Product / Package Information Environmental Information Package Lead Count Body Size Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LQFP_EP 100 14 X 14 X 1.4 (6.0 EP) 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Other inorganic materials Subtotal Silica Epoxy and Phenol resin Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary 1333-86-4 4.03 E-01 5.93 E-02 1.44 E-03 4.64 E-01 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100 869100 127800 3100 1000000 60.60 8.91 0.22 69.73 PPM 606016 89114 2162 697292 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 1.38 E-01 3.33 E-03 1.70 E-04 4.26 E-05 1.42 E-01 CAS# Weight (g) Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 20.80 0.50 0.03 0.01 21.34 PPM 208022 5014 256 64 213356 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver 7440-22-4 Component Level Percentage (%) PPM Percentage (%) 100 1000000 0.17 1.10 E-03 PPM 1660 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 9.94 E-03 Percentage (%) PPM Percentage (%) 100 1000000 1.49 PPM 14949 Bond Wires Homogeneous Material Level Substance Description Precious Metals Precious Metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 2.80 E-03 2.83 E-05 2.83 E-03 CAS# Weight (g) Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 0.42 0.004 0.43 PPM 4213 43 4256 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon 7440-21-3 3.89 E-02 Component Level Percentage (%) PPM Percentage (%) 100 1000000 5.85 PPM 58456 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy resin Aliphatic acid anhydride 2,6 diglycidyl phenyl allyl ether oligome Epoxy derivative 1,4-bis(2,3-epoxypropoxy)butane Hexahydromethylphthalic anhydride CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Component Level Weight (g) 4.42 E-03 3.74 E-04 3.74 E-04 3.74 E-04 3.74 E-04 3.74 E-04 3.74 E-04 6.67 E-03 Weight (g) 6.65 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 66.34 5.61 5.61 5.61 5.61 5.61 5.61 100.00 663400 56100 56100 56100 56100 56100 56100 1000000 0.67 0.06 0.06 0.06 0.06 0.06 0.06 1.00 Percentage (%) 100.00 PPM 6655 563 563 563 563 563 563 10031 PPM 1000000