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Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LGA
5X5
13
Gold
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
2.71 E-02
1.89 E-03
1.89 E-03
4.72 E-04
9.44 E-05
3.15 E-02
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
57.95
4.03
4.03
1.01
0.20
67.23
PPM
579511
40337
40337
10084
2017
672287
Laminate
Component Level
Homogeneous Material Level
Description
Glass
Copper & its alloys
Thermoset
Thermoset
Other inorganic materials
Thermoset
Other inorganic materials
Other organic materials
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Other organic materials
Other organic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Substance
Continuous filament Fiber Glass
Copper Foil
Bismaleimide/Triazine
Epoxy Resin
Inorganic Filler
Laminate Core Subtotal
Modified Resin
Barium sulfate
Aromatic Hydrocarbon
Epoxy Resin
Diethylene Glycol Monomethyl Ether Acetate
Acrylic Ester Monomer
Aromatic Carbonyl Compound
Dipropylene Glycol Methyl Ether
Leveling Agents
Organic Filler
Amine Compound
Phthalocyanine Green
Soldermask Subtotal
Copper
Nickel
Gold
CAS#
Weight (g)
2.50 E-03
1.67 E-03
1.00 E-03
5.01 E-04
1.00 E-03
6.67 E-03
5.46 E-04
5.57 E-04
3.07 E-04
2.87 E-04
1.97 E-04
8.44 E-05
5.40 E-05
5.17 E-05
3.49 E-05
2.81 E-05
9.00 E-06
4.50 E-06
2.16 E-03
2.09 E-03
2.90 E-04
3.49 E-05
1.12 E-02
65997-17-3
7440-50-8
13676-54-5
Proprietary
Proprietary
85954-11-6
7727-43-7
Proprietary
85954-11-6
112-15-2
Proprietary
Proprietary
34590-94-8
Proprietary
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
22.23
14.87
8.89
4.45
8.89
59.33
4.85
4.95
2.73
2.55
1.75
0.75
0.48
0.46
0.31
0.25
0.08
0.04
19.20
18.58
2.58
0.31
100.00
79432
53133
31766
15901
31766
211998
17330
17687
9755
9112
6253
2680
1715
1644
1108
893
286
143
68605
185800
25800
3100
495303
5.34
3.57
2.14
1.07
2.14
14.25
1.17
1.19
0.66
0.61
0.42
0.18
0.12
0.11
0.07
0.06
0.02
0.01
4.61
4.46
0.62
0.07
24
PPM
53401
35721
21356
10690
21356
142523
11651
11891
6558
6126
4204
1802
1153
1105
745
601
192
96
46122
44633
6198
745
240221
Bond Wires
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
1.86 E-04
1.88 E-06
1.88 E-04
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
0.40
0.00
0.40
PPM
3974
40
4014
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
Component Level
Weight (g)
CAS#
7440-21-3
3.65 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
7.79
PPM
77946
Die Attach
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Subtotal
Substance
Silicon dioxide
Bismaleimide monomer
Acrylate monomer
Epoxy resin
Acryric resin
CAS#
Weight (g)
60676-86-0
TS #10049
TS #10050
TS #10042
TS #10051
1.25 E-04
8.09 E-05
2.21 E-05
2.21 E-05
8.83 E-06
2.59 E-04
Weight (g)
4.68 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
48.30
31.25
8.52
8.52
3.41
100.00
483000
312500
85200
85200
34100
1000000
0.27
0.17
0.05
0.05
0.02
0.55
Percentage (%)
100.00
PPM
2672
1729
471
471
189
5532
PPM
1000000