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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Carbon Black
Item
Cu
Ni
Si
Mg
Ag
Item
Sn
MQFP
14 X 20
100
Pb-Free
Molding Compound
% of Compound
Weight (g)
10
1.23 E-01
84
1.03 E+00
5.5
6.77 E-02
0.5
6.16 E-03
PPM
62821
527697
34552
3141
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
4.34 E-01
1.35 E-02
2.93 E-03
6.77 E-04
PPM
221415
6905
1496
345
Internal Leadframe Plating
% of Plating
Weight (g)
3.00 E-03
100
PPM
1530
External Leadframe Plating
Weight (g)
% of Plating
100
2.11 E-02
PPM
10743
Au
Bond Wires
% of Wire
99.99
Weight (g)
2.76 E-03
PPM
1410
Si
Chip
% of Chip
100
Weight (g)
2.33 E-01
PPM
118907
Weight (g)
4.07 E-03
1.36 E-02
PPM
2079
6959
Item
Resin
Ag Filler
Die Attach
% of Die Attach
23
77
Item
Pb
Cd
Hg
Cr+6
PPM
4.40
<2.0
<2.0
<2.0
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICPaes)
Mercury Analyser
EPA method #3060A(UV)
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
2.0
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
Package Totals
Weight (g)
PPM
1000000
1.96 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Carbon Black
Item
Cu
Ni
Si
Mg
MQFP
14 X 20
100
Sn/Pb Plating
Molding Compound
% of Compound
Weight (g)
10
1.23 E-01
84
1.03 E+00
5.5
6.77 E-02
0.5
6.16 E-03
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
4.34 E-01
1.35 E-02
2.93 E-03
6.77 E-04
PPM
62821
527697
34552
3141
PPM
221415
6905
1496
345
Internal Leadframe Plating
% of Plating
Weight (g)
3.00 E-03
100
PPM
Ag
PPM
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85
1.79 E-02
15
3.16 E-03
Item
Bond Wires
% of Wire
99.99
Au
Item
Pb
Cd
Hg
Cr+6
PPM
4.40
<2.0
<2.0
<2.0
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
2.0
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICPaes)
Mercury Analyser
EPA method #3060A(UV)
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
1530
9132
1611
Weight (g)
2.76 E-03
PPM
Weight (g)
2.33 E-01
PPM
118907
Weight (g)
4.07 E-03
1.36 E-02
PPM
1410
Chip
% of Chip
Si
100
Item
Resin
Ag Filler
Die Attach
% of Die Attach
23
77
2079
6959
Package Totals
Weight (g)
PPM
1000000
1.96 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary