Material Declaration Report

Material Declaration Report
Package Type: BQSOP 48L
Component Weight (mg): 160.6670
Pericom Package Code: B48(Pb-free)
MSL Rating: 1
Termination Plating: Matte Tin
RoHS Compliance: Yes
Peak Body Temp (C): 260
JESD 97 Pb-free Category: e3
Applicable Exemption: N/A
Max Time (sec): 30
Plating Thickness (um): 10~20
Reflow Cycles: 3
Tin Whisker Mitigation: Anneal, 150C/1hr
Rev Date: 11/5/2009
Homogeneous Material Declaration
MATERIAL
ITEM
MATERIAL
WEIGHT(mg)
MOLD COMPOUND
ASSEMBLY
SUBCON
101.3111
OSE
SPEL
LEADFRAME
51.4257
SILICON DIE
2.7637
DIE ATTACH EPOXY
0.2601
OSE
SPEL
MATERIAL
COMPOSITION
Silica Fused
Epoxy Resin 1
Phenolic Resin
Epoxy Resin 2
Aromatic Phosphate
Carbon Black
CAS NO.
COMPOSITION
%
90.800
3.000
3.000
2.000
1.000
0.200
COMPOSITION
WEIGHT(mg)
91.9905
3.0393
3.0393
2.0262
1.0131
0.2026
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
Silica Fused
Epoxy Resin
Phenolic Resin
Epoxy, Cresol Novolac
Carbon Black
60676-86-0
Proprietary
Proprietary
29690-82-2
1333-86-4
88.000
5.000
4.500
2.000
0.500
89.1538
5.0656
4.5590
2.0262
0.5066
Copper
Iron
Silver
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-22-4
7440-66-6
7723-14-0
97.021
2.350
0.453
0.111
0.065
49.8936
1.2085
0.2331
0.0570
0.0334
Silicon (Si)
Non-hazardous Metal
7440-21-3
Proprietary
99.192
0.808
2.7414
0.0223
Silver
Acrylic Resin
Acrylate
Polybutadiene derivative
Epoxy resin
Additive
Butadiene copolymer
Peroxide
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
76.000
8.000
5.500
5.500
2.500
1.000
1.000
0.500
0.1977
0.0208
0.0143
0.0143
0.0065
0.0026
0.0026
0.0013
Silver
Epoxy Resin
Diluent
Hardener
Dicyandamide
7440-22-4
9003-36-5
26447-14-3
620-92-8
461-58-5
80.000
10.000
6.000
3.250
0.750
0.2081
0.0260
0.0156
0.0085
0.0020
GOLD WIRE
0.7432
Gold(Au)
Impurities
7440-57-5
-
99.990
0.010
0.7431
0.0001
SOLDER PLATING
4.1631
Tin (Sn)
Impurity
7440-31-5
-
99.990
0.010
4.1627
0.0004
NOTE: The device contents disclosed are approximated and are based on engineering estimates.
3rd Party Analysis Results (PPM)
Device
MATERIAL
Pb
Hg
Cr+6
Cd
PBB
Mold Compound
Leadframe
Silicon Die
Die Attach Epoxy
Gold Wire
Solder Plating
<2
<50
<2
<2
<2
<50
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<2
<5
<5
<5
<5
<5
<5
PBDE
<5
<5
<5
<5
<5
<5
ROHS MATERIAL COMPOSITION DECLARATION
EU RoHS
Directive
2002/95/EC
Declaration
Statement:
Quantity limit of 0.1% (1000 PPM) by mass in homogeneous material for: Lead (Pb), Mercury,
Hexavalent Chromium(Cr+6), Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE);
and Quantity limit of 0.01% (100 PPM) for Cadmium
and
Pb
China RoHS
Directive
<1000ppm
O
Hg
<1000ppm
O
Cr+6
<1000ppm
O
Cd
<100ppm
O
PBB
<1000ppm
O
SJ/T11363-2006
O: Indicates that this toxic or hazardous substance contained in all of the homogeneous
materials for this part is below the limit requirement in SJ/T11363-2006.
X: Indicates that this toxic or hazardous substance contained in at least one of the
homogeneous materials used for this part is above the limit requirement in SJ/T11363-2006.
PBDE
<1000ppm
O