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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
LQFP
20 X 20
184
Pb Free
Molding Compound
% of Compound
Weight (g)
8
5.53 E-02
86
5.95 E-01
5
3.46 E-02
0.4
2.77 E-03
0.4
2.77 E-03
0.2
1.38 E-03
Sub-Total
6.92 E-01
PPM
40613
436590
25383
2031
2031
1015
507662
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
ND
ND
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICP AES)
Mercury Analyser
EPA method #3060A(UV)
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
Die Attach Paste
Item
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Sub-Total
Weight (g)
5.53 E-01
1.73 E-02
3.74 E-03
8.63 E-04
5.75 E-01
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
3.50 E-03
100
Sn
External Leadframe Plating
Weight (g)
% of Plating
100
7.14 E-02
Item
Au
Item
Resin
Ag Filler
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
PPM
2569
PPM
52372
Sub-Total
7.14 E-02
Bond Wires
% of Wire
99.99
Weight (g)
8.85 E-04
PPM
Weight (g)
7.04 E-04
PPM
100
Die Attach
% of Die Attach
26
74
Weight (g)
5.02 E-03
1.43 E-02
PPM
Sub-Total
1.93 E-02
Chip
% of Chip
Si
PPM
406026
12662
2743
633
422065
52372
649
517
3683
10483
14166
Package Totals
PPM
Weight (g)
1000000
1.36 E+00
STS-ST-C
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
7/7/05
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
LQFP
20 X 20
184
Sn/Pb
Molding Compound
% of Compound
Weight (g)
8
5.53 E-02
86
5.95 E-01
5
3.46 E-02
0.4
2.77 E-03
0.4
2.77 E-03
0.2
1.38 E-03
Sub-Total
6.92 E-01
PPM
40613
436590
25383
2031
2031
1015
507662
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
ND
ND
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICP AES)
Mercury Analyser
EPA method #3060A(UV)
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
Die Attach Paste
Item
Cu
Ni
Si
Mg
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Sub-Total
Internal Leadframe Plating
% of Plating
Weight (g)
3.50 E-03
100
Ag
Item
Sn
Pb
External Leadframe Plating
Weight (g)
% of Plating
85
6.06 E-02
15
1.07 E-02
Sub-Total
7.14 E-02
Bond Wires
% of Wire
99.99
Au
Si
Item
PPM
406026
12662
2743
633
422065
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
SGS in-house Method by GC/MS
SGS in-house Method by GC/MS
PPM
2569
PPM
44516
7856
52372
Weight (g)
8.85 E-04
PPM
Weight (g)
7.04 E-04
PPM
100
Die Attach
% of Die Attach
26
74
Weight (g)
5.02 E-03
1.43 E-02
PPM
Sub-Total
1.93 E-02
Chip
% of Chip
Resin
Ag Filler
Weight (g)
5.53 E-01
1.73 E-02
3.74 E-03
8.63 E-04
5.75 E-01
649
517
3683
10483
14166
Package Totals
PPM
Weight (g)
1000000
1.36 E+00
STS-ST-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
7/7/05