pdf

Materials Declaration
Package
Body Size (mm)
Ball Count
Option
CSP BGA
12 X 12 X 1.6
160
Pb-free
0.45
Ball Size (mm)
Weight (g)
2.03 E-01
1.41 E-02
1.41 E-02
3.54 E-03
7.07 E-04
2.36 E-01
PPM
389183
27089
27089
6772
1354
451488
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Weight (g)
3.32 E-02
2.07 E-02
PPM
63568
39743
30.70
0.90
0.80
0.46
0.34
0.32
0.26
0.13
0.09
0.09
0.05
0.03
0.01
0.01
0.01
0.001
5.39 E-02
1.58 E-03
1.41 E-03
8.08 E-04
5.97 E-04
5.62 E-04
4.57 E-04
2.28 E-04
1.58 E-04
1.58 E-04
8.78 E-05
5.27 E-05
1.76 E-05
1.76 E-05
1.58 E-05
1.76 E-06
103311
3029
2692
1548
1144
1077
875
437
303
303
168
101
34
34
30
3
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
3.5
18.90
45.60
1.10
0.20
100.00
6.15 E-03
3.32 E-02
8.01 E-02
1.93 E-03
3.51 E-04
1.76 E-01
11778
63602
153452
3702
673
336518
Solder Ball
% of Solder Ball
96.50
3.00
0.50
100
Weight (g)
9.01 E-02
2.80 E-03
4.67 E-04
9.34 E-02
PPM
172608
5366
894
178869
Substance
Bond Wires
% of Wire
99.99
Weight (g)
9.02 E-04
PPM
1727
Substance
Chip
% of Chip
100.0
Weight (g)
1.47 E-02
PPM
28117
Die Attach
% of Die Attach
66.11
16.53
6.2
6.2
2.48
2.48
100.0
Weight (g)
1.13 E-03
2.83 E-04
1.06 E-04
1.06 E-04
4.25 E-05
4.25 E-05
1.71 E-03
PPM
2170
543
204
204
81
81
3282
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Molding Compound
% of Compound
86.20
6.00
6.00
1.50
0.30
100.0
Substance
Glass Cloth
Core Resin
May contain Chlorine (refer to test reports)
May contain Bromine (refer to test reports)
Laminate Core Subtotal
Soldermask Acrylate Resin
Barium Sulfate
Epoxy Resin
Dipropylene glycol monomethyl ether
Solvent naphta (petroleum), Heavy arom
Diethylene glycol monoethyl ether acetate
Acrylic Ester Monomer
Talc
Morpholine Derivatives
Urethane Resin
Silane Compounds
Triazine derivatives
Pigment Green
Silica
Pigment Yellow
May contain Chlorine (refer to test reports)
May contain Bromine (refer to test reports)
Soldermask Subtotal
Copper Foil
Copper
Nickel
Gold
Subtotal
Substance
Tin
Silver
Copper
Subtotal
Gold
Doped Silicon
Substance
Silver
Polymeric material
Acrylate resin
Diester resin
Functionalized urethane resin
Epoxy resin
Subtotal
Laminate
% of Laminate
18.89
11.81
Package Totals
Weight (g)
PPM
1000000
5.22 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Materials Declaration
Package
Body Size (mm)
Ball Count
Option
CSP BGA
12 X 12 X 1.6
160
with Pb
0.45 mm
Ball Size (mm)
Weight (g)
2.03 E-01
1.41 E-02
1.41 E-02
3.54 E-03
7.07 E-04
2.36 E-01
PPM
389183
27089
27089
6772
1354
451488
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Weight (g)
3.32 E-02
2.07 E-02
PPM
63568
39743
30.70
0.90
0.80
0.46
0.34
0.32
0.26
0.13
0.09
0.09
0.05
0.03
0.01
0.01
0.01
0.001
5.39 E-02
1.58 E-03
1.41 E-03
8.08 E-04
5.97 E-04
5.62 E-04
4.57 E-04
2.28 E-04
1.58 E-04
1.58 E-04
8.78 E-05
5.27 E-05
1.76 E-05
1.76 E-05
1.58 E-05
1.76 E-06
103311
3029
2692
1548
1144
1077
875
437
303
303
168
101
34
34
30
3
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
3.5
18.90
45.60
1.10
0.20
100.00
6.15 E-03
3.32 E-02
8.01 E-02
1.93 E-03
3.51 E-04
1.76 E-01
11778
63602
153452
3702
673
336518
Solder Ball
% of Solder Ball
62.00
36.00
2.00
100.0
Weight (g)
5.79 E-02
3.36 E-02
1.87 E-03
9.34 E-02
PPM
110899
64393
3577
178869
Substance
Bond Wires
% of Wire
99.99
Weight (g)
9.02 E-04
PPM
1727
Substance
Chip
% of Chip
100.0
Weight (g)
1.47 E-02
PPM
28117
Die Attach
% of Die Attach
66.11
16.53
6.2
6.2
2.48
2.48
100.0
Weight (g)
1.13 E-03
2.83 E-04
1.06 E-04
1.06 E-04
4.25 E-05
4.25 E-05
1.71 E-03
PPM
2170
543
204
204
81
81
3282
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Molding Compound
% of Compound
86.20
6.00
6.00
1.50
0.30
100.0
Substance
Glass Cloth
Core Resin
May contain Chlorine (refer to test reports)
May contain Bromine (refer to test reports)
Laminate Core Subtotal
Soldermask Acrylate Resin
Barium Sulfate
Epoxy Resin
Dipropylene glycol monomethyl ether
Solvent naphta (petroleum), Heavy arom
Diethylene glycol monoethyl ether acetate
Acrylic Ester Monomer
Talc
Morpholine Derivatives
Urethane Resin
Silane Compounds
Triazine derivatives
Pigment Green
Silica
Pigment Yellow
May contain Chlorine (refer to test reports)
May contain Bromine (refer to test reports)
Soldermask Subtotal
Copper Foil
Copper
Nickel
Gold
Subtotal
Substance
Tin
Lead
Silver
Subtotal
Gold
Doped Silicon
Substance
Silver
Polymeric material
Acrylate resin
Diester resin
Functionalized urethane resin
Epoxy resin
Subtotal
Laminate
% of Laminate
18.89
11.81
Package Totals
Weight (g)
PPM
1000000
5.22 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary