Materials Declaration Package Body Size (mm) Ball Count Option CSP BGA 12 X 12 X 1.6 160 Pb-free 0.45 Ball Size (mm) Weight (g) 2.03 E-01 1.41 E-02 1.41 E-02 3.54 E-03 7.07 E-04 2.36 E-01 PPM 389183 27089 27089 6772 1354 451488 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Weight (g) 3.32 E-02 2.07 E-02 PPM 63568 39743 30.70 0.90 0.80 0.46 0.34 0.32 0.26 0.13 0.09 0.09 0.05 0.03 0.01 0.01 0.01 0.001 5.39 E-02 1.58 E-03 1.41 E-03 8.08 E-04 5.97 E-04 5.62 E-04 4.57 E-04 2.28 E-04 1.58 E-04 1.58 E-04 8.78 E-05 5.27 E-05 1.76 E-05 1.76 E-05 1.58 E-05 1.76 E-06 103311 3029 2692 1548 1144 1077 875 437 303 303 168 101 34 34 30 3 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. 3.5 18.90 45.60 1.10 0.20 100.00 6.15 E-03 3.32 E-02 8.01 E-02 1.93 E-03 3.51 E-04 1.76 E-01 11778 63602 153452 3702 673 336518 Solder Ball % of Solder Ball 96.50 3.00 0.50 100 Weight (g) 9.01 E-02 2.80 E-03 4.67 E-04 9.34 E-02 PPM 172608 5366 894 178869 Substance Bond Wires % of Wire 99.99 Weight (g) 9.02 E-04 PPM 1727 Substance Chip % of Chip 100.0 Weight (g) 1.47 E-02 PPM 28117 Die Attach % of Die Attach 66.11 16.53 6.2 6.2 2.48 2.48 100.0 Weight (g) 1.13 E-03 2.83 E-04 1.06 E-04 1.06 E-04 4.25 E-05 4.25 E-05 1.71 E-03 PPM 2170 543 204 204 81 81 3282 Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Molding Compound % of Compound 86.20 6.00 6.00 1.50 0.30 100.0 Substance Glass Cloth Core Resin May contain Chlorine (refer to test reports) May contain Bromine (refer to test reports) Laminate Core Subtotal Soldermask Acrylate Resin Barium Sulfate Epoxy Resin Dipropylene glycol monomethyl ether Solvent naphta (petroleum), Heavy arom Diethylene glycol monoethyl ether acetate Acrylic Ester Monomer Talc Morpholine Derivatives Urethane Resin Silane Compounds Triazine derivatives Pigment Green Silica Pigment Yellow May contain Chlorine (refer to test reports) May contain Bromine (refer to test reports) Soldermask Subtotal Copper Foil Copper Nickel Gold Subtotal Substance Tin Silver Copper Subtotal Gold Doped Silicon Substance Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin Subtotal Laminate % of Laminate 18.89 11.81 Package Totals Weight (g) PPM 1000000 5.22 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size (mm) Ball Count Option CSP BGA 12 X 12 X 1.6 160 with Pb 0.45 mm Ball Size (mm) Weight (g) 2.03 E-01 1.41 E-02 1.41 E-02 3.54 E-03 7.07 E-04 2.36 E-01 PPM 389183 27089 27089 6772 1354 451488 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Weight (g) 3.32 E-02 2.07 E-02 PPM 63568 39743 30.70 0.90 0.80 0.46 0.34 0.32 0.26 0.13 0.09 0.09 0.05 0.03 0.01 0.01 0.01 0.001 5.39 E-02 1.58 E-03 1.41 E-03 8.08 E-04 5.97 E-04 5.62 E-04 4.57 E-04 2.28 E-04 1.58 E-04 1.58 E-04 8.78 E-05 5.27 E-05 1.76 E-05 1.76 E-05 1.58 E-05 1.76 E-06 103311 3029 2692 1548 1144 1077 875 437 303 303 168 101 34 34 30 3 Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. 3.5 18.90 45.60 1.10 0.20 100.00 6.15 E-03 3.32 E-02 8.01 E-02 1.93 E-03 3.51 E-04 1.76 E-01 11778 63602 153452 3702 673 336518 Solder Ball % of Solder Ball 62.00 36.00 2.00 100.0 Weight (g) 5.79 E-02 3.36 E-02 1.87 E-03 9.34 E-02 PPM 110899 64393 3577 178869 Substance Bond Wires % of Wire 99.99 Weight (g) 9.02 E-04 PPM 1727 Substance Chip % of Chip 100.0 Weight (g) 1.47 E-02 PPM 28117 Die Attach % of Die Attach 66.11 16.53 6.2 6.2 2.48 2.48 100.0 Weight (g) 1.13 E-03 2.83 E-04 1.06 E-04 1.06 E-04 4.25 E-05 4.25 E-05 1.71 E-03 PPM 2170 543 204 204 81 81 3282 Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Molding Compound % of Compound 86.20 6.00 6.00 1.50 0.30 100.0 Substance Glass Cloth Core Resin May contain Chlorine (refer to test reports) May contain Bromine (refer to test reports) Laminate Core Subtotal Soldermask Acrylate Resin Barium Sulfate Epoxy Resin Dipropylene glycol monomethyl ether Solvent naphta (petroleum), Heavy arom Diethylene glycol monoethyl ether acetate Acrylic Ester Monomer Talc Morpholine Derivatives Urethane Resin Silane Compounds Triazine derivatives Pigment Green Silica Pigment Yellow May contain Chlorine (refer to test reports) May contain Bromine (refer to test reports) Soldermask Subtotal Copper Foil Copper Nickel Gold Subtotal Substance Tin Lead Silver Subtotal Gold Doped Silicon Substance Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin Subtotal Laminate % of Laminate 18.89 11.81 Package Totals Weight (g) PPM 1000000 5.22 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary