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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
3.5 X 3.5 X 0.75 (2.2 EP)
24
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
1.68E-02
1.17E-03
1.17E-03
2.92E-04
5.84E-05
1.95 E-02
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.00
862000
60000
60000
15000
3000
1000000
37.06
2.58
2.58
0.64
0.13
42.99
PPM
370576
25794
25794
6449
1290
429902
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
1.42 E-02
3.42 E-04
1.75 E-05
4.37 E-06
1.46 E-02
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
31.39
0.76
0.04
0.01
32.20
PPM
313920
7566
386
97
321969
Internal Leadframe Plating
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Component Level
Weight (g)
1.46 E-05
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.03
PPM
322
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Component Level
Weight (g)
8.58 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.89
PPM
18944
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Weight (g)
1.82 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.40
PPM
4019
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
7.54 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
16.65
PPM
166463
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
Component Level
Weight (g)
2.05 E-03
8.22 E-05
8.22 E-05
8.22 E-05
8.22 E-05
8.22 E-05
8.22 E-05
8.22 E-05
1.37 E-05
2.64 E-03
Weight (g)
4.53 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.0
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
4.54
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.03
5.84
Percentage (%)
100
PPM
45368
1816
1816
1816
1816
1816
1816
1816
304
58381
PPM
1000000