Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black LQFP 20 X 20 184 Pb Free Molding Compound % of Compound Weight (g) 8 5.53 E-02 86 5.95 E-01 5 3.46 E-02 0.4 2.77 E-03 0.4 2.77 E-03 0.2 1.38 E-03 Sub-Total 6.92 E-01 PPM 40613 436590 25383 2031 2031 1015 507662 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Item Pb Cd Hg Cr+6 PBB PBDE PPM <5.0 <5.0 <5.0 <5.0 ND ND Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS Die Attach Paste Item Cu Ni Si Mg Leadframe % of Leadframe 96.2 3 0.65 0.15 Sub-Total Weight (g) 5.53 E-01 1.73 E-02 3.74 E-03 8.63 E-04 5.75 E-01 Ag Internal Leadframe Plating % of Plating Weight (g) 3.50 E-03 100 Sn External Leadframe Plating Weight (g) % of Plating 100 7.14 E-02 Item Au Item Resin Ag Filler Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A SGS in-house Method by GC/MS SGS in-house Method by GC/MS PPM 2569 PPM 52372 Sub-Total 7.14 E-02 Bond Wires % of Wire 99.99 Weight (g) 8.85 E-04 PPM Weight (g) 7.04 E-04 PPM 100 Die Attach % of Die Attach 26 74 Weight (g) 5.02 E-03 1.43 E-02 PPM Sub-Total 1.93 E-02 Chip % of Chip Si PPM 406026 12662 2743 633 422065 52372 649 517 3683 10483 14166 Package Totals PPM Weight (g) 1000000 1.36 E+00 STS-ST-C Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 7/7/05 Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black LQFP 20 X 20 184 Sn/Pb Molding Compound % of Compound Weight (g) 8 5.53 E-02 86 5.95 E-01 5 3.46 E-02 0.4 2.77 E-03 0.4 2.77 E-03 0.2 1.38 E-03 Sub-Total 6.92 E-01 PPM 40613 436590 25383 2031 2031 1015 507662 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Item Pb Cd Hg Cr+6 PBB PBDE PPM <5.0 <5.0 <5.0 <5.0 ND ND Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICP AES) Mercury Analyser EPA method #3060A(UV) SGS in-house Method by GC/MS SGS in-house Method by GC/MS Die Attach Paste Item Cu Ni Si Mg Leadframe % of Leadframe 96.2 3 0.65 0.15 Sub-Total Internal Leadframe Plating % of Plating Weight (g) 3.50 E-03 100 Ag Item Sn Pb External Leadframe Plating Weight (g) % of Plating 85 6.06 E-02 15 1.07 E-02 Sub-Total 7.14 E-02 Bond Wires % of Wire 99.99 Au Si Item PPM 406026 12662 2743 633 422065 Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A SGS in-house Method by GC/MS SGS in-house Method by GC/MS PPM 2569 PPM 44516 7856 52372 Weight (g) 8.85 E-04 PPM Weight (g) 7.04 E-04 PPM 100 Die Attach % of Die Attach 26 74 Weight (g) 5.02 E-03 1.43 E-02 PPM Sub-Total 1.93 E-02 Chip % of Chip Resin Ag Filler Weight (g) 5.53 E-01 1.73 E-02 3.74 E-03 8.63 E-04 5.75 E-01 649 517 3683 10483 14166 Package Totals PPM Weight (g) 1000000 1.36 E+00 STS-ST-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 7/7/05