Materials Declaration Package Body Size Ball Count Option LGA 3X3 16 e4 with exemption Substance Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black Subtotal Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 100.0 Molding Compound Weight (g) 1.23 E-02 8.58 E-04 8.58 E-04 2.15 E-04 4.29 E-05 1.43 E-02 PPM 500333 34826 34826 8706 1741 580432 Weight (g) PPM Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. Laminate Substance Continuous filament Fiber Glass Copper Bismaleimide/Triazine Epoxy Resin Epoxy Resin (may contain Chlorine) Epoxy Resin (may contain Bromine) % of Laminate 0.014 0.003 38.8 2.66 E-07 5.70 E-08 1.90 E-03 11 2 77120 0.040 0.028 18.4 22.4 18.4 2.0 100.0 3.60 E-07 2.52 E-07 9.00 E-04 1.10 E-03 9.00 E-04 1.00 E-04 4.90 E-03 15 10 36531 44649 36531 4059 198889 % of Wire 99.0 1.0 100.0 Weight (g) 6.43 E-05 6.50 E-07 6.50 E-05 PPM % of Chip 100 Weight (g) 2.24 E-03 PPM 91056 % of Die Attach 51 49 100 Weight (g) 9.69 E-04 9.31 E-04 1.90 E-03 PPM 39331 37789 77120 % of Seal Glass 63.0 25.0 9.0 3.0 100.0 Weight (g) 7.74 E-04 3.07 E-04 1.11 E-04 3.69 E-05 1.23 E-03 PPM 31415 12466 4488 1496 49864 Laminate Core Subtotal Inorganic Filler Diethylene Glycol Ethyl Ether Acetate Dipropylene Glycol Methyl Ether Heavy Aromatic Naphtha (petroleum) May contain Chlorine May contain Bromine Soldermask Subtotal Copper Nickel Gold Subtotal Bond Wires Substance Gold Palladium Subtotal 2611 26 2637 Chip Substance Doped Silicon Die Attach Substance Silver Resin Subtotal Seal Glass Substance Lead borosilicate glass Trimethyl pentanediol monoisobutyrate Aluminosilicate glass Terpineol Subtotal Package Totals Weight (g) PPM 1000000 2.46 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Die Attach Paste Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE)