RTG4 Enabled by Microsemi Power Technology Portfolio

Power Matters.TM
RTG4 Enabled by Microsemi Power
Technology Portfolio
Microsemi Space Forum 2015
Ken O’Neill, Director of Marketing, Space and Aviation
Brian Wilkinson, Sr Director Technical & Strategic Marketing &
Applications
© 2015 Microsemi Corporation. Company Proprietary.
1
RTG4 Overview and Power Requirements
© 2015 Microsemi Corporation. Company Proprietary.
Power Matters.TM
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Agenda
 RTG4 product overview
 RTG4 power requirements
 Microsemi power components and systems
© 2015 Microsemi Corporation. Company Proprietary.
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3
Introducing RTG4 High-Speed RT FPGAs
Logic
Density
150 KLE
TM
20 KLE
9 KLE
2 KLE
RTAX-S / DSP
Command and Control
Medium Speed Processing
High-Speed Signal Processing
• 300 MHz
• 150 KLE
• 5 Mbit SRAM
• 462 Multipliers
• 24 x 3.125 Gb/sec SERDES
• TID > 100 Krad
• SEL immune
RT ProASIC3
RTSX-SU
Frequency of
Operation
RTG4 mitigates risks of ASICs and SRAM FPGAs, and has
20X improvement in signal processing throughput
© 2015 Microsemi Corporation. Company Proprietary.
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Why RTG4 is Compelling
 More flexible than an RH ASIC
• Reprogrammable, no NRE, no cost and schedule risk
 More signal-processing features than any other RT FPGA
• More registers, combinatorial logic, multiply blocks, and transceivers
• Lower power, live at power-up, no external boot memory needed
 Radiation enhanced for Geosynchronous Earth Orbit and deep space
• RTG4 65nm Flash has complete immunity to configuration upsets (SEU)
• Total ionizing dose (TID) and single event effects (SEE) hardened by design
RTG4 offers groundbreaking features for satellite applications
© 2015 Microsemi Corporation. Company Proprietary.
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RTG4 Radiation-Mitigated Architecture
 Total-dose hardening of Flash cells
 Single-event hardening of registers, SRAM, multipliers, PLLs
Comprehensive radiation-mitigated architecture
for signal processing applications
© 2015 Microsemi Corporation. Company Proprietary.
Power Matters.TM
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RTG4 Family Resources
Resources
RT4G075
RT4G150
77,712
151,824
18x18 Multiply-Accumulate Blocks
224
462
RAM Mbits (1.5 Kbit and 24 Kbit Blocks, with ECC)
2.8
5.2
UPROM Kbits
254
381
DDR2/3 SDRAM Controller (with ECC)
2x32
2x32
PCI Express Endpoints
2
2
Globals
24
24
PLLs (Rad Tolerant)
8
8
SpaceWire Clock & Data Recovery Circuits
16
16
User IO (excluding SERDES)
528
720
SERDES lanes (3.125 Gbit/sec)
16
24
Logic Elements (TMR Register + 4-Input C Logic)
Hermetic, Ceramic Column-Grid Packages
CG1432 (Six Sigma Columns)

CG1657 (Six Sigma Columns)


 RT4G150 is the first device, available now in Engineering Samples
 RT4G075 availability TBD
© 2015 Microsemi Corporation. Company Proprietary.
Power Matters.TM
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Power Supplies
Supply
Voltage
Description
VDD
1.2 V
Core supply voltage
VPP
3.3 V
Power supply for device
charge pumps
VDDPLL
3.3 V
Power for eight corner
PLLs, PLLs in SERDES
PCIe/PCS blocks, and
FDDR PLL
VDDIx
1.2 V, 1.5 V, 1.8
V,
2.5 V, or 3.3 V
Bank supplies
VREFx
0.5 * VDDIx
FDDR reference voltage
SERDES_x_Lyz_VDDAI
O
1.2 V
SERDES_x_Lyz_VDDAP
LL
2.5 V
SERDES_VDDI
1.8 V, 2.5 V, or
3.3 V
TX/RX analog I/O
voltage for SERDES
lanes.
Analog power for
SERDES TXPLL and
CDRPLL
Power for SERDES
reference clock receiver
supply.
SERDES_VREF
0.5 *
SERDES_VDDI
© 2015 Microsemi Corporation. Company Proprietary.
External differential
receiver reference
voltage for SERDES
Reference Clocks
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Analog Supplies
SERDES VDDAPLL Supply
2.5V
3.3W
SERDES_x_Lyz_VDDAPLL
33uF
0.1uF
SERDES_x_Lyz_REFRET
1.21KW
1%
SERDES_x_Lyz_REXT
FPGA PLL Supply
3.3V
5W
VDDPLL
22uF
47uF
VSS
 External R-C filters provide
filtering to sensitive analog PLL
supplies.
 SERDES PLL = 2.5V
• SERDES TXPLL and CDRPLL
supply
• SERDES Calibration
resistor(REXT). 1.21KW
– impedance calibration (transmit,
receive, and receiver equalization)
 FPGA PLLs = 3.3V
 Place all passive components
as close to device as possible.
© 2015 Microsemi Corporation. Company Proprietary.
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Power Supply Specifications
 Key power supplies must comply to the specifications
including operating range, POR trip points, and power
supply ramp rates
Symbol
Description
Min
Typ
Max
Units
VDD
Core Supply Voltage
1.14
1.2
1.26
V
VPP
Flash operating voltage
3
3.3
3.45
V
VDDt
VPPt
VDDr
Power ON Reset Threshold for VDD supply
Power ON Reset Threshold for VPP supply
VDD Power supply ramp rates ( from GND/0V) for all power
supplies
0.006
24
V
V
mV/ms
VPPr
VPP Power supply ramp rates ( from GND/0V) for all power
supplies
0.016
66
mV/ms
0.8
2.6
Monotonicity of VDD/VPP/VDDIx required through its rise time
Tvddpor
Power Up to Functional time (From VDD/VPP/VDDIx ramp to
beginning of device ready
© 2015 Microsemi Corporation. Company Proprietary.
Yes
60
ms
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Power Supply Decoupling Capacitors
 Proper on-board power supply decoupling is required
•
•
•
•
Keep decoupling caps close to pin (use 402’s where possible on underside)
Distribute overall decoupling capacitance around the device perimeter
Use blind vias to remove crosstalk risk and cap surface mount area
Use larger power vias to reduce inductance – especially for high layer count
boards
Pin Name
Internal PME capacitance available for CG1657
package
VDD
2.2uF/4V
VDDI0
2.2uF/4V
VDDI1
2.2uF/4V
VDDI2
2.2uF/4V
VDDI4
0.68uF/6.3V
VDDI5
0.68uF/6.3V
VDDI6
0.68uF/6.3V
VDDI7
2.2uF/4V
VDDI8
2.2uF/4V
VDDI9
2.2uF/4V
VDDPLL
2.2uF/4V
 PME (Precious Metal Electrode)
decoupling caps within the FPGA
package enhances overall
PCB decoupling
© 2015 Microsemi Corporation. Company Proprietary.
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Radiation Tolerant Power Supplies
 Microsemi provides many Radiation-Tolerant components
that can be used to supply power to RTG4 FPGAs
 Engineers should consider the following when selecting
power supply components
• Calculate required power of the RTG4 device
– PowerCalc spreadsheet, SmartPower tool in Libero design software
• Select an appropriate Radiation-Tolerant regulator that can supply the
required power and meet all power requirements of RTG4
– Radiation-Tolerant Linear-Regulator (Microsemi)
– Radiation-Tolerant Switching regulator (Microsemi)
© 2015 Microsemi Corporation. Company Proprietary.
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Current Requirements
 Use RTG4 Power Calculator to estimate current required
• Available on Microsemi web site RTG4 Power Calculator
• Need to enter specific details for your design
• Example is for 99% utilized RT4G150 – total 6.7W
– 4 fast clocks (150MHz to 250MHz), 2 slow clocks (25MHz and 50MHz)
– 496 I/O (400 LVCMOS, 66 PCI, 32 LVDS)
– 8 Lanes of transceivers (2.5Gb/sec)
© 2015 Microsemi Corporation. Company Proprietary.
Power Matters.TM
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Microsemi Power Solutions for RTG4
© 2015 Microsemi Corporation. Company Proprietary.
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Cold Sparing
Advantages of cold sparing:
 Power-Up can be done in any sequence. (No Power supply sequencing
requirements).
 No excess device leakage in spare device where implemented.
In cold sparing applications, voltage can be applied to device I/O’s before
and during power-up. RTG4 device is capable of cold sparing applications
with the following strategies:
© 2015 Microsemi Corporation. Company Proprietary.
Power Matters.TM
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RTG4 Cold Sparing Strategies

Example of a system board integrating two parallel RTG4 devices on the board with shared or common
I/C connections.

Primary RTG4 device has its core powered and fully functional until a point where a swap of devices is
determined as necessary.

Backup RTG4 device has its I/O banks powered to prevent I/O leakage through the ESD diode and
fabric core un-powered. This establishes a low power, protected state for the backup RTG4 device.

At any point, you can swap by powering down the core of the primary RTG4 device and power up the
core of the backup RTG4 device going through its configuration sequence.




Primary and backup devices are identical parts.
Only one of the two devices might be active at one time.
Core VDD high activates the part and low de-activates the part.
The de-activate part must tie the VDD to the ground and must not be floating.
© 2015 Microsemi Corporation. Company Proprietary.
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SA 50 Series Concept, isolated DC-DC
SMT Construction in an Industry Standard Package
•Features:
•+28V or 120V nominal Inputs
•Internal EMI Filter (120V version)
•Triple, Dual and Single output versions
•Isolated Outputs
•50W total combined power output
•Inhibit Feature
•Isolated Sync Input, 500kHz
•Output trim on Single & Dual Variants
•>86% efficient Full load @5 +-15V out
•Length Width Height
•3.055 x 2.055” x 0.50”
•Total Dose Rating of 200KRads
•Threshold (LET) with no latch-up
>80MeV-cm2/mg
© 2015 Microsemi Corporation. Company Proprietary.
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SB 30 Series 30 Watt Family, isolated DC-DC
•Triple Output for Digital Loads
–5V @ 2A; 3.3V @ 3A; 2.5V @ 3A
•30W total combined power output
+28V or 100V nominal Inputs
•Internal EMI Filter (100 Vin only)
•Outputs individually regulated
•Power Good Status
•+/- 10% trim for each output
•Inhibit Feature
•Isolated Sync Input, 500kHz
•75% efficiency
•3.055 x 2.055” x 0.60”
•Total Dose Rating of 200KRads
•Threshold (LET) with no latch-up
>80MeV-cm2/mg
SMT Construction in an Industry
Standard Package
© 2015 Microsemi Corporation. Company Proprietary.
Power Matters.TM
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SB 30 Series 30 Watt Family, isolated DC-DC
 Designed to support multiple Low Voltage Digital loads
 Three independent outputs, each regulator with it’s own





PWM
Multi Simultaneous Switching Outputs on one rail will not
induce noise on an adjacent rail
Excellent load step response
Power up / power down sequencing built in
Synchronize clock with other converters to reduce system
noise
For a nominal NRE, input / output voltages can be
customized – consult PMG Microsemi
© 2015 Microsemi Corporation. Company Proprietary.
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Isolated DC-DC converters in production
SA50-120-12S-B-P
SA50-120-12S-B-T
SA50-120-15S-A-H
SA50-120-15S-A-P
SA50-120-28S-B-H
SA50-120-28S-B-P
SA50-120-28S-B-T
SA50-120-3R3-14T-B-P
SA50-120-3R3-14T-B-TX1
SA50-120-5-12T-A-P
SA50-120-5-12T-A-T
SA50-120-5-15T-A-H
SA50-120-5-15T-A-P
SA50-120-5-15T-A-T
SA50-28-5-15T-A-H
SA50-28-5-15T-A-P
SA50-28-5-15T-A-T
SB30-100-2R5S-3R3-5T-A-H
SB30-100-2R5S-3R3-5T-A-P
SB30-100-2R5S-3R3-5T-A-T
 Input Voltages 28V, 100V & 120V Standard, others
Custom
 Single Outputs: 3.3V, 5V, 12V, 15V, 28V Standard, others
Custom
 Dual Outputs: Special Configurations of Triples
 Triple Outputs: 3.3V or 5V with 12V or 15V Standard,
others can be available
 Case Style
A = leads out the side
B = leads out the top
Performance Level
P = Prototype
T = SEE Tolerant, TID Hard
H = SEE Hard, TID Hard
 Go To: http://www.microsemi.com/productdirectory/modules-a-hybrids/1450-dc-to-dc-converters
Also Available:
• Semi and full Customized Versions
• Filter Solutions e.g. SF200-28
© 2015 Microsemi Corporation. Company Proprietary.
Power Matters.TM
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RAD Hard and Hybrid
Products
RHH- Linear Regulators
Product
Description
Critical
Parameters
Vin Range
MHL8601
Pos., Linear, 3A
Fixed or
Adjustable
VLDO = 0.300 V
(3A), Rad-Hard to
300Krad+
+3V to +5.5V
+1.26V to +4.5V
MHL8605
Pos., Linear, 5A,
Fixed or
adjustable
VLDO = 0.300 V
(2A), 0.400 V (5A)
RadHard to 300
Krad+
+3V to +5.5V
+1.26V to +4.5V
MHL8701/5 Pos., Linear, 5A,
Fixed or
adjustable, SEE =
82 MeV
VLDO = 0.400 V
(2A) RadHard to
300 Krad+
+3V to +5.5V
+1.26V to +5.5V
MHL117
Pos. Linear, Adj.,
1.25A, Vin = 40 V
RadHard to
300Krad
+5V to +37V
+1.21V to +4.5V
MHL127
Dual, ±1A, Pos.
and Neg. Linear
regulator
RadHard to 300
Krad
±5V to
±40V
±6.5V to ±37V
© 2015 Microsemi Corporation. Company Proprietary.
Vout Range
Power Matters.TM
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21
Linear Applications
SA50- 28,
DC-DC (Triple)
+28 V Bus
+3.3 V
+12 V
–12 V
Radiation-Tolerant
ULDO < 0.300 V
MHL127- ADJ
MHL8605R-1.5
MHL8601- ADJ
+5
+1.5 V
FPGA FPGA
+2.5 V
+3.3 V to +2.5 V, 5A
ASIC
Logic
© 2015 Microsemi Corporation. Company Proprietary.
–5
Log-Amp
Log-Amp
Log-Amp
Power Matters.TM
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ULDO Linear Regulator MHL8701
 The MHL 8701 series products are space qualified, ultra low dropout linear
regulators designed for military and space flight applications. Assembled in a
hermetic package, this series provides an ultra low drop out voltage of 400mV
@ 2A. They are optimized for operation at +5V input or +3.3V input.










Enhanced SEE performance, SET < 5% of Vout
Thermal shutdown @ 150 °C
Output Voltage: +1.26V to +4.5V
Post Rad Output Voltage accuracy +-6%
Rad- Tolerant to 300 Krad HDR TID
Rad- Tolerant to 100 Krad Eldrs .01 rads(si)/sec
LET= 85 MeV (Au ions) No Latch-up
Fixed & Adjustable output voltages
7 Pin Power SIP
Available Now
© 2015 Microsemi Corporation. Company Proprietary.
0.300 Max
0.040
±0.002
Power Matters.TM
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RHH- POL’s
Product
Description
Critical Parameters
MHP8564A
Sw. Reg., 4.5A,
Adj./Fixed
300 Krad, Iout= 4.0A
MHP8565A
Sw. Reg., 3.0A,
Adj
300 Krad, Iout = 3.0A +4.5V to +8V +1.21V to
+4.5V
MHP8566A
Quad Sw. Reg.,
Adjustable Vout,
15A
100 Krad TID, 15A
Efficiency, 15A
© 2015 Microsemi Corporation. Company Proprietary.
Vin Range
(De-rated)
Vout Range
+4.5V to +8V +1.21V to
+4.5V
+4.5V to +8V +1.0V to
+4.5V
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RadHard Quad POL- MHP8566
 Rad-Tolerant to 100 Krad 1
 Quad adjustable output to +1.21 V.
 Up to 16A output current (total of
all outputs)
 Vin Range: +4.5 V to +8 V
(for +12 Vin consult factory)
Surface-mount package:
2.0 in. X 2.0 in. X 0.290 in.
Complete assembly – just add
voltage set resistors.
.
42 pin flat pack = L 82.5 X W 82.5 X H 11.2 mm
Configurable as four
independent 4A POLs
or one 16A POL
*****FPGA Power Supply*****
© 2015 Microsemi Corporation. Company Proprietary.
Power Matters.TM
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Thank You
Microsemi Corporation (MSCC) offers a comprehensive portfolio of semiconductor and system solutions for
communications, defense & security, aerospace and industrial markets. Products include high-performance and radiationhardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and
synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF
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email: [email protected]
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purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other
products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any
performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products,
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