Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LGA 5X5 13 Gold Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 2.71 E-02 1.89 E-03 1.89 E-03 4.72 E-04 9.44 E-05 3.15 E-02 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 57.95 4.03 4.03 1.01 0.20 67.23 PPM 579511 40337 40337 10084 2017 672287 Laminate Component Level Homogeneous Material Level Description Glass Copper & its alloys Thermoset Thermoset Other inorganic materials Thermoset Other inorganic materials Other organic materials Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Others Other organic materials Other organic materials Other organic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Substance Continuous filament Fiber Glass Copper Foil Bismaleimide/Triazine Epoxy Resin Inorganic Filler Laminate Core Subtotal Modified Resin Barium sulfate Aromatic Hydrocarbon Epoxy Resin Diethylene Glycol Monomethyl Ether Acetate Acrylic Ester Monomer Aromatic Carbonyl Compound Dipropylene Glycol Methyl Ether Leveling Agents Organic Filler Amine Compound Phthalocyanine Green Soldermask Subtotal Copper Nickel Gold CAS# Weight (g) 2.50 E-03 1.67 E-03 1.00 E-03 5.01 E-04 1.00 E-03 6.67 E-03 5.46 E-04 5.57 E-04 3.07 E-04 2.87 E-04 1.97 E-04 8.44 E-05 5.40 E-05 5.17 E-05 3.49 E-05 2.81 E-05 9.00 E-06 4.50 E-06 2.16 E-03 2.09 E-03 2.90 E-04 3.49 E-05 1.12 E-02 65997-17-3 7440-50-8 13676-54-5 Proprietary Proprietary 85954-11-6 7727-43-7 Proprietary 85954-11-6 112-15-2 Proprietary Proprietary 34590-94-8 Proprietary Proprietary Proprietary Proprietary 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 22.23 14.87 8.89 4.45 8.89 59.33 4.85 4.95 2.73 2.55 1.75 0.75 0.48 0.46 0.31 0.25 0.08 0.04 19.20 18.58 2.58 0.31 100.00 79432 53133 31766 15901 31766 211998 17330 17687 9755 9112 6253 2680 1715 1644 1108 893 286 143 68605 185800 25800 3100 495303 5.34 3.57 2.14 1.07 2.14 14.25 1.17 1.19 0.66 0.61 0.42 0.18 0.12 0.11 0.07 0.06 0.02 0.01 4.61 4.46 0.62 0.07 24 PPM 53401 35721 21356 10690 21356 142523 11651 11891 6558 6126 4204 1802 1153 1105 745 601 192 96 46122 44633 6198 745 240221 Bond Wires Homogeneous Material Level Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 1.86 E-04 1.88 E-06 1.88 E-04 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 0.40 0.00 0.40 PPM 3974 40 4014 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon Component Level Weight (g) CAS# 7440-21-3 3.65 E-03 Percentage (%) PPM Percentage (%) 100 1000000 7.79 PPM 77946 Die Attach Component Level Homogeneous Material Level Description Other inorganic materials Other organic materials Other organic materials Thermoset Other organic materials Subtotal Substance Silicon dioxide Bismaleimide monomer Acrylate monomer Epoxy resin Acryric resin CAS# Weight (g) 60676-86-0 TS #10049 TS #10050 TS #10042 TS #10051 1.25 E-04 8.09 E-05 2.21 E-05 2.21 E-05 8.83 E-06 2.59 E-04 Weight (g) 4.68 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 48.30 31.25 8.52 8.52 3.41 100.00 483000 312500 85200 85200 34100 1000000 0.27 0.17 0.05 0.05 0.02 0.55 Percentage (%) 100.00 PPM 2672 1729 471 471 189 5532 PPM 1000000