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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
5 X 5 X 0.75 (3.3 EP)
28
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
3.53E-02
2.45E-03
2.45E-03
6.14E-04
1.23E-04
4.09 E-02
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.00
862000
60000
60000
15000
3000
1000000
38.41
2.67
2.67
0.67
0.13
44.56
PPM
384129
26737
26737
6684
1337
445625
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
4.34 E-02
1.05 E-03
5.34 E-05
1.34 E-05
4.45 E-02
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
47.27
1.14
0.06
0.01
48.48
PPM
472727
11394
582
145
484848
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
1.11 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.12
PPM
1212
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
2.10 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.29
PPM
22880
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Weight (g)
3.20 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.35
PPM
3487
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
3.30 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.60
PPM
35955
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Others
Other organic materials
Other organic materials
Others
Others
Subtotal
Package Totals
Substance
Silver
Epoxy resin A
Anhydride
2,6-Diglycidyl phenyl allyl ether oligomer
Epoxy resin B
Epoxy resin modifier
Anhydride
CAS#
7440-22-4
TS ref# 10013
TS ref# 10181
Unassigned
TS ref# 10237
TS ref# 10038
TS ref# 10180
Component Level
Weight (g)
4.04 E-04
4.04 E-05
4.04 E-05
1.62 E-05
1.62 E-05
1.62 E-05
1.62 E-05
5.50 E-04
Weight (g)
9.18 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
73.54
7.35
7.35
2.94
2.94
2.94
2.94
100.0
735400
73500
73500
29400
29400
29400
29400
1000000
0.44
0.04
0.04
0.02
0.02
0.02
0.02
0.60
Percentage (%)
100
PPM
4407
440
440
176
176
176
176
5993
PPM
1000000