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Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multiaromatic Resin
Item
Cu
Cr
Sn
Zn
MQFP_PQ4
32 X 32 x 3.5
240
Pb-free
Molding Compound
% of Compound
85.0
15.0
Weight (g)
3.75 E+00
6.61 E-01
PPM
447306
78936
Leadframe
% of Leadframe
99.25
0.30
0.25
0.20
Weight (g)
9.61 E-01
2.90 E-03
2.42 E-03
1.94 E-03
PPM
114726
347
289
231
Internal Leadframe Plating
% of Plating
Weight (g)
2.86 E-03
100.0
PPM
Ag
PPM
Sn
External Leadframe Plating
Weight (g)
% of Plating
3.46 E-02
100.0
Item
Bond Wires
% of Wire
99.99
Au
342
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Molding Compound
Method
USEPA 3050B - ICP-AES
EN1122 MethodB:2001. ICP-AES
USEPA 3052. ICP-AES
USEPA 3060A. UV-VIS
USEPA 3540C. Analysis by GC/MS.
USEPA 3540C. Analysis by GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
USEPA 3050B - ICP-AES
EN1122:2001. ICP-AES
USEPA 3052. ICP-AES
USEPA 3060A & 7196A.
USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS.
USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS.
4134
Weight (g)
2.06 E-02
PPM
Weight (g)
2.88 E-01
PPM
34414
2459
Chip
% of Chip
100.0
Si
Die Attach
% of Die Attach
75.0
25.0
Weight (g)
1.78 E-02
5.95 E-03
PPM
Ag Filler
Resin
Al
Heat Slug/Sink
% of Heat Sink
100.0
Weight (g)
2.63 E+00
PPM
313975
Item
2131
710
Package Totals
Weight (g)
PPM
1000000
8.37 E+00
AMK-SP-B
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
10/23/06
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy Resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Ni
Si
Mg
MQFP-ED
32 X 32
240
Sn/Pb
Molding Compound
% of Compound
8
86
5
0.4
0.4
0.2
Weight (g)
3.47 E-01
3.73 E+00
2.17 E-01
1.74 E-02
1.74 E-02
8.68 E-03
PPM
46576
500695
29110
2329
2329
1164
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
4.90
<2.0
<2.0
<2.0
ND
ND
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
8.65 E-01
2.70 E-02
5.85 E-03
1.35 E-03
PPM
115982
3617
784
181
Item
PPM
<5.0
<5.0
<5.0
2.0
Die Attach Paste
Internal Leadframe Plating
% of Plating
Weight (g)
3.60 E-02
100
PPM
Ag
PPM
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85
3.44 E-02
15
6.08 E-03
Item
Bond Wires
% of Wire
99.99
Au
Molding Compound
Method
EPA method #3052 (ICP-AES)
BS EN 1122:2001B (ICP-AES)
Mercury Analyser
EPA method #3060A(UV)
SGS In-House Method
SGS In-House Method
Pb
Cd
Hg
Cr+6
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
4827
4616
815
Weight (g)
7.73 E-02
PPM
10367
Weight (g)
9.94 E-02
PPM
13329
Weight (g)
2.77 E-03
9.27 E-03
PPM
23
77
Heat Sink A
% of Heat Sink
99.935
0.05
0.005
0.005
0.005
Weight (g)
9.00 E-01
4.50 E-04
4.50 E-05
4.50 E-05
4.50 E-05
PPM
120683
60
6
6
6
Weight (g)
1.73 E-02
5.78 E-02
PPM
Weight (g)
9.00 E-01
4.50 E-04
4.50 E-05
4.50 E-05
4.50 E-05
PPM
120683
60
6
6
6
Weight (g)
2.25 E-02
5.26 E-02
PPM
Chip
% of Chip
Si
100
Item
Resin
Ag Filler
Cu
Zr
Mn
Fe
Al
Heat Sink Attach A
% of Heat Sink Attach
23
77
Resin
Ag Filler
Heat Sink B
% of Heat Sink
99.935
0.05
0.005
0.005
0.005
Cu
Zr
Mn
Fe
Al
Item
Resin
Ag Filler
Die Attach
% of Die Attach
Heat Sink Attach B
% of Heat Sink Attach
30
70
371
1243
2316
7755
3021
7050
Package Totals
Weight (g)
PPM
1000000
7.46 E+00
AST-SP-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
8/18/04