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Product / Package Information
Environmental Information
Package
Lead Count
Body Size
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LQFP_EP
100
14 X 14 X 1.4 (6.0 EP)
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Silica
Epoxy and Phenol resin
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
1333-86-4
4.03 E-01
5.93 E-02
1.44 E-03
4.64 E-01
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100
869100
127800
3100
1000000
60.60
8.91
0.22
69.73
PPM
606016
89114
2162
697292
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
1.38 E-01
3.33 E-03
1.70 E-04
4.26 E-05
1.42 E-01
CAS#
Weight (g)
Component Level
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
20.80
0.50
0.03
0.01
21.34
PPM
208022
5014
256
64
213356
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
7440-22-4
Component Level
Percentage (%)
PPM
Percentage (%)
100
1000000
0.17
1.10 E-03
PPM
1660
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
9.94 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
1.49
PPM
14949
Bond Wires
Homogeneous Material Level
Substance
Description
Precious Metals
Precious Metals
Subtotal
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
2.80 E-03
2.83 E-05
2.83 E-03
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
0.42
0.004
0.43
PPM
4213
43
4256
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
7440-21-3
3.89 E-02
Component Level
Percentage (%)
PPM
Percentage (%)
100
1000000
5.85
PPM
58456
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy resin
Aliphatic acid anhydride
2,6 diglycidyl phenyl allyl ether oligome
Epoxy derivative
1,4-bis(2,3-epoxypropoxy)butane
Hexahydromethylphthalic anhydride
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Component Level
Weight (g)
4.42 E-03
3.74 E-04
3.74 E-04
3.74 E-04
3.74 E-04
3.74 E-04
3.74 E-04
6.67 E-03
Weight (g)
6.65 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
66.34
5.61
5.61
5.61
5.61
5.61
5.61
100.00
663400
56100
56100
56100
56100
56100
56100
1000000
0.67
0.06
0.06
0.06
0.06
0.06
0.06
1.00
Percentage (%)
100.00
PPM
6655
563
563
563
563
563
563
10031
PPM
1000000