levels, the 8 A SCR series is suitable to fit all modes of control found in applications such as overvoltage crowbar protection, motor control circuits in power tools and kitchen aids, inrush current limiting circuits, capacitive discharge ignition and voltage regulation circuits. DPAK TN805-600B TN815-x00B TS820-600B K G TO-220AB TYN608RG A Available in through-hole or surface-mount packages, they provide an optimized performance in a limited space. A K A G TO-220AB TS820-600T K A G TO-220FPAB TS820-600FP Table 1. Device summary Voltage (x00) VDRM/VRRM Order code 600 V 800 V Sensitivity IGT Package TS820-600B X 0.2 mA DPAK TS820-600H X 0.2 mA IPAK TS820-600T X 0.2 mA TO-220AB TS820-600FP X 0.2 mA TO-220FPAB TN805-600B X 5 mA DPAK TN815-x00B X 15 mA DPAK TYN608RG X 15 mA TO-220AB October 2011 X Doc ID 7476 Rev 7 1/13 www.st.com 13 Characteristics TN805, TN815, TS820, TYN608 1 Characteristics Table 2. Absolute ratings (limiting values) Value Symbol TN805 Parameter Unit TN815 TYN608 TS820 IT(RMS) Tc = 110 °C On-state rms current (180° conduction angle) IT(AV) Average on-state current (180° conduction angle) ITSM Non repetitive surge peak on-state current I2t 8 A 5 A T0-220FPAB, Tc = 91 °C Tc = 110 °C T0-220FPAB, Tc = 91 °C tp = 8.3 ms tp = 10 ms Tj = 25 °C 73 100 70 95 24.5 45 A I2t value for fusing tp = 10 ms Tj = 25 °C dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Tj = 125 °C 50 A/µs IGM Peak gate current tp = 20 µs Tj = 125 °C 4 A Tj = 125 °C 1 W - 40 to + 150 - 40 to + 125 °C 5 V PG(AV) Tstg Tj VRGM Table 3. Average gate power dissipation Storage junction temperature range Operating junction temperature range Maximum peak reverse gate voltage (for TN8x5 and TYN608 only) Sensitive electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT VGT A2S Test conditions VD = 12 V, RL = 140 Ω TS820 Unit MAX. 200 µA MAX. 0.8 V MIN. 0.1 V VGD VD = VDRM, RL = 3.3 kΩ, RGK = 220 Ω VRG IRG = 10 µA MIN. 8 V IH IT = 50 mA, RGK = 1 kΩ MAX. 5 mA IL IG = 1 mA ,, RGK = 1 kΩ MAX. 6 mA Tj = 125 °C dV/dt VD = 65% VDRM, RGK = 220 Ω Tj = 125 °C MIN. 5 V/µs VTM ITM = 16 A, tp = 380 µs Tj = 25 °C MAX. 1.6 V Vt0 Threshold voltage Tj = 125 °C MAX. 0.85 V Rd Dynamic resistance Tj = 125 °C MAX. 46 mΩ 5 µA 1 mA IDRM IRRM 2/13 VDRM = VRRM, RGK = 220 Ω Tj = 25 °C Tj = 125 °C Doc ID 7476 Rev 7 MAX. TN805, TN815, TS820, TYN608 Table 4. Standard electrical characteristics (Tj = 25 °C, unless otherwise specified) Symbol IGT Characteristics Test conditions TN805 TN815 TYN608 MIN. 0.5 2 2 MAX. 5 15 15 Unit mA VD = 12 V, RL = 33 Ω VGT MAX. 1.3 V MIN. 0.2 V VGD VD = VDRM, RL = 3.3 kΩ IH IT = 100 mA , gate open MAX. 25 40 30 mA IL IG = 1.2 IGT MAX. 30 50 70 mA 50 150 150 V/µs Tj = 125 °C dV/dt VD = 67% VDRM, gate open Tj =125 °C MIN. VTM ITM = 16 A Tj = 25 °C MAX. 1.6 V Vt0 Threshold voltage Tj = 125 °C MAX. 0.85 V Rd Dynamic resistance Tj = 125 °C MAX. 46 mΩ 5 µA 2 mA IDRM IRRM tp = 380 µs Tj = 25 °C VDRM = VRRM Table 5. MAX. Tj = 125 °C Thermal resistance Symbol Parameter Rth(j-c) Value DPAK, IPAK, TO-220AB 1.3 TO-220FPAB 4.6 DPAK 70 IPAK 100 TO-220AB, TO-220FPAB 60 Junction to case (DC) °C/W S(1) = 0.5 cm2 Rth(j-a) Unit Junction to ambient (DC) °C/W 1. S = Copper surface under tab Figure 1. Maximum average power Figure 2. dissipation versus average on-state current P(W) Average and DC on-state current versus case temperature IT(AV)(A) 8 10 DPAK IPAK 9 α = 180° 7 TO-220AB D.C. 8 6 7 5 6 4 5 α = 180° 4 3 360° TO-220FPAB 3 2 2 1 α IT(AV)(A) Tcase(°C) 1 0 0 0 1 2 3 4 5 6 0 Doc ID 7476 Rev 7 25 50 75 100 125 3/13 Characteristics Figure 3. TN805, TN815, TS820, TYN608 Average and DC on-state current versus ambient temperature Figure 4. IT(AV)(A) Relative variation of thermal impedance junction to case versus pulse duration K=[Zth(j-c)/Rth(j-c)] 2,5 1.0 Recommended pad layout, FR4 printed circuit board D.C. α = 180° 2,0 0.5 TO-220AB TO-220FPAB 1,5 1,0 0.2 DPAK IPAK 0,5 tp(s) Tamb(°C) 0.1 0,0 0 25 Figure 5. 50 75 100 1E-3 125 Relative variation of thermal impedance junction to ambient versus pulse duration 1E-2 Figure 6. K=[Zth(j-a)/Rth(j-a)] 1E+0 1E-1 Relative variation of gate trigger current and holding current versus junction temperature for TS820 IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 1.00 2.0 Recommended pad layout, FR4 printed circuit board 1.8 IGT 1.6 1.4 DPAK 1.2 0.10 IH & IL RGK = 1kΩ 1.0 0.8 TO-220AB / IPAK TO-220FPAB 0.6 0.4 0.2 tp(s) 1E-2 1E+0 1E-1 Figure 7. 1E+1 1E+2 -40 5E+2 -20 Relative variation of gate trigger Figure 8. and holding current versus junction temperature 0 20 40 60 80 100 120 140 Relative variation of holding current versus gate-cathode resistance (typical values) IH[RGK] / IH[RGK=1kΩ] IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 6.0 2.4 5.5 2.2 TN8 and TYNx8 IGT 2.0 Tj(°C) 0.0 0.01 Tj = 25°C TS8 5.0 1.8 4.5 1.6 4.0 3.5 1.4 1.2 3.0 IH & IL 1.0 2.5 0.8 2.0 0.6 1.5 0.4 1.0 Tj(°C) 0.2 -40 4/13 -20 0 20 40 RGK(kΩ) 0.5 0.0 60 80 100 120 140 0.0 1E-2 Doc ID 7476 Rev 7 1E-1 1E+0 1E+1 TN805, TN815, TS820, TYN608 Figure 9. Characteristics Relative variation of dV/dt immunity Figure 10. Relative variation of dV/dt immunity versus gate-cathode resistance versus gate-cathode capacitance (typical values) for TS820 (typical values) for TS820 dV/dt[RGK] / dV/dt[RGK=220Ω] dV/dt[CGK] / dV/dt[RGK=220Ω] 10.00 15.0 Tj = 125°C VD = 0.67 x VDRM VD = 0.67 x VDRM Tj = 125°C RGK = 220Ω 12.5 10.0 1.00 7.5 5.0 0.10 2.5 RGK(kΩ) CGK(nF) 0.0 0.01 0 200 400 600 800 1000 1200 1400 1600 1800 0 2000 20 40 60 80 100 120 140 160 180 200 220 Figure 11. Surge peak on-state current versus Figure 12. Non-repetitive surge peak on-state number of cycles current and corresponding values of I2t 2 2 ITSM(A), I t (A s) ITSM(A) 1000 100 Tj initial = 25°C 90 80 ITSM tp=10ms TYN08 One cycle 70 TYN08 dI/dt limitation Non repetitive Tj initial=25°C 60 TN8 / TS8 50 TN8 / TS8 Sinusoidal pulse width tp < 10 ms 100 40 TYN08 30 Repetitive TC=110°C 20 It 2 TN8 / TS8 10 Number of cycles 0 tp(ms) 10 10 1 100 1000 0.01 0.10 1.00 10.00 Figure 13. On-state characteristics (maximum Figure 14. Thermal resistance junction to values) ambient versus copper surface under tab (DPAK) Rth(j-a)(°C/W) ITM(A) 100 50.0 Tj max.: Vt0=0.85V Rd=46mΩ Epoxy printed circuit board FR4 copper thickness = 35 µm 80 10.0 Tj=max 60 40 1.0 Tj=25°C 20 S(cm²) VTM(V) 0.1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 Doc ID 7476 Rev 7 2 4 6 8 10 12 14 16 18 20 5/13 Ordering information scheme 2 TN805, TN815, TS820, TYN608 Ordering information scheme Figure 15. TN8 series TN 8 05 - 600 B -TR Standard SCR series Current 8=8A Sensitivity 05 = 5 mA 15 = 15 mA Voltage 600 = 600 V 800 = 800 V Package B = DPAK Packing mode -TR = Tape and reel Figure 16. TS8 series TS 8 20 - 600 B (-TR) Sensitive SCR series Current 8=8A Sensitivity 20 = 200 µA Voltage 600 = 600 V Package B = DPAK H = IPAK T = TO-220AB FP = TO220FPAB Packing mode Blank = Tube -TR = Tape and reel Figure 17. TYNx08 series TYN Standard SCR series Voltage 6 = 600 V Current 8=8A Packing mode RG = Tube 6/13 Doc ID 7476 Rev 7 6 08 RG TN805, TN815, TS820, TYN608 3 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free packages ● Recommended torque: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. DPAK dimensions Dimensions Ref. E A B2 C2 L2 Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 D R H L4 A1 B G R C A2 0.60 MIN. V2 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 18. Footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 Doc ID 7476 Rev 7 7/13 Package information TN805, TN815, TS820, TYN608 Table 7. IPAK dimensions Dimensions Ref. Millimeters Min. A E C2 B2 L Typ. Max. 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A3 0.70 1.30 0.027 0.051 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 0.95 0.037 0.30 0.035 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.019 0.023 D 6 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 B3 L1 B A1 V1 e B5 e G 2.28 0.090 C A3 G 4.40 H 8/13 Min. 2.20 B5 D Max. A B3 L2 H Typ. Inches Doc ID 7476 Rev 7 4.60 0.173 16.10 0.181 0.634 L 9 9.40 0.354 0.370 L1 0.8 1.20 0.031 0.047 L2 0.80 V1 10° 1 0.031 0.039 10° TN805, TN815, TS820, TYN608 Table 8. Package information TO-220AB dimensions (for TS820-xxxT) Dimensions Ref. Dia Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 D L9 L4 L2 F M G1 Inches A H2 F1 Millimeters 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 E G M Diam. Doc ID 7476 Rev 7 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 9/13 Package information Table 9. TN805, TN815, TS820, TYN608 TO-220AB dimensions (for TYNx8 series) Dimensions Ref. Millimeters Min. A 15.20 a1 C B ØI Typ. Max. Inches Min. Typ. 15.90 0.598 3.75 Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 2.40 2.70 0.094 0.106 F 6.20 6.60 0.244 0.259 ØI 3.75 3.85 0.147 0.151 I4 15.80 16.40 16.80 0.622 0.646 0.661 L 2.65 2.95 0.104 0.116 l2 1.14 1.70 0.044 0.066 l3 1.14 1.70 0.044 0.066 b2 L F A I4 l3 c2 a1 l2 a2 M b1 c1 e M 10/13 Doc ID 7476 Rev 7 2.60 0.102 TN805, TN815, TS820, TYN608 Table 10. Package information TO-220FPAB dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 A B H Dia L6 L2 L7 L3 L5 F1 L4 D F2 F L2 E G1 G Doc ID 7476 Rev 7 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 11/13 Ordering information 4 Ordering information Table 11. 5 Ordering information Order code Marking Package Weight TN805-600B-TR TN805600 DPAK 0.3 g 2500 Tape and reel TN815-600B-TR TN815600 DPAK 0.3 g 2500 Tape and reel TN815-800B-TR TN815800 DPAK 0.3 g 2500 Tape and reel TS820-600B TS820600 DPAK 0.3 g 75 Tube TS820-600B-TR TS820600 DPAK 0.3 g 2500 Tape and reel TS820-600H TS820600 IPAK 0.4 g 75 Tube TS820-600T TS820600T TO-220AB 2.3 g 50 Tube TS820-600FP TS820600 TO-220FPAB 2.0 g 50 Tube TYN608RG TYN608 TO-220AB 2.3 g 50 Tube Base qty Delivery mode Revision history Table 12. 12/13 TN805, TN815, TS820, TYN608 Document revision history Date Revision Changes Apr-2002 4A 13-Feb-2006 5 TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. 22-Jan-2010 6 Alpha definition updated in Figure 1. Thermal resistance, junction to case, updated in Table 5. 10-Oct-2011 7 Added TO-220FPAB package. Removed 700 V and 1000 V products. Last update. Doc ID 7476 Rev 7 TN805, TN815, TS820, TYN608 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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