Freescale Semiconductor, Inc. MOTOROLA Order Number: MPXAZ6115A Rev. 1, 06/2004 SEMICONDUCTOR TECHNICAL DATA Freescale Semiconductor, Inc... Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXAZ6115A MPXHZ6115A SERIES INTEGRATED PRESSURE SENSOR 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.8 Volts Output SMALL OUTLINE PACKAGE Motorola's MPXAZ6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensor's packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and high reliability of on-chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXAZ6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXAZ6115A6U CASE 482-01 Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features • Resistant to High Humidity and Common Automotive Media • Improved Accuracy at High Temperature • 1.5% Maximum Error over 0° to 85°C • Ideally suited for Microprocessor or Microcontroller-Based Systems • Temperature Compensated from -40° to +125°C • Durable Thermoplastic (PPS) Surface Mount Package Application Examples • Aviation Altimeters • Industrial Controls • Engine Control/Manifold Absolute Pressure (MAP) • Weather Station and Weather Reporting Devices MPXAZ6115AC6U CASE 482A-01 PIN NUMBER 1 N/C 5 N/C 2 VS 6 N/C 3 Gnd 7 N/C 4 Vout 8 N/C NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead. VS SUPER SMALL OUTLINE PACKAGE THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 SENSING ELEMENT GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY Vout MPXHZ6115A6U CASE 1317-04 PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic © Motorola, Inc. 2004 For More Information On This Product, Go to: www.freescale.com MPXAZ6115AC6U CASE 1317A-03 Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES MAXIMUM RATINGS(1) Parametrics Symbol Value Units Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg -40° to +125° °C TA -40° to +125° °C Io + 0.5 mAdc Io - -0.5 mAdc Operating Temperature (2) Output Source Current @ Full Scale Output Output Sink Current @ Minimum Pressure Offset (2) Freescale Semiconductor, Inc... NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 - 115 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Io - 6.0 10 mAdc (0 to 85°C) Voff 0.133 0.200 0.268 Vdc Full Scale Output(3) @ VS = 5.0 Volts (0 to 85°C) VFSO 4.633 4.700 4.768 Vdc Full Scale Span(4) @ VS = 5.0 Volts (0 to 85°C) VFSS 4.433 4.500 4.568 Vdc Accuracy(5) (0 to 85°C) - - - ±1.5 %VFSS Supply Current Minimum Pressure @ VS = 5.0 Volts Sensitivity Offset(2) V/P - 45.9 - mV/kPa Response Time(6) tR - 1.0 - ms Warm-Up Time(7) - - 20 - ms - - ±0.25 - %VFSS (8) Offset Stability NOTES: 1. Device is radiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MPXAZ6115A 2 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES DIE GEL DIE COAT +5.0 V STAINLESS STEEL CAP P1 VS Pin 2 THERMOPLASTIC CASE WIRE BOND LEAD FRAME MPXAZ6115A Vout Pin 4 100 nF GND Pin 3 ABSOLUTE ELEMENT to ADC 47 pF 51 K DIE BOND Figure 2. Cross Sectional Diagram SOP (Not to Scale) Figure 2 illustrates the absolute sensing chip in the basic Small Outline chip carrier (Case 482). Figure 3. Typical Application Circuit (Output Source Current Operation) Figure 3 shows a typical application circuit (output source current operation). 5.0 4.5 4.0 OUTPUT (Volts) 3.5 TRANSFER FUNCTION: MAX Vout = Vs* (.009*P-.095) ± Error VS = 5.0 Vdc TEMP = 0 to 85°C TYP 3.0 2.5 2.0 1.5 MIN 1.0 0.5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Freescale Semiconductor, Inc... SEALED VACUUM REFERENCE Pressure (ref: to sealed vacuum) in kPa Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. Motorola Sensor Device Data The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application. For More Information On This Product, Go to: www.freescale.com MPXAZ6115A 3 Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES Transfer Function (MPXAZ6115A) Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXAZ6115A Series 4.0 Break Points Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) Freescale Semiconductor, Inc... 3.0 2.0 1.0 0.0 20 40 60 80 100 Pressure (in kPa) 120 -1.0 Pressure -2.0 Error (Max) 15 to 115 (kPa) ±1.5 (kPa) -3.0 ORDERING INFORMATION—SMALL OUTLINE PACKAGE Device Type Basic Element Ported Element Options Case No. MPX Series Order No. Packing Options Marking Absolute, Element Only 482 MPXAZ6115A6U Rails MPXAZ6115A Absolute, Element Only 482 MPXAZ6115A6T1 Tape and Reel MPXAZ6115A Absolute, Axial Port 482A MPXAZ6115AC6U Rails MPXAZ6115A Absolute, Axial Port 482A MPXAZ6115AC6T1 Tape and Reel MPXAZ6115A ORDERING INFORMATION—SUPER SMALL OUTLINE PACKAGE Device Type Basic Element Ported Element MPXAZ6115A 4 Options Case No. MPX Series Order No. Packing Options Marking Absolute, Element Only 1317 MPXHZ6115A6U Rails MPXHZ6115A Absolute, Element Only 1317A MPXHZ6115A6T1 Tape and Reel MPXHZ6115A Absolute, Axial Port 1317A MPXHZ6115AC6U Rails MPXHZ6115A Absolute, Axial Port 1317A MPXHZ6115AC6T1 Tape and Reel MPXHZ6115A For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES SURFACE MOUNTING INFORMATION MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to 0.100 TYP 2.54 Freescale Semiconductor, Inc... 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 5. SOP Footprint (Case 482 and 482A) MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to 0.050 1.27 TYP a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 6. SSOP Footprint (Case 1317 and 1317A) Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com MPXAZ6115A 5 Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES SMALL OUTLINE PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S Freescale Semiconductor, Inc... N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A MPXAZ6115A 6 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES SUPER SMALL OUTLINE PACKAGE DIMENSIONS 2X 0.006 C A B 0.420 0.400 0.050 NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5˚ MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.025 0.300 0.280 3 0.019 5 0.014 0.004 M C A B Freescale Semiconductor, Inc... 8X A 0.300 0.280 B 3 0.298 0.278 .014 GAGE PLANE 0.165 0.145 0.010 0.002 0.004 10˚ 0˚ DETAIL D DETAIL D C 0.038 0.048 SEATING PLANE CASE 1317-04 ISSUE D Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com MPXAZ6115A 7 Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES SUPER SMALL OUTLINE PACKAGE DIMENSIONS 2X 0.006 C A B 0.420 0.400 NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 55 MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.050 0.025 0.025 0.345 0.325 Freescale Semiconductor, Inc... 8X 0.018 0.014 0.004 0.345 0.325 M 5 .014 C A B GAGE PLANE 0.010 0.002 10˚ 0˚ 0.048 0.038 DETAIL E Ø 0.130 Ø 0.110 0.200 0.180 0.300 0.280 0.390 0.370 3 0.004 C SEATING PLANE A 0.300 0.280 B 3 DETAIL E BOTTOM VIEW CASE 1317A-03 ISSUE A MPXAZ6115A 8 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES Freescale Semiconductor, Inc... NOTES Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com MPXAZ6115A 9 Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES Freescale Semiconductor, Inc... NOTES MPXAZ6115A 10 For More Information On This Product, Go to: www.freescale.com Motorola Sensor Device Data Freescale Semiconductor, Inc. MPXAZ6115A MPXHZ6115A SERIES Freescale Semiconductor, Inc... NOTES Motorola Sensor Device Data For More Information On This Product, Go to: www.freescale.com MPXAZ6115A 11 Freescale Semiconductor, Inc... Freescale Semiconductor, Inc. Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. © Motorola, Inc. 2004 HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-800-521-6274 or 480-768-2130 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center 3-20-1 Minami-Azabu. Minato-ku, Tokyo 106-8573, Japan 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors For More Information On This Product, Go to: www.freescale.com MPXAZ6115A