MBR460MFS D

MBR460MFS, NRVB460MFS
SWITCHMODE
Power Rectifiers
These state−of−the−art devices have the following features:
Features
• Low Power Loss / High Efficiency
• New Package Provides Capability of Inspection and Probe After
•
•
•
•
•
Board Mounting
Guardring for Stress Protection
Low Forward Voltage Drop
175°C Operating Junction Temperature
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These are Pb−Free and Halide−Free Devices
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIERS
4 AMPERES
60 VOLTS
5,6
1,2,3
MARKING
DIAGRAM
Mechanical Characteristics:
•
•
•
•
•
Case: Epoxy, Molded
Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
Lead Finish: 100% Matte Sn (Tin)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
Applications
• Ideally Suited for use as an Output Rectifier in High Frequency
(up to 2 MHz) Automotive and Non−Automotive Applications
• Output Rectification in Compact Portable Consumer Applications
• Freewheeling Diode used with Inductive Loads
A
1
SO−8 FLAT LEAD
CASE 488AA
STYLE 2
B460
A
Y
W
ZZ
A
A
C
B460
AYWZZ
C
Not Used
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Lot Traceability
ORDERING INFORMATION
Device
Package
Shipping†
MBR460MFST1G
SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
MBR460MFST3G
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
NRVB460MFST1G
SO−8 FL
(Pb−Free)
1500 /
Tape & Reel
NRVB460MFST3G
SO−8 FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
June, 2013 − Rev. 0
1
Publication Order Number:
MBR460MFS/D
MBR460MFS, NRVB460MFS
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
60
Average Rectified Forward Current
(Rated VR, TC = 165°C)
IF(AV)
4.0
A
Peak Repetitive Forward Current,
(Rated VR, Square Wave, 20 kHz, TC = 165°C)
IFRM
8.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
40
A
Storage Temperature Range
Tstg
−65 to +175
°C
Operating Junction Temperature
TJ
−55 to +175
°C
EAS
10
mJ
Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive)
V
ESD Rating (Human Body Model)
3B
ESD Rating (Machine Model)
M4
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board)
Symbol
Typ
Max
Unit
RθJC
−
2.4
°C/W
0.65
0.71
0.72
0.74
6.5
0.01
20
0.2
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
(iF = 4 Amps, TJ = 125°C)
(iF = 4 Amps, TJ = 25°C)
vF
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
iR
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
http://onsemi.com
2
V
mA
MBR460MFS, NRVB460MFS
TYPICAL CHARACTERISTICS
100
iF, INSTANTANEOUS FORWARD
CURRENT (A)
TA = 175°C
10
TA = 125°C
TA = 150°C
1
TA = 25°C
TA = −40°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.1
0.2
0.3
0.4
0.5
0.6
0.8
0.7
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E+00
TA = 175°C
1.E−04
TA = 150°C
1.E−02
TA = 125°C
1.E−03
TA = 150°C
1.E−04
TA = 25°C
1.E−05
TA = 25°C
1.E−05
1.E−06
0.9
TA = 175°C
1.E−01
TA = 125°C
1.E−03
1.E−06
1.E−07
1.E−08
1.E−07
TA = −40°C
TA = −40°C
1.E−08
0
10
20
30
40
50
60
1.E−09
0
10
20
30
40
50
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
1000
C, JUNCTION CAPACITANCE (pF)
TA = −40°C
Figure 1. Typical Instantaneous Forward
Characteristics
1.E−02
TJ = 25°C
100
0
TA = 25°C
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
1.E−01
10
TA = 150°C
1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
1.E+00
1.E−09
1.E−10
TA = 125°C
0.1
0.9
TA = 175°C
10
IR, INSTANTANEOUS REVERSE CURRENT (A)
0
IR, INSTANTANEOUS REVERSE CURRENT (A)
0.1
IF(AV), AVERAGE FORWARD CURRENT (A)
iF, INSTANTANEOUS FORWARD
CURRENT (A)
100
10
20
30
40
50
60
10
9
RqJC = 2.4°C/W
8
7
DC
6
5
Square Wave
4
3
2
1
0
60
80
100
120
140
160
VR, REVERSE VOLTAGE (V)
TC, CASE TEMPERATURE (°C)
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating TO−220AB
http://onsemi.com
3
60
MBR460MFS, NRVB460MFS
TYPICAL CHARACTERISTICS
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
8
IPK/IAV = 20
7
IPK/IAV = 10
TJ = 175°C
6
5
IPK/IAV = 5
4
Square Wave
3
2
DC
1
0
0
1
2
3
4
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 7. Forward Power Dissipation
100
50% Duty Cycle
R(t) (°C/W)
20%
10 10%
5%
2%
1
0.1
0.01
Assumes 25°C ambient and soldered to
a 600 mm2 − oz copper pad on PCB
1%
Single Pulse
0.000001 0.00001
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
Figure 8. Thermal Characteristics
http://onsemi.com
4
1
10
100
1000
MBR460MFS, NRVB460MFS
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE G
2X
0.20 C
D
2
A
B
D1
2X
0.20 C
3
q
E
2
2
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
4X
E1
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
c
A1
4
TOP VIEW
C
3X
e
0.10 C
SEATING
PLANE
DETAIL A
A
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
0.10 C
SIDE VIEW
8X
DETAIL A
SOLDERING FOOTPRINT*
b
0.10
C A B
0.05
c
3X
0.750
4
K
0.965
1.330
E2
L1
M
2X
0.905
2X
0.495
4.530
3.200
G
4X
1.000
e/2
1
PIN 5
(EXPOSED PAD)
4X
1.270
L
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.15 BSC
4.50
4.90
5.10
3.50
−−−
4.22
6.15 BSC
5.50
5.80
6.10
3.45
−−−
4.30
1.27 BSC
0.51
0.61
0.71
1.20
1.35
1.50
0.51
0.61
0.71
0.05
0.17
0.20
3.00
3.40
3.80
0_
−−−
12 _
0.475
D2
BOTTOM VIEW
2X
1.530
4.560
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MBR460MFS/D