Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXA6115A Rev. 7.3, 04/2015 MPXxx6115A, 15 to 115 kPa, Absolute, Integrated Pressure Sensor MPXA6115A MPXAZ6115A MPXH6115A MPXHZ6115A Series The MPXxx6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the pressure sensor a logical and economical choice for the system designer. The MPXxx6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Top view Features • Resistant to high humidity and common automotive media DNC 5 4 VOUT • Improved accuracy at high temperature DNC 6 3 GND • Available in small and super small outline packages DNC 7 2 VS • 1.5% maximum error over 0 °C to 85 °C DNC 8 1 DNC • Ideally suited for microprocessor or microcontroller-based systems • Temperature compensated from -40 °C to +125 °C • Durable Thermoplastic (PPS) Surface Mount Package Pin 1 identification chamfered corner or notch in pin Typical applications Pinout • Industrial controls • Engine control/manifold absolute pressure (MAP) • Weather station and weather reporting device barometers Small outline packages MPXA6115A6U/T1 Case 98ASB17756C MPXA6115AC6U/T1 MPXAZ6115AC6T1 Case 98ASB17757C MPXA6115AC7U Case 98ASB17759C Super small outline packages MPXH6115A6U/T1 MPXHZ6115A6U/T1 Case 98ARH99066A MPXH6115AC6U/T1 MPXHZ6115AC6U/T1 Case 98ARH99089A Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2007-2012, 2015 Freescale Semiconductor, Inc. All rights reserved. MPXAZ6115AP/T1 Case 98ASA99303D Ordering information # of Ports Device name Shipping Pressure type Absolute Device marking Package None Single Dual Gauge Differential Small outline package (MPXA6115A series) MPXA6115A6U Rails 98ASB17756C • • MPXA6115A MPXA6115A6T1 Tape and Reel 98ASB17756C • • MPXA6115A MPXA6115AC6U Rails 98ASB17757C • • MPXA6115A MPXA6115AC6T1 Tape and Reel 98ASB17757C • • MPXA6115A MPXA6115AC7U Rails 98ASB17759C • • MPXA6115A Small outline package (Media resistant gel) (MPXAZ6115A series) MPXAZ6115AC6T1 MPXAZ6115AP MPXAZ6115APT1 Tape and Reel 98ASB17757C • • MPXAZ6115A Trays 98ASA99303D • • MPXAZ6115A Tape and Reel 98ASA99303D • • MPXAZ6115A Super small outline package (MPXH6115A series) MPXH6115A6U Rails 98ARH99066A • • MPXH6115A MPXH6115A6T1 Tape and Reel 98ARH99066A • • MPXH6115A MPXH6115AC6U Rails 98ARH99089A • • MPXH6115A MPXH6115AC6T1 Tape and Reel 98ARH99089A • • MPXH6115A Small outline package (Media resistant gel) (MPXHZ6115A series) MPXHZ6115A6U Rails 98ARH99066A • • MPXHZ6115A MPXHZ6115A6T1 Tape and Reel 98ARH99066A • • MPXHZ6115A MPXHZ6115AC6U Rails 98ARH99089A • • MPXHZ6115A MPXHZ6115AC6T1 Tape and Reel 98ARH99089A • • MPXHZ6115A MPXA6115A 2 Sensors Freescale Semiconductor, Inc. Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 Minimum recommended footprint for small and super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Related Documentation The MPXxx6115A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPXxx6115A. In the Refine Your Result pane on the left, click on the Documentation link. MPXA6115A Sensors Freescale Semiconductor, Inc. 3 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. +5.0 V VS Pin 2 MPXxx6115A 100 nF to ADC VOUT Pin 4 47 pF GND Pin 3 51 K Figure 1. Fully integrated pressure sensor schematic 1.2 Pinout VOUT DNC 5 4 DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Pin 1 identification, chamfered corner or notch in pin Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name 1 DNC Function Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner. Voltage supply 2 VS 3 GND 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. Ground MPXA6115A 4 Sensors Freescale Semiconductor, Inc. 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Symbol Value Units Maximum pressure (P1 > P2) Rating Pmax 400 kPa Storage temperature Tstg -40° to +125° °C TA -40° to +125° °C Output source current @ full-scale output Io + 0.5 mAdc Output sink current @ minimum pressure offset(2) Io - -0.5 mAdc Operating temperature (2) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit POP 15 — 115 kPa VS 4.75 5.0 5.25 Vdc Io — 6.0 10 mAdc Voff 0.133 0.200 0.268 Vdc Full-scale output(3) (0 °C to 85° C) @ VS = 5.0 Volts VFSO 4.633 4.700 4.768 Vdc Full-scale span(4) (0 °C to 85° C) @ VS = 5.0 Volts VFSS 4.433 4.500 4.568 Vdc Accuracy(5) (0 °C to 85° C) — — — ±1.5 %VFSS Sensitivity V/P — 45.0 — mV/kPa tR — 1.0 — ms Warm-up time(7) — — 20 — ms Offset stability(8) — — ±0.25 — %VFSS Pressure range (1) Supply voltage Supply current Minimum pressure offset Response time (2) (0 °C to 85° C) @ VS = 5.0 Volts (6) 1.Device is ratiometric within this specified excitation range. 2.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. 4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressure. 5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 °C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 °C. TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C. 6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. MPXA6115A Sensors Freescale Semiconductor, Inc. 5 3 On-chip Temperature Compensation and Calibration Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A). Figure 4 shows a typical application circuit (output source current operation). Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 °C to 85 °C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXxx6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Gel Die Coat Stainless Steel Cap Die P1 Wire Bond Thermoplastic Case Lead Frame Die Bond Absolute Element Sealed Vacuum Reference Figure 3. Cross Sectional Diagram SSOP/SOP (not to scale) +5.0 V VS Pin 2 100 nF MPXxx6115A to ADC VOUT Pin 4 47 pF GND Pin 3 51 K Figure 4. Typical application circuit (output source current operation) 5.0 4.5 4.0 Output (Volts) 3.5 Transfer Function: VOUT = Vs* (.009*P-.095) ± Error VS = 5.0 Vdc TEMP = 0 to 85 °C MAX TYP 3.0 2.5 2.0 1.5 1.0 MIN 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0 Pressure (ref: to sealed vacuum) in kPa Figure 5. Output vs. absolute pressure MPXA6115A 6 Sensors Freescale Semiconductor, Inc. Nominal Transfer Value: VOUT = VS x (0.009 x P - 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 ± 0.25 Vdc Figure 6. Transfer function Temperature error factor 4.0 Break Points 3.0 2.0 Temp Multiplier - 40 °C 0 °C to 85 °C 125 °C 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0 ºC to -40 ºC and from 85 ºC to 125 ºC Figure 7. Temperature error band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 Pressure 15 to 115 (kPa) -2.0 Error (Max) ±1.5 (kPa) -3.0 Figure 8. Pressure error band MPXA6115A Sensors Freescale Semiconductor, Inc. 7 4 Package Information 4.1 Minimum recommended footprint for small and super small packages Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.100 TYP 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 inch mm 0.100 TYP 8X 2.54 Figure 9. SOP Footprint (Case 98ASB17756C) 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 10. SSOP Footprint (Case 98ARH99066A and 98ARH99089A) MPXA6115A 8 Sensors Freescale Semiconductor, Inc. 4.2 Package dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf. Case 98ASB17756C, Small outline package MPXA6115A Sensors Freescale Semiconductor, Inc. 9 This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf. -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE Case 98ASB17757C, small outline package MPXA6115A 10 Sensors Freescale Semiconductor, Inc. This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17759C.pdf. FREESCALE D Case 98ASB17759C, small outline package MPXA6115A Sensors Freescale Semiconductor, Inc. 11 This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASA99303D.pdf. PAGE 1 OF 2 Case 98ASA99303D, Small Outline Package MPXA6115A 12 Sensors Freescale Semiconductor, Inc. PAGE 2 OF 2 Case 98ASA99303D, Small outline package MPXA6115A Sensors Freescale Semiconductor, Inc. 13 This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf. PAGE 1 OF 3 Case 98ARH99066A, Super small outline package MPXA6115A 14 Sensors Freescale Semiconductor, Inc. PAGE 2 OF 3 Case 98ARH99066A, Super small outline package MPXA6115A Sensors Freescale Semiconductor, Inc. 15 PAGE 3 OF 3 Case 98ARH99066A, Super small outline package MPXA6115A 16 Sensors Freescale Semiconductor, Inc. This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf. PAGE 1 OF 2 Case 98ARH99089A, Super small outline package MPXA6115A Sensors Freescale Semiconductor, Inc. 17 PAGE 2 OF 2 Case 98ARH99089A, Super small outline package MPXA6115A 18 Sensors Freescale Semiconductor, Inc. 5 Revision History Table 4. Revision history Revision number Revision date 7.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H, 7.2 10/2012 • On page 1, changed typical output voltage from 4.8V to 4.7V to match typical output voltage listed on page 3 of document 7.3 04/2015 • Removed obsolete part numbers MPXAZ6115A6U and MPXAZ6115AC6U from data sheet. • Updated format. Description of changes MPXA6115A Sensors Freescale Semiconductor, Inc. 19 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. 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U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2015 Freescale Semiconductor, Inc. Document Number: MPXA6115A Rev. 7.3 04/2015