Material Declaration Report Package Type: BQSOP 48L Component Weight (mg): 160.6670 Pericom Package Code: B48(Pb-free) MSL Rating: 1 Termination Plating: Matte Tin RoHS Compliance: Yes Peak Body Temp (C): 260 JESD 97 Pb-free Category: e3 Applicable Exemption: N/A Max Time (sec): 30 Plating Thickness (um): 10~20 Reflow Cycles: 3 Tin Whisker Mitigation: Anneal, 150C/1hr Rev Date: 11/5/2009 Homogeneous Material Declaration MATERIAL ITEM MATERIAL WEIGHT(mg) MOLD COMPOUND ASSEMBLY SUBCON 101.3111 OSE SPEL LEADFRAME 51.4257 SILICON DIE 2.7637 DIE ATTACH EPOXY 0.2601 OSE SPEL MATERIAL COMPOSITION Silica Fused Epoxy Resin 1 Phenolic Resin Epoxy Resin 2 Aromatic Phosphate Carbon Black CAS NO. COMPOSITION % 90.800 3.000 3.000 2.000 1.000 0.200 COMPOSITION WEIGHT(mg) 91.9905 3.0393 3.0393 2.0262 1.0131 0.2026 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 Silica Fused Epoxy Resin Phenolic Resin Epoxy, Cresol Novolac Carbon Black 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-4 88.000 5.000 4.500 2.000 0.500 89.1538 5.0656 4.5590 2.0262 0.5066 Copper Iron Silver Zinc Phosphorus 7440-50-8 7439-89-6 7440-22-4 7440-66-6 7723-14-0 97.021 2.350 0.453 0.111 0.065 49.8936 1.2085 0.2331 0.0570 0.0334 Silicon (Si) Non-hazardous Metal 7440-21-3 Proprietary 99.192 0.808 2.7414 0.0223 Silver Acrylic Resin Acrylate Polybutadiene derivative Epoxy resin Additive Butadiene copolymer Peroxide 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 76.000 8.000 5.500 5.500 2.500 1.000 1.000 0.500 0.1977 0.0208 0.0143 0.0143 0.0065 0.0026 0.0026 0.0013 Silver Epoxy Resin Diluent Hardener Dicyandamide 7440-22-4 9003-36-5 26447-14-3 620-92-8 461-58-5 80.000 10.000 6.000 3.250 0.750 0.2081 0.0260 0.0156 0.0085 0.0020 GOLD WIRE 0.7432 Gold(Au) Impurities 7440-57-5 - 99.990 0.010 0.7431 0.0001 SOLDER PLATING 4.1631 Tin (Sn) Impurity 7440-31-5 - 99.990 0.010 4.1627 0.0004 NOTE: The device contents disclosed are approximated and are based on engineering estimates. 3rd Party Analysis Results (PPM) Device MATERIAL Pb Hg Cr+6 Cd PBB Mold Compound Leadframe Silicon Die Die Attach Epoxy Gold Wire Solder Plating <2 <50 <2 <2 <2 <50 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <2 <5 <5 <5 <5 <5 <5 PBDE <5 <5 <5 <5 <5 <5 ROHS MATERIAL COMPOSITION DECLARATION EU RoHS Directive 2002/95/EC Declaration Statement: Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE); and Quantity limit of 0.01% (100 PPM) for Cadmium and Pb China RoHS Directive <1000ppm O Hg <1000ppm O Cr+6 <1000ppm O Cd <100ppm O PBB <1000ppm O SJ/T11363-2006 O: Indicates that this toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement in SJ/T11363-2006. X: Indicates that this toxic or hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006. PBDE <1000ppm O