Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LGA 3X5 14 Gold Yes - with exemption Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.12 E-02 7.80 E-04 7.80 E-04 1.95 E-04 3.90 E-05 1.30 E-02 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 36.73 2.56 2.56 0.64 0.13 42.61 PPM 367287 25565 25565 6391 1278 426088 Laminate Homogeneous Material Level Substance Description Glass Copper & its alloys Thermoset Thermoset Other inorganic materials Other organic materials Other organic materials Other organic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Continuous filament Fiber Glass Copper Bismaleimide/Triazine Epoxy Resin Inorganic Filler Laminate Core Subtotal Diethylene Glycol Ethyl Ether Acetate Dipropylene Glycol Methyl Ether Heavy Aromatic Naphtha (petroleum) Soldermask Subtotal Copper Nickel Gold CAS# Component Level Weight (g) Percentage (%) PPM Percentage (%) PPM 2.90 E-03 41.40 414285.7143 9.51 95050 1.40 E-03 1.50 E-03 1.00 E-03 2.00 E-04 7.00 E-03 20.0 21.4 14.3 2.86 100.0 200000 214285.7143 142857.1429 28571.42857 1000000 4.59 4.92 3.28 0.66 23 45886 49164 32776 6555 229432 65997-17-3 Proprietary 13676-54-5 Proprietary Proprietary 112-15-2 34590-94-8 64742-94-5 7440-50-8 7440-02-0 7440-57-5 Seal Glass Component Level Homogeneous Material Level Description Glass Glass Subtotal Substance Lead borosilicate glass Aluminosilicate glass CAS# Weight (g) 65997-17-3 65997-17-3 7.74 E-04 1.11 E-04 8.85 E-04 Percentage (%) PPM Percentage (%) 87.50 12.50 100 875000 125000 1000000 2.54 0.36 2.90 PPM 25367 3624 28991 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 3.29 E-03 3.33 E-05 3.33 E-03 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 10.79 0.11 10.90 PPM 107911 1090 109001 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# Component Level Weight (g) 7440-21-3 4.50 E-03 Percentage (%) PPM Percentage (%) 100 1000000 14.75 PPM 147492 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Subtotal Substance Silver Resin CAS# Component Level Weight (g) 7440-22-4 Proprietary 9.18 E-04 8.82 E-04 1.80 E-03 Weight (g) 3.05 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 51.00 49.00 100.00 510000 490000 1000000 3.01 2.89 5.90 Percentage (%) 100.00 PPM 30088 28908 58997 PPM 1000000