Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 5 X 5 X 0.75 (3.3 EP) 28 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 3.53E-02 2.45E-03 2.45E-03 6.14E-04 1.23E-04 4.09 E-02 Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 38.41 2.67 2.67 0.67 0.13 44.56 PPM 384129 26737 26737 6684 1337 445625 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 4.34 E-02 1.05 E-03 5.34 E-05 1.34 E-05 4.45 E-02 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 47.27 1.14 0.06 0.01 48.48 PPM 472727 11394 582 145 484848 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 1.11 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.12 PPM 1212 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 2.10 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.29 PPM 22880 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Weight (g) 3.20 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.35 PPM 3487 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 3.30 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 3.60 PPM 35955 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Others Other organic materials Other organic materials Others Others Subtotal Package Totals Substance Silver Epoxy resin A Anhydride 2,6-Diglycidyl phenyl allyl ether oligomer Epoxy resin B Epoxy resin modifier Anhydride CAS# 7440-22-4 TS ref# 10013 TS ref# 10181 Unassigned TS ref# 10237 TS ref# 10038 TS ref# 10180 Component Level Weight (g) 4.04 E-04 4.04 E-05 4.04 E-05 1.62 E-05 1.62 E-05 1.62 E-05 1.62 E-05 5.50 E-04 Weight (g) 9.18 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 73.54 7.35 7.35 2.94 2.94 2.94 2.94 100.0 735400 73500 73500 29400 29400 29400 29400 1000000 0.44 0.04 0.04 0.02 0.02 0.02 0.02 0.60 Percentage (%) 100 PPM 4407 440 440 176 176 176 176 5993 PPM 1000000