Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached QTR: 2013- 00267 Wafer Process: PHEMT-A HMC261 HMC263 HMC264 HMC265 HMC268 HMC281 HMC282 HMC283 HMC337 HMC338 HMC339 HMC341 HMC342 HMC404 HMC516 HMC517 HMC518 HMC519 HMC564 HMC565 HMC566 HMC570 HMC571 HMC572 HMC902 HMC903 HMC904 HMC908 HMC951B HMC962 HMC963 HMC966 HMC967 HMC977 HMC1113 Rev: 05 QTR: 2013- 00267 Wafer Process: PHEMT-A Rev: 05 Introduction The testing performed for this report is designed to accelerate the predominant failure mode, electro-migration (EM), for the devices under test. The devices are stressed at high temperature and DC biased to simulate a lifetime of use at typical operating temperatures. Using the Arrhenius equation, the acceleration factor (AF) is calculated for the stress testing based on the stress temperature and the typical use operating temperature. This report is intended to summarize all of the High Temperature Operating Life Test (HTOL) data for the PHEMT-A process. The FIT/MTTF data contained in this report includes all the stress testing performed on this process to date and will be updated periodically as additional data becomes available. Data sheets for the tested devices can be found at www.hittite.com. Glossary of Terms & Definitions: 1. HAST: Highly Accelerated Stress Test (biased). Devices are subjected to 96 hours of 85% relative humidity at a temperature of 130°C and pressure (18.6 PSIG), while DC biased. This test is performed in accordance with JESD22-A110. 2. HTOL: High Temperature Operating Life. This test is used to determine the effects of bias conditions and temperature on semiconductor devices over time. It simulates the devices’ operating condition in an accelerated way, through high temperature and/or bias voltage, and is primarily for device qualification and reliability monitoring. This test was performed in accordance with JEDEC JESD22-A108. 3. HTSL: High Temperature Storage Life. Devices are subjected to 1000 hours at 150oC per JESD22-A103. 4. MSL: Moisture sensitivity level pre-conditioning is performed per JESD22-A113. 5. Operating Junction Temp (Toj): Temperature of the die active circuitry during typical operation. 6. Stress Junction Temp (Tsj): Temperature of the die active circuitry during stress testing. 7. Temperature Cycle: Cond C (-65°C to 150°C), 500 cycles per JESD22-A104. QTR: 2013- 00267 Wafer Process: PHEMT-A Rev: 05 Qualification Sample Selection: All qualification devices used were manufactured and tested on standard production processes and met pre-stress acceptance test requirements. Summary of Qualification Tests: HMC264 (QTR2002-00001) QTY IN 36 QTY OUT 36 HTOL, 1000 hours 36 36 Complete Post HTOL Electrical test 36 35 Pass 1 piece damaged during test. Bond Pull 10 10 Pass HMC261 Die Die Shear 10 10 Pass HMC261 Die SEM Inspection 10 10 Pass HMC261 Die Metal and Dielectric Thickness 10 10 Pass HMC261 Die QTY IN 48 103 48 103 48 103 QTY OUT 48 103 48 103 47 103 TEST Initial electrical Test PASS/FAIL NOTES Pass HMC261 & 263 (QTR2002-00005) TEST Initial electrical Test HTOL, 1240 hours Post HTOL Electrical test PASS/FAIL NOTES Pass HMC261 HMC263 Complete Pass 1 failure during test. QTR: 2013- 00267 Wafer Process: PHEMT-A Rev: 05 Bond Pull QTY IN 10 QTY OUT 10 Die Shear 10 SEM Inspection Metal and Dielectric Thickness TEST PASS/FAIL NOTES Pass HMC261 Die 10 Pass HMC261 Die 10 10 Pass HMC261 Die 10 10 Pass HMC261 Die Initial electrical Test QTY IN 316 QTY OUT 316 MSL-1 Precondition 154 154 Complete Post MSL1 Electrical Test 154 154 Pass HAST (preconditioned) 77 77 Complete Post HAST electrical Test 77 77 Pass Temp. Cycle (preconditioned) 77 77 Complete Post Temp Cycle electrical Test 77 77 Pass HTSL 77 77 Complete Post HTSL Electrical Test 77 77 Pass HTOL 80 80 Complete Post HTOL Electrical test 80 80 Pass Physical Dimensions 15 15 Pass Solderability 15 15 Pass HMC966 (QTR2012-00014) TEST PASS/FAIL Pass NOTES QTR: 2013- 00267 Wafer Process: PHEMT-A Rev: 05 HMC6XXX (QTR2013-00340) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 6 6 Complete HTOL, 5039 hours 6 6 Complete Post HTOL Electrical Test 6 6 Pass NOTES HMC6XXX (QTR2013-00340) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 14 14 Complete HTOL, 2000 hours 14 14 Complete Post HTOL Electrical Test 14 14 Pass NOTES QTR: 2013- 00267 Wafer Process: PHEMT-A Rev: 05 PHEMT-A Failure Rate Estimate Based on the HTOL test results, a failure rate estimation was determined using the following parameters: With device case temp, Tc = 85°C HMC264 (QTR2002-00001) Operating Junction Temp (Toj) = 85°C(358°K) Stress Junction Temp (Tsj) = 125°C(398°K) HMC261 & 263 (QTR2002-00005) Operating Junction Temp (Toj) = 85°C(358°K) Stress Junction Temp (Tsj) = 125°C(398°K) HMC966 (QTR2012-00014) Operating Junction Temp (Toj) = 132°C(405°K) Stress Junction Temp (Tsj) = 175°C(448°K) HMC6XXX (QTR2013-00340) Operating Junction Temp (Toj) = 108°C(381°K) Stress Junction Temp (Tsj) = 112°C(385°K) Device hours: HMC264 (QTR2002-00001) = (35 X 1000hrs) = 35,000 hours HMC261 & 263 (QTR2002-00005) = (151 X 1240hrs) = 187,240 hours HMC966 (QTR2012-00014) = (80 X 1000hrs) = 80,000 hours HMC6XXX (QTR2013-00340) = (6 X 5039hrs) = 30,234 hours HMC6XXX (QTR2013-00340) = (14 X 2000hrs) = 28,000 hours For PHEMT-A MMIC, Activation Energy = 1.6 eV QTR: 2013- 00267 Wafer Process: PHEMT-A Rev: 05 Acceleration Factor (AF): HMC264 (QTR2002-00001) Acceleration Factor = exp[1.6/8.6x10-5(1/390-1/448)] = 185.5 HMC261 & 263 (QTR2002-00005) Acceleration Factor = exp[1.6/8.6x10-5(1/390-1/448)] = 185.5 HMC966 (QTR2012-00014) Acceleration Factor = exp[1.6/8.6x10-5(1/390-1/448)] = 82.2 HMC6XXX (QTR2013-00340) Acceleration Factor = exp[1.6/8.6x10-5(1/381-1/385)] = 1.7 Equivalent hours = Device hours x Acceleration Factor Equivalent hours = (35,000x185.5)+(187,240x185.5)+(80,000x82.2)+(30,234x1.7)+ (28,000x1.7) = 4.79x107 hours Since there was one failure and we used a time terminated test, F=1, and R = 2F+2 = 4 The failure rate was calculated using Chi Square Statistic: at 60% and 90% Confidence Level (CL), with 1 unit out of spec and a 85°C case temp; Failure Rate 60 = [(2)60,2]/(2X 4.79x107 )] = 4.1/ 9.58x107 = 4.23x10-8 failures/hour or 42.3 FIT or MTTF = 2.37x107 Hours 90 = [(2)90,2]/(2X 4.79x107 )] = 7.8/ 9.58x107 = 8.12x10-8 failures/hour or 81.2 FIT or MTTF = 1.23x107 Hours