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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP
4 X 4 X 1.45
16
100 Sn
Yes with exemption
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol resin
Carbon black
CAS#
60676-86-0
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
93.7
3.0
3.0
0.3
100.00
937000
30000
30000
3000
1000000
53.38
1.71
1.71
0.17
56.97
3.46E-02
1.11E-03
1.11E-03
1.11E-04
3.70E-02
PPM
533832
17092
17092
1709
569725
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Nickel
Silicon
Magnesium
CAS#
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
96.20
3.00
0.65
0.15
100.00
962000
30000
6500
1500
1000000
27.31
0.85
0.18
0.04
28.39
1.77 E-02
5.53 E-04
1.20 E-04
2.76 E-05
1.84 E-02
PPM
273104
8517
1845
426
283892
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
CAS#
7440-22-4
Silver
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.84
5.48 E-04
PPM
8444
External Leadframe Plating
Homogeneous Material Level
Description
y
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.39
2.50 E-04
PPM
3852
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
7440-57-5
7440-05-3
Weight (g)
Percentage (%)
PPM
Percentage (%)
99.0
1.00
100.0
990000
10000
1000000
0.41
0.004
0.41
2.66 E-04
2.69 E-06
2.69 E-04
PPM
4103
41
4145
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
7.98
5.18 E-03
PPM
79767
Die Attach
Homogeneous Material Level
Description
Thermoset
Other organic materials
Subtotal
Substance
Resin
Polytetrafluoroethylene
CAS#
Component Level
Weight (g)
Proprietary
9002-84-0
1.38 E-03
9.96 E-04
2.37 E-03
CAS#
Weight (g)
65997-17-3
65997-17-3
7.74 E-04
1.11 E-04
8.85 E-04
Percentage (%)
PPM
Percentage (%)
58
42
100.0
580000
420000
1000000
2.12
1.54
3.65
PPM
21198
15350
36548
Seal Glass
Description
Ceramics/Glass
Ceramics/Glass
Package Totals
Substance
Lead borosilicate glass
Aluminosilicate glass
Homogeneous Material Level
Percentage (%)
PPM
87.5
875000
12.5
125000
Weight (g)
6.49 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
Percentage (%)
1.19
0.17
1.36
PPM
Percentage (%)
100
PPM
1000000
11925
1704
13629