Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant LFCSP - Sawn - COL 1.3 X 1.6 X 0.55 10 NiPdAu Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 4.10E-04 4.56E-05 2.54E-05 2.54E-05 1.01E-06 5.07E-04 CAS# Weight (g) Percentage (%) PPM Percentage (%) 80.80 9.00 5.00 5.00 0.20 100.00 808000 90000 50000 50000 2000 1000000 7.11 0.79 0.44 0.44 0.02 8.80 PPM 71116 7921 4401 4401 176 88015 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Nickel Silicon Magnesium 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Component Level Percentage (%) PPM Percentage (%) 96.20 3.00 0.65 0.15 100.00 962000 30000 6500 1500 1000000 77.74 2.42 0.53 0.12 80.81 4.48 E-03 1.40 E-04 3.03 E-05 6.98 E-06 4.66 E-03 PPM 777394 24243 5253 1212 808102 Internal / External Leadframe Plating Component Level Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold CAS# Weight (g) 7440-02-0 7440-05-3 7440-57-5 8.60 E-05 2.00 E-06 4.14 E-07 8.84 E-05 CAS# Weight (g) Percentage (%) PPM Percentage (%) 97.3 2.3 0.5 100.00 972697 22621 4683 1000000 1.49 0.03 0.01 1.53 PPM 14929 347 72 15349 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold 7440-57-5 Component Level Percentage (%) PPM Percentage (%) 100.0 1000000 1.25 7.20 E-05 PPM 12499 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.25 7.20 E-05 PPM 12499 Die Attach Component Level Homogeneous Material Level Description Other inorganic materials Thermoset Others Other organic materials Subtotal Package Totals Substance Silica Resin Additive Bisphenol A Glycidylether CAS# 60676-86-0 Proprietary Proprietary 25068-38-6 Weight (g) Percentage (%) PPM Percentage (%) 70.0 15.0 10.0 5.0 100.0 700000 150000 100000 50000 1000000 4.45 0.95 0.64 0.32 6.35 2.56 E-04 5.49 E-05 3.66 E-05 1.83 E-05 3.66 E-04 Weight (g) 5.76 E-03 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 44476 9531 6354 3177 63537 PPM 1000000