Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 3.5 X 3.5 X 0.75 (2.2 EP) 24 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 1.68E-02 1.17E-03 1.17E-03 2.92E-04 5.84E-05 1.95 E-02 Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 37.06 2.58 2.58 0.64 0.13 42.99 PPM 370576 25794 25794 6449 1290 429902 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 1.42 E-02 3.42 E-04 1.75 E-05 4.37 E-06 1.46 E-02 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 31.39 0.76 0.04 0.01 32.20 PPM 313920 7566 386 97 321969 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 1.46 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.03 PPM 322 External Leadframe Plating Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Component Level Weight (g) 8.58 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 1.89 PPM 18944 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Weight (g) 1.82 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.40 PPM 4019 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 7.54 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 16.65 PPM 166463 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 2.05 E-03 8.22 E-05 8.22 E-05 8.22 E-05 8.22 E-05 8.22 E-05 8.22 E-05 8.22 E-05 1.37 E-05 2.64 E-03 Weight (g) 4.53 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 4.54 0.18 0.18 0.18 0.18 0.18 0.18 0.18 0.03 5.84 Percentage (%) 100 PPM 45368 1816 1816 1816 1816 1816 1816 1816 304 58381 PPM 1000000