Product / Package Information Environmental Compliance Information Package Body Size LeadCount Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant PSOP_2 300 mil 20 100 Sn Yes Yes Yes Level A and B Compliant Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black CAS# Weight (g) 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-3 2.56 E-01 1.46 E-02 1.46 E-02 5.84 E-03 8.76 E-04 2.92 E-01 CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 9.81 E-02 2.29 E-03 1.27 E-04 2.44 E-05 1.01 E-01 CAS# Weight (g) 7440-22-4 1.23 E-03 Homogeneous Material Level Percentage (%) PPM 87.7 877000 5.0 50000 5.0 50000 2.0 20000 0.3 3000 100 1000000 Percentage (%) 63.68 3.63 3.63 1.45 0.22 72.61 Component Level Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Percentage (%) 24.40 0.57 0.03 0.01 25.01 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Percentage (%) 0.31 PPM 636757 36303 36303 14521 2178 726063 Leadframe Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus Component Level PPM 243987 5699 316 61 250062 Internal Leadframe Plating Description Precious metals Substance Silver Component Level PPM 3068 External Leadframe Plating Description Tin & its alloys Substance Tin CAS# Weight (g) 7440-31-5 3.70 E-03 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) 0.92 PPM 9187 Bond Wires Substance Description Precious metals Gold CAS# Weight (g) 7440-57-5 1.04 E-03 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) 0.26 PPM 2586 Chip Substance Description Other inorganic materials Doped Silicon CAS# Weight (g) 7440-21-3 2.77 E-03 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) 0.69 PPM 6892 Die Attach Description Precious metals Thermoset Other inorganic materials Others Other organic materials Subtotal Substance Silver Epoxy Resin Metal oxide Curing and hardening agen Gamma Butyrolactone CAS# Weight (g) 7440-22-4 Proprietary Proprietary Proprietary 96-48-0 6.33 E-04 1.58 E-04 2.37 E-05 2.37 E-05 2.37 E-05 8.62 E-04 Weight (g) 4.02 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledg ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liabili any inaccuracy of such information ADI Proprietary Homogeneous Material Level Percentage (%) PPM 73.40 734000 18.35 183500 2.75 27500 2.75 27500 2.75 27500 100.00 1000000 Component Level Percentage (%) 0.16 0.04 0.01 0.01 0.01 0.21 PPM Percentage (%) 100.00 PPM 1573 393 59 59 59 2143 1000000