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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Ni
Si
Mg
Ag
Item
Sn
MQFP
14 X 20
128
Pb-Free
Molding Compound
% of Compound
Weight (g)
8
9.85 E-02
86
1.06 E+00
5
6.16 E-02
0.4
4.93 E-03
0.4
4.93 E-03
0.2
2.46 E-03
PPM
50678
544787
31674
2534
2534
1267
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
4.17 E-01
1.30 E-02
2.82 E-03
6.51 E-04
PPM
214685
6695
1451
335
Item
Pb
Cd
Hg
Cr+6
Internal Leadframe Plating
Weight (g)
% of Plating
3.00 E-03
100
PPM
1543
External Leadframe Plating
% of Plating
Weight (g)
2.11 E-02
100
PPM
10834
Au
Bond Wires
% of Wire
99.99
Weight (g)
3.80 E-03
PPM
1956
Si
Chip
% of Chip
100
Weight (g)
2.33 E-01
PPM
119913
Weight (g)
4.61 E-03
1.31 E-02
PPM
2370
6745
Item
Resin
Ag Filler
Die Attach
% of Die Attach
26
74
PPM
4.90
<2.0
<2.0
<2.0
ND
ND
PPM
<5.0
<5.0
<5.0
<5.0
Molding Compound
Method
EPA method #3052 (ICP-AES)
BS EN 1122:2001B (ICP-AES)
Mercury Analyser
EPA method #3060A(UV)
SGS In-House Method
SGS In-House Method
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
Package Totals
PPM
Weight (g)
1000000
1.94 E+00
STS-S-B
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
04/26/04
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Ni
Si
Mg
Ag
Item
Sn
Pb
MQFP
14 X 20
128
Sn/Pb
Molding Compound
% of Compound
Weight (g)
8
9.85 E-02
86
1.06 E+00
5
6.16 E-02
0.4
4.93 E-03
0.4
4.93 E-03
0.2
2.46 E-03
PPM
50678
544787
31674
2534
2534
1267
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
214685
6695
1451
335
Item
Pb
Cd
Hg
Cr+6
Weight (g)
4.17 E-01
1.30 E-02
2.82 E-03
6.51 E-04
Internal Leadframe Plating
Weight (g)
% of Plating
3.00 E-03
100
PPM
External Leadframe Plating
% of Plating
Weight (g)
1.79 E-02
85
3.16 E-03
15
PPM
PPM
<5.0
<5.0
<5.0
<5.0
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
9209
1625
Bond Wires
% of Wire
99.99
Weight (g)
3.80 E-03
PPM
Si
Chip
% of Chip
100
Weight (g)
2.33 E-01
PPM
119913
Die Attach
% of Die Attach
26
74
Weight (g)
4.61 E-03
1.31 E-02
PPM
Item
ND
ND
Molding Compound
Method
EPA method #3052 (ICP-AES)
BS EN 1122:2001B (ICP-AES)
Mercury Analyser
EPA method #3060A(UV)
SGS In-House Method
SGS In-House Method
1543
Au
Resin
Ag Filler
PPM
4.90
<2.0
<2.0
<2.0
1956
2370
6745
Package Totals
PPM
Weight (g)
1000000
1.94 E+00
STS-S-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
04/26/04