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Product / Package Information
Environmental Compliance Information
Package
Body Size
LeadCount
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliant
PSOP_2
300 mil
20
100 Sn
Yes
Yes
Yes
Level A and B Compliant
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Epoxy Cresol Novolac
Carbon Black
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
29690-82-2
1333-86-3
2.56 E-01
1.46 E-02
1.46 E-02
5.84 E-03
8.76 E-04
2.92 E-01
CAS#
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
9.81 E-02
2.29 E-03
1.27 E-04
2.44 E-05
1.01 E-01
CAS#
Weight (g)
7440-22-4
1.23 E-03
Homogeneous Material Level
Percentage (%)
PPM
87.7
877000
5.0
50000
5.0
50000
2.0
20000
0.3
3000
100
1000000
Percentage (%)
63.68
3.63
3.63
1.45
0.22
72.61
Component Level
Homogeneous Material Level
Percentage (%)
PPM
97.57
975706
2.28
22789
0.13
1263
0.02
242
100.00
1000000
Percentage (%)
24.40
0.57
0.03
0.01
25.01
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Percentage (%)
0.31
PPM
636757
36303
36303
14521
2178
726063
Leadframe
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
Component Level
PPM
243987
5699
316
61
250062
Internal Leadframe Plating
Description
Precious metals
Substance
Silver
Component Level
PPM
3068
External Leadframe Plating
Description
Tin & its alloys
Substance
Tin
CAS#
Weight (g)
7440-31-5
3.70 E-03
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
0.92
PPM
9187
Bond Wires
Substance
Description
Precious metals
Gold
CAS#
Weight (g)
7440-57-5
1.04 E-03
Homogeneous Material Level
Percentage (%)
PPM
99.99
1000000
Component Level
Percentage (%)
0.26
PPM
2586
Chip
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
Weight (g)
7440-21-3
2.77 E-03
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
0.69
PPM
6892
Die Attach
Description
Precious metals
Thermoset
Other inorganic materials
Others
Other organic materials
Subtotal
Substance
Silver
Epoxy Resin
Metal oxide
Curing and hardening agen
Gamma Butyrolactone
CAS#
Weight (g)
7440-22-4
Proprietary
Proprietary
Proprietary
96-48-0
6.33 E-04
1.58 E-04
2.37 E-05
2.37 E-05
2.37 E-05
8.62 E-04
Weight (g)
4.02 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledg
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liabili
any inaccuracy of such information
ADI Proprietary
Homogeneous Material Level
Percentage (%)
PPM
73.40
734000
18.35
183500
2.75
27500
2.75
27500
2.75
27500
100.00
1000000
Component Level
Percentage (%)
0.16
0.04
0.01
0.01
0.01
0.21
PPM
Percentage (%)
100.00
PPM
1573
393
59
59
59
2143
1000000