Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Ni Si Mg Ag Item Sn MQFP 14 X 20 128 Pb-Free Molding Compound % of Compound Weight (g) 8 9.85 E-02 86 1.06 E+00 5 6.16 E-02 0.4 4.93 E-03 0.4 4.93 E-03 0.2 2.46 E-03 PPM 50678 544787 31674 2534 2534 1267 Item Pb Cd Hg Cr+6 PBB PBDE Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 4.17 E-01 1.30 E-02 2.82 E-03 6.51 E-04 PPM 214685 6695 1451 335 Item Pb Cd Hg Cr+6 Internal Leadframe Plating Weight (g) % of Plating 3.00 E-03 100 PPM 1543 External Leadframe Plating % of Plating Weight (g) 2.11 E-02 100 PPM 10834 Au Bond Wires % of Wire 99.99 Weight (g) 3.80 E-03 PPM 1956 Si Chip % of Chip 100 Weight (g) 2.33 E-01 PPM 119913 Weight (g) 4.61 E-03 1.31 E-02 PPM 2370 6745 Item Resin Ag Filler Die Attach % of Die Attach 26 74 PPM 4.90 <2.0 <2.0 <2.0 ND ND PPM <5.0 <5.0 <5.0 <5.0 Molding Compound Method EPA method #3052 (ICP-AES) BS EN 1122:2001B (ICP-AES) Mercury Analyser EPA method #3060A(UV) SGS In-House Method SGS In-House Method Die Attach Paste Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A Package Totals PPM Weight (g) 1000000 1.94 E+00 STS-S-B Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 04/26/04 Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Ni Si Mg Ag Item Sn Pb MQFP 14 X 20 128 Sn/Pb Molding Compound % of Compound Weight (g) 8 9.85 E-02 86 1.06 E+00 5 6.16 E-02 0.4 4.93 E-03 0.4 4.93 E-03 0.2 2.46 E-03 PPM 50678 544787 31674 2534 2534 1267 Item Pb Cd Hg Cr+6 PBB PBDE Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 214685 6695 1451 335 Item Pb Cd Hg Cr+6 Weight (g) 4.17 E-01 1.30 E-02 2.82 E-03 6.51 E-04 Internal Leadframe Plating Weight (g) % of Plating 3.00 E-03 100 PPM External Leadframe Plating % of Plating Weight (g) 1.79 E-02 85 3.16 E-03 15 PPM PPM <5.0 <5.0 <5.0 <5.0 Die Attach Paste Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A 9209 1625 Bond Wires % of Wire 99.99 Weight (g) 3.80 E-03 PPM Si Chip % of Chip 100 Weight (g) 2.33 E-01 PPM 119913 Die Attach % of Die Attach 26 74 Weight (g) 4.61 E-03 1.31 E-02 PPM Item ND ND Molding Compound Method EPA method #3052 (ICP-AES) BS EN 1122:2001B (ICP-AES) Mercury Analyser EPA method #3060A(UV) SGS In-House Method SGS In-House Method 1543 Au Resin Ag Filler PPM 4.90 <2.0 <2.0 <2.0 1956 2370 6745 Package Totals PPM Weight (g) 1000000 1.94 E+00 STS-S-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 04/26/04