Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish Ball Size (mm) RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant CSP BGA 6X6 76 SnAgCu 0.30 Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 2.67 E-02 1.86 E-03 1.86 E-03 4.65 E-04 9.31 E-05 3.10 E-02 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 38.07 2.65 2.65 0.66 0.13 44.16 PPM 380697 26499 26499 6625 1325 441644 Laminate Component Level Homogeneous Material Level Substance Description Composite Other inorganic materials Thermoset Thermoset Thermoset Organic materials Other inorganic materials Other inorganic materials Other inorganic materials Organic materials Others Organic materials Organic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal CAS# Glass Cloth Inorganic Filler Epoxy Flame Resistant Epoxy Resin Heat Resistant Resin Laminate Core Subtotal Resin Talc Silica Barium Sulfate Organic filler Additives Organic pigment Phthalocyanine blue Soldermask Subtotal Copper Nickel Gold 65997-17-3 Proprietary 7328-97-4 Proprietary Proprietary Substance CAS# Weight (g) 4.03 E-03 1.25 E-03 6.63 E-04 5.88 E-04 5.88 E-04 7.12 E-03 2.47 E-03 3.69 E-04 3.69 E-04 3.69 E-04 3.69 E-04 5.17 E-05 6.74 E-06 6.74 E-06 4.02 E-03 1.03 E-02 9.12 E-04 1.08 E-04 2.25 E-02 Proprietary 14807-96-6 7631-86-9 7727-43-7 Proprietary Proprietary Proprietary Proprietary 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 17.92 5.57 2.95 2.62 2.62 31.68 11.01 1.65 1.65 1.65 1.64 0.23 0.03 0.03 17.88 45.90 4.06 0.48 100.00 179200 55700 29500 26200 26200 316800 110120 16450 16450 16450 16430 2300 300 300 178800 459000 40600 4800 1000000 5.73 1.78 0.94 0.84 0.84 10.13 3.52 0.53 0.53 0.53 0.53 0.07 0.01 0.01 5.72 14.67 1.30 0.15 31.97 PPM 57287 17806 9431 8376 8376 101275 35203 5259 5259 5259 5252 735 96 96 57159 146734 12979 1534 319682 Solder Ball Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Tin Silver Copper Component Level Weight (g) 7440-31-5 7440-22-4 7440-50-8 7.33 E-03 2.28 E-04 3 80 E 3.80 E-05 05 7.59 E-03 Percentage (%) PPM Percentage (%) 96.50 3.00 0 50 0.50 100 965000 30000 5000 1000000 10.43 0.32 0 05 0.05 10.80 PPM 104260 3241 540 108041 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 4.91 E-04 4.96 E-06 4.96 E-04 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 0.70 0.01 0.71 PPM 6987 71 7058 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon Component Level Weight (g) CAS# 7440-21-3 8.08 E-03 Percentage (%) PPM Percentage (%) 100 1000000 11.49 PPM 114942 Die Attach Component Level Homogeneous Material Level Description Other inorganic materials Other organic materials Other organic materials Thermoset Other organic materials Subtotal Substance Silicon dioxide Bismaleimide monomer Acrylate monomer Epoxy resin Acryric resin CAS# Weight (g) 60676-86-0 TS #10049 TS #10050 TS #10042 TS #10051 2.93 E-04 1.90 E-04 5.17 E-05 5.17 E-05 2.07 E-05 6.07 E-04 Weight (g) 7.03 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 48.30 31.25 8.52 8.52 3.41 100.00 483000 312500 85200 85200 34100 1000000 0.42 0.27 0.07 0.07 0.03 0.86 Percentage (%) 100.00 PPM 4170 2698 736 736 294 8633 PPM 1000000