Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Item Cu Cr Sn Zn MQFP_PQ4 32 X 32 x 3.5 240 Pb-free Molding Compound % of Compound 85.0 15.0 Weight (g) 3.75 E+00 6.61 E-01 PPM 447306 78936 Leadframe % of Leadframe 99.25 0.30 0.25 0.20 Weight (g) 9.61 E-01 2.90 E-03 2.42 E-03 1.94 E-03 PPM 114726 347 289 231 Internal Leadframe Plating % of Plating Weight (g) 2.86 E-03 100.0 PPM Ag PPM Sn External Leadframe Plating Weight (g) % of Plating 3.46 E-02 100.0 Item Bond Wires % of Wire 99.99 Au 342 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Molding Compound Method USEPA 3050B - ICP-AES EN1122 MethodB:2001. ICP-AES USEPA 3052. ICP-AES USEPA 3060A. UV-VIS USEPA 3540C. Analysis by GC/MS. USEPA 3540C. Analysis by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method USEPA 3050B - ICP-AES EN1122:2001. ICP-AES USEPA 3052. ICP-AES USEPA 3060A & 7196A. USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS. USEPA 3540C or 3550C. Analysis by HPLC/DAD, LC/MS or GC/MS. 4134 Weight (g) 2.06 E-02 PPM Weight (g) 2.88 E-01 PPM 34414 2459 Chip % of Chip 100.0 Si Die Attach % of Die Attach 75.0 25.0 Weight (g) 1.78 E-02 5.95 E-03 PPM Ag Filler Resin Al Heat Slug/Sink % of Heat Sink 100.0 Weight (g) 2.63 E+00 PPM 313975 Item 2131 710 Package Totals Weight (g) PPM 1000000 8.37 E+00 AMK-SP-B Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 10/23/06 Materials Declaration Package Body Size LeadCount Option Item Epoxy Resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Ni Si Mg MQFP-ED 32 X 32 240 Sn/Pb Molding Compound % of Compound 8 86 5 0.4 0.4 0.2 Weight (g) 3.47 E-01 3.73 E+00 2.17 E-01 1.74 E-02 1.74 E-02 8.68 E-03 PPM 46576 500695 29110 2329 2329 1164 Item Pb Cd Hg Cr+6 PBB PBDE PPM 4.90 <2.0 <2.0 <2.0 ND ND Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 8.65 E-01 2.70 E-02 5.85 E-03 1.35 E-03 PPM 115982 3617 784 181 Item PPM <5.0 <5.0 <5.0 2.0 Die Attach Paste Internal Leadframe Plating % of Plating Weight (g) 3.60 E-02 100 PPM Ag PPM Sn Pb External Leadframe Plating Weight (g) % of Plating 85 3.44 E-02 15 6.08 E-03 Item Bond Wires % of Wire 99.99 Au Molding Compound Method EPA method #3052 (ICP-AES) BS EN 1122:2001B (ICP-AES) Mercury Analyser EPA method #3060A(UV) SGS In-House Method SGS In-House Method Pb Cd Hg Cr+6 Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A 4827 4616 815 Weight (g) 7.73 E-02 PPM 10367 Weight (g) 9.94 E-02 PPM 13329 Weight (g) 2.77 E-03 9.27 E-03 PPM 23 77 Heat Sink A % of Heat Sink 99.935 0.05 0.005 0.005 0.005 Weight (g) 9.00 E-01 4.50 E-04 4.50 E-05 4.50 E-05 4.50 E-05 PPM 120683 60 6 6 6 Weight (g) 1.73 E-02 5.78 E-02 PPM Weight (g) 9.00 E-01 4.50 E-04 4.50 E-05 4.50 E-05 4.50 E-05 PPM 120683 60 6 6 6 Weight (g) 2.25 E-02 5.26 E-02 PPM Chip % of Chip Si 100 Item Resin Ag Filler Cu Zr Mn Fe Al Heat Sink Attach A % of Heat Sink Attach 23 77 Resin Ag Filler Heat Sink B % of Heat Sink 99.935 0.05 0.005 0.005 0.005 Cu Zr Mn Fe Al Item Resin Ag Filler Die Attach % of Die Attach Heat Sink Attach B % of Heat Sink Attach 30 70 371 1243 2316 7755 3021 7050 Package Totals Weight (g) PPM 1000000 7.46 E+00 AST-SP-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 8/18/04