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Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LGA
3X3
16
Gold
Yes - with exemption
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
1.23 E-02
8.58 E-04
8.58 E-04
2.15 E-04
4.29 E-05
1.43 E-02
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
50.74
3.53
3.53
0.88
0.18
58.87
PPM
507417
35319
35319
8830
1766
588651
Laminate
Homogeneous Material Level
Substance
Description
Glass
Copper & its alloys
Thermoset
Thermoset
Other inorganic materials
Other organic materials
Other organic materials
Other organic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Continuous filament Fiber Glass
Copper
Bismaleimide/Triazine
Epoxy Resin
Inorganic Filler
Laminate Core Subtotal
Diethylene Glycol Ethyl Ether Acetate
Dipropylene Glycol Methyl Ether
Heavy Aromatic Naphtha (petroleum)
Soldermask Subtotal
Copper
Nickel
Gold
CAS#
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
PPM
1.90 E-03
38.80
387755
7.82
78212
9.00 E-04
1.10 E-03
9.00 E-04
1.00 E-04
4.90 E-03
18.4
22.4
18.4
2.00
100.0
183673
224490
183673
20408
1000000
3.70
4.53
3.70
0.41
20
37048
45281
37048
4116
201706
65997-17-3
Proprietary
13676-54-5
Proprietary
Proprietary
112-15-2
34590-94-8
64742-94-5
7440-50-8
7440-02-0
7440-57-5
Seal Glass
Component Level
Homogeneous Material Level
Description
Glass
Glass
Subtotal
Substance
Lead borosilicate glass
Aluminosilicate glass
CAS#
Weight (g)
Proprietary
Proprietary
7.74 E-04
1.11 E-04
8.85 E-04
Percentage (%)
PPM
Percentage (%)
87.50
12.50
100
875000
125000
1000000
3.19
0.46
3.64
PPM
31859
4551
36411
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
6.43 E-05
6.50 E-07
6.50 E-05
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
0.26
0.00
0.27
PPM
2648
27
2674
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
7440-21-3
2.24 E-03
Component Level
Percentage (%)
PPM
Percentage (%)
100
1000000
9.23
PPM
92346
Die Attach
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Subtotal
Substance
Silicon dioxide
Diester resin
Functionalized ester
Epoxy resin
Polymeric material
CAS#
Component Level
Weight (g)
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
7.95 E-04
4.86 E-04
3.53 E-04
1.33 E-04
1.33 E-04
1.90 E-03
Weight (g)
2.43 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
41.86
25.58
18.60
6.98
6.98
100.00
418600
255800
186000
69800
69800
1000000
3.27
2.00
1.45
0.55
0.55
7.82
Percentage (%)
100.00
PPM
32740
20007
14548
5459
5459
78212
PPM
1000000