Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LGA 3X3 16 Gold Yes - with exemption Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.23 E-02 8.58 E-04 8.58 E-04 2.15 E-04 4.29 E-05 1.43 E-02 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 50.74 3.53 3.53 0.88 0.18 58.87 PPM 507417 35319 35319 8830 1766 588651 Laminate Homogeneous Material Level Substance Description Glass Copper & its alloys Thermoset Thermoset Other inorganic materials Other organic materials Other organic materials Other organic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Continuous filament Fiber Glass Copper Bismaleimide/Triazine Epoxy Resin Inorganic Filler Laminate Core Subtotal Diethylene Glycol Ethyl Ether Acetate Dipropylene Glycol Methyl Ether Heavy Aromatic Naphtha (petroleum) Soldermask Subtotal Copper Nickel Gold CAS# Component Level Weight (g) Percentage (%) PPM Percentage (%) PPM 1.90 E-03 38.80 387755 7.82 78212 9.00 E-04 1.10 E-03 9.00 E-04 1.00 E-04 4.90 E-03 18.4 22.4 18.4 2.00 100.0 183673 224490 183673 20408 1000000 3.70 4.53 3.70 0.41 20 37048 45281 37048 4116 201706 65997-17-3 Proprietary 13676-54-5 Proprietary Proprietary 112-15-2 34590-94-8 64742-94-5 7440-50-8 7440-02-0 7440-57-5 Seal Glass Component Level Homogeneous Material Level Description Glass Glass Subtotal Substance Lead borosilicate glass Aluminosilicate glass CAS# Weight (g) Proprietary Proprietary 7.74 E-04 1.11 E-04 8.85 E-04 Percentage (%) PPM Percentage (%) 87.50 12.50 100 875000 125000 1000000 3.19 0.46 3.64 PPM 31859 4551 36411 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 6.43 E-05 6.50 E-07 6.50 E-05 CAS# Weight (g) Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 0.26 0.00 0.27 PPM 2648 27 2674 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon 7440-21-3 2.24 E-03 Component Level Percentage (%) PPM Percentage (%) 100 1000000 9.23 PPM 92346 Die Attach Homogeneous Material Level Description Other inorganic materials Other organic materials Other organic materials Thermoset Other organic materials Subtotal Substance Silicon dioxide Diester resin Functionalized ester Epoxy resin Polymeric material CAS# Component Level Weight (g) Proprietary Proprietary Proprietary Proprietary Proprietary 7.95 E-04 4.86 E-04 3.53 E-04 1.33 E-04 1.33 E-04 1.90 E-03 Weight (g) 2.43 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 41.86 25.58 18.60 6.98 6.98 100.00 418600 255800 186000 69800 69800 1000000 3.27 2.00 1.45 0.55 0.55 7.82 Percentage (%) 100.00 PPM 32740 20007 14548 5459 5459 78212 PPM 1000000