Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP 4 X 4 X 1.45 16 100 Sn Yes with exemption Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol resin Carbon black CAS# 60676-86-0 Proprietary Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 93.7 3.0 3.0 0.3 100.00 937000 30000 30000 3000 1000000 53.38 1.71 1.71 0.17 56.97 3.46E-02 1.11E-03 1.11E-03 1.11E-04 3.70E-02 PPM 533832 17092 17092 1709 569725 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Nickel Silicon Magnesium CAS# 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 96.20 3.00 0.65 0.15 100.00 962000 30000 6500 1500 1000000 27.31 0.85 0.18 0.04 28.39 1.77 E-02 5.53 E-04 1.20 E-04 2.76 E-05 1.84 E-02 PPM 273104 8517 1845 426 283892 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance CAS# 7440-22-4 Silver Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.84 5.48 E-04 PPM 8444 External Leadframe Plating Homogeneous Material Level Description y Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.39 2.50 E-04 PPM 3852 Bond Wires Component Level Homogeneous Material Level Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# 7440-57-5 7440-05-3 Weight (g) Percentage (%) PPM Percentage (%) 99.0 1.00 100.0 990000 10000 1000000 0.41 0.004 0.41 2.66 E-04 2.69 E-06 2.69 E-04 PPM 4103 41 4145 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 7.98 5.18 E-03 PPM 79767 Die Attach Homogeneous Material Level Description Thermoset Other organic materials Subtotal Substance Resin Polytetrafluoroethylene CAS# Component Level Weight (g) Proprietary 9002-84-0 1.38 E-03 9.96 E-04 2.37 E-03 CAS# Weight (g) 65997-17-3 65997-17-3 7.74 E-04 1.11 E-04 8.85 E-04 Percentage (%) PPM Percentage (%) 58 42 100.0 580000 420000 1000000 2.12 1.54 3.65 PPM 21198 15350 36548 Seal Glass Description Ceramics/Glass Ceramics/Glass Package Totals Substance Lead borosilicate glass Aluminosilicate glass Homogeneous Material Level Percentage (%) PPM 87.5 875000 12.5 125000 Weight (g) 6.49 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level Percentage (%) 1.19 0.17 1.36 PPM Percentage (%) 100 PPM 1000000 11925 1704 13629