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Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
Ball Size (mm)
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
CSP BGA
6X6
112
SnAgCu
0.30
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Component Level
Weight (g)
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
2.85 E-02
1.98 E-03
1.98 E-03
4.95 E-04
9.90 E-05
3.30 E-02
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
34.90
2.43
2.43
0.61
0.12
40.49
PPM
349002
24292
24292
6073
1215
404875
Laminate
Homogeneous Material Level
Substance
Description
Copper & its alloys
Composite
Thermoset
Thermoset
Thermoset
Other inorganic materials
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Copper Foil
Glass Cloth
Epoxy resin
Bismaleimide
Triazine
Inorganic filler
CAS#
3.86 E-03
3.88 E-03
7.71 E-04
7.71 E-04
7.71 E-04
1.55 E-03
1.16 E-02
3.62 E-04
3.06 E-04
1.98 E-04
1.86 E-04
1.31 E-04
8.04 E-05
5.28 E-05
3.52 E-05
2.76 E-05
2.51 E-05
1.26 E-05
5.02 E-06
1.06 E-03
1.17 E-02
6.03 E-05
3.22 E-04
2.51 E-02
7440-50-8
65997-17-3
7238-97-4
13676-54-5
25722-66-1
Proprietary
Laminate Core Subtotal
Barium Sulfate
Modified resin
Aromatic hydrocarbon
Epoxy resin
Diethylene Glycol Monomethyl Ether Acetate
Aromatic Carbonyl Compound
Acrylic ester monomer
Dipropylene gylcol monomethyl ether
Amine Compound
Levelling Agents & Others
Organic Filler
Phthalocyanine Green
Soldermask Subtotal
Copper
Nickel
Gold
Component Level
Weight (g)
7727-43-7
Proprietary
Proprietary
85954-11-6
112-15-2
Proprietary
Proprietary
34590-94-8
Proprietary
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
15.37
15.45
3.07
3.07
3.07
6.18
46.21
1.44
1.22
0.79
0.74
0.52
0.32
0.21
0.14
0.11
0.10
0.05
0.02
5.66
46.61
0.24
1.28
100.00
153700
154500
30700
30700
30700
61800
462100
14400
12200
7900
7400
5200
3200
2100
1400
1100
1000
500
200
56600
466100
2400
12800
1000000
4.74
4.76
0.95
0.95
0.95
1.90
14.24
0.44
0.38
0.24
0.23
0.16
0.10
0.06
0.04
0.03
0.03
0.02
0.01
1.74
14.36
0.07
0.39
30.81
PPM
47360
47606
9460
9460
9460
19043
142388
4437
3759
2434
2280
1602
986
647
431
339
308
154
62
17440
143620
740
3944
308132
Solder Ball
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
Copper
Weight (g)
CAS#
7440-31-5
7440-22-4
7440-50-8
1.13 E-02
3.52 E-04
5.86 E-05
1.17 E-02
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
13.87
0.43
0.07
14.37
PPM
138693
4312
719
143724
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
1.16 E-03
1.17 E-05
1.17 E-03
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
1.42
0.014
1.44
PPM
14207
144
14351
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
Component Level
Weight (g)
CAS#
7440-21-3
9.42 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
11.55
PPM
115502
Die Attach
Component Level
Homogeneous Material Level
Description
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Subtotal
Substance
Acrylic copolymer
Epoxy Resin
Phenol Resin
Silicon Dioxide
CAS#
Weight (g)
Proprietary
Proprietary
Proprietary
Proprietary
7.26 E-04
1.56 E-04
1.56 E-04
5.70 E-05
1.09 E-03
Weight (g)
8.15 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
66.35
14.22
14.22
5.21
100.00
663500
142200
142200
52100
1000000
0.89
0.19
0.19
0.07
1.34
Percentage (%)
100.00
PPM
8902
1908
1908
699
13417
PPM
1000000