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Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
Ball Size (mm)
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
CSP BGA
6X6
76
SnAgCu
0.30
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
2.67 E-02
1.86 E-03
1.86 E-03
4.65 E-04
9.31 E-05
3.10 E-02
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
38.07
2.65
2.65
0.66
0.13
44.16
PPM
380697
26499
26499
6625
1325
441644
Laminate
Component Level
Homogeneous Material Level
Substance
Description
Composite
Other inorganic materials
Thermoset
Thermoset
Thermoset
Organic materials
Other inorganic materials
Other inorganic materials
Other inorganic materials
Organic materials
Others
Organic materials
Organic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
CAS#
Glass Cloth
Inorganic Filler
Epoxy
Flame Resistant Epoxy Resin
Heat Resistant Resin
Laminate Core Subtotal
Resin
Talc
Silica
Barium Sulfate
Organic filler
Additives
Organic pigment
Phthalocyanine blue
Soldermask Subtotal
Copper
Nickel
Gold
65997-17-3
Proprietary
7328-97-4
Proprietary
Proprietary
Substance
CAS#
Weight (g)
4.03 E-03
1.25 E-03
6.63 E-04
5.88 E-04
5.88 E-04
7.12 E-03
2.47 E-03
3.69 E-04
3.69 E-04
3.69 E-04
3.69 E-04
5.17 E-05
6.74 E-06
6.74 E-06
4.02 E-03
1.03 E-02
9.12 E-04
1.08 E-04
2.25 E-02
Proprietary
14807-96-6
7631-86-9
7727-43-7
Proprietary
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
17.92
5.57
2.95
2.62
2.62
31.68
11.01
1.65
1.65
1.65
1.64
0.23
0.03
0.03
17.88
45.90
4.06
0.48
100.00
179200
55700
29500
26200
26200
316800
110120
16450
16450
16450
16430
2300
300
300
178800
459000
40600
4800
1000000
5.73
1.78
0.94
0.84
0.84
10.13
3.52
0.53
0.53
0.53
0.53
0.07
0.01
0.01
5.72
14.67
1.30
0.15
31.97
PPM
57287
17806
9431
8376
8376
101275
35203
5259
5259
5259
5252
735
96
96
57159
146734
12979
1534
319682
Solder Ball
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
Copper
Component Level
Weight (g)
7440-31-5
7440-22-4
7440-50-8
7.33 E-03
2.28 E-04
3 80 E
3.80
E-05
05
7.59 E-03
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0 50
0.50
100
965000
30000
5000
1000000
10.43
0.32
0 05
0.05
10.80
PPM
104260
3241
540
108041
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
4.91 E-04
4.96 E-06
4.96 E-04
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
0.70
0.01
0.71
PPM
6987
71
7058
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
Component Level
Weight (g)
CAS#
7440-21-3
8.08 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
11.49
PPM
114942
Die Attach
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Subtotal
Substance
Silicon dioxide
Bismaleimide monomer
Acrylate monomer
Epoxy resin
Acryric resin
CAS#
Weight (g)
60676-86-0
TS #10049
TS #10050
TS #10042
TS #10051
2.93 E-04
1.90 E-04
5.17 E-05
5.17 E-05
2.07 E-05
6.07 E-04
Weight (g)
7.03 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
48.30
31.25
8.52
8.52
3.41
100.00
483000
312500
85200
85200
34100
1000000
0.42
0.27
0.07
0.07
0.03
0.86
Percentage (%)
100.00
PPM
4170
2698
736
736
294
8633
PPM
1000000