HITTITE HMC283LM1_06

HMC283LM1
v04.1201
AMPLIFIERS - SMT
5
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
Typical Applications
Features
The HMC283LM1 is ideal for:
SMT mmWave Package
• Millimeterwave Point-to-Point Radios
Psat Output Power: +21 dBm
• LMDS
High Gain: 21 dB
• SATCOM
No External Matching Required
Functional Diagram
General Description
The HMC283LM1 is a Medium Power Amplifier (MPA)
in a SMT leadless chip carrier package covering 17 to
40 GHz. The LM1 is a true surface mount broadband
millimeterwave package offering low loss & excellent I/
O match preserving MMIC chip performance. Utilizing
a GaAs PHEMT process, the device offers 20 dB gain
and +21 dBm ouput power from a bias supply of +3.5V
@ 300mA. As an alternative to chip-and-wire hybrid
assemblies the HMC283LM1 eliminates the need for
wirebonding, thereby providing a consistent connection interface for the customer. The amplifier may be
used as a frequency doubler. A built-in-test pad (Vdet)
allows monitoring of microwave output power. All data
is with the non-hermetic, epoxy sealed LM1 packaged
MPA device mounted in a 50 ohm test fixture.
Electrical Specifications, TA = +25° C, Vdd= +3.5V*, ldd = 300 mA
Parameter
Min.
Frequency Range
Gain
Typ.
Max.
Min.
17 - 40
15
Gain Variation over Temperature
20
0.05
Typ.
Max.
21 - 30
17
0.07
GHz
22
0.05
dB
0.07
dB/°C
Input Return Loss
6
10
6
12
Output Return Loss
4
7
4
8
dB
Reverse Isolation
30
40
35
45
dB
Output Power for 1 dB Compression (P1dB)
14
18
14
18
dBm
Saturated Output Power (Psat)
17
21
17
21
dBm
Output Third Order Intercept (IP3)
22
27
21
27
dBm
10
dB
Noise Figure
10
Supply Current (Idd)
300
330
300
dB
330
*Vdd = +3.5V, adjust Vgg = Vgg1, Vgg2 between -2.0 to +0.4V to achieve Idd = 300 mA typical.
5-2
Units
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
mA
HMC283LM1
v04.1201
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
Broadband Gain & Return Loss
5
Gain vs. Temperature
25
25
15
10
20
S11
S21
S22
5
GAIN (dB)
RESPONSE (dB)
20
0
-5
15
+25 C
+85 C
-40 C
10
-10
-15
5
-20
-25
0
10
15
20
25
30
35
16
40
18 20 22
FREQUENCY (GHz)
32 34 36
38 40
42
Input Return Loss vs. Temperature
0
0
-10
INPUT RETURN LOSS (dB)
REVERSE ISOLATION (dB)
30
FREQUENCY (GHz)
Reverse Isolation vs. Temperature
+25 C
+85 C
-40 C
-20
-30
-40
-50
-60
-5
-10
-15
+25 C
+85 C
-40 C
-20
-25
16
18 20 22
24 26 28
30
32 34 36
38 40
42
16
18 20 22
FREQUENCY (GHz)
24 26 28
30
32 34 36
38 40
42
FREQUENCY (GHz)
P1dB and Psat @ 25 °C
Output Return Loss vs. Temperature
25
0
OUTPUT RETURN LOSS (dB)
OUTPUT P1dB & Psat (dBm)
24 26 28
AMPLIFIERS - SMT
30
30
23
Psat
21
19
17
P1dB
15
13
-5
-10
+25 C
+85 C
-40 C
-15
-20
16
18
20
22
24
26
28
30
32
FREQUENCY (GHz)
34
36
38
40
16
18 20 22
24 26 28
30
32 34 36
38 40
42
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5-3
HMC283LM1
v04.1201
5
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
Power Compression @ 20 GHz
P1dB vs. Temperature
24
Pout (dBm), GAIN (dB), PAE (%)
OUTPUT P1dB (dBm)
AMPLIFIERS - SMT
25
23
+25 C
-40 C
+85 C
21
19
17
15
22
20
18
16
14
12
10
8
6
Pout
Gain
PAE
4
2
13
16
18
20
22
24
26
28
30
32
34
36
38
0
-10
40
-8
-6
-4
FREQUENCY (GHz)
Psat vs. Temperature
0
2
4
6
8
10
Power Compression @ 28 GHz
24
Pout (dBm), GAIN (dB), PAE (%)
25
23
Psat (dBm)
-2
INPUT POWER (dBm)
21
19
17
+25 C
-55 C
+85 C
15
18
20
22
24
26
28
30
32
20
18
16
14
12
10
8
6
Pout
Gain
PAE
4
2
13
16
22
34
36
38
0
-10
40
-8
-6
-4
FREQUENCY (GHz)
0
2
4
6
8
10
6
8
10
Power Compression @ 39 GHz
Output IP3 vs. Temperature
24
20
28
38
-40 °C
29.0
28.0
31.0
+25 °C
28.5
27.5
28.5
+85 °C
27.5
26.0
24.5
Pout (dBm), GAIN (dB), PAE (%)
Frequency (GHz)
Temperature
All levels in dBm
-2
INPUT POWER (dBm)
22
20
18
16
14
12
10
Pout
Gain
PAE
8
6
4
2
0
-10
-8
-6
-4
-2
0
2
4
INPUT POWER (dBm)
5-4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC283LM1
v04.1201
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
5
Drain Bias Voltage (Vdd)
+5.0 Vdc
Drain Bias Current (Idd)
400 mA
Gate Bias Voltage (Vgg1, Vgg2)
-2.0 to +0.4 Vdc
Gate Bias Current (Igg)
4.0 mA
RF Input Power (RFin)(Vdd = +3.5 Vdc)
+8 dBm
Channel Temperature
175 °C
Continuous Pdiss (T = 85 °C)
(derate 16 mW/°C above 85 °C)
1.44 W
Thermal Resistance
(channel to ground paddle)
62.5 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
AMPLIFIERS - SMT
Absolute Maximum Ratings
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Pin
Function
1
GND
2
Vdd
2. PLATING: GOLD OVER NICKEL
3
GND
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4
RF OUT
5
VDET
6
Vgg2
7
Vgg1
8
RF IN
NOTES:
1. MATERIAL: PLASTIC
4. ALL TOLERANCES ARE ± 0.005 [± 0.13].
5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND.
6.
• INDICATES PIN 1
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5-5
HMC283LM1
v04.1201
Evaluation PCB
AMPLIFIERS - SMT
5
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
LM1 Evaluation PCB
The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground
(GSG) probes for testing. Suggested probe pitch is 400um (16 mils). Alternatively, the board can be mounted in a
metal housing with 2.4 mm coaxial connectors.
Evaluation Circuit Board Layout Design Details
Layout Technique
Micro Strip to CPWG
Material
Rogers 4003 with 1/2 oz. Cu
Dielectric Thickness
0.008” (0.20 mm)
Microstrip Line Width
0.018” (0.46 mm)
CPWG Line Width
0.016” (0.41 mm)
CPWG Line to GND Gap
0.005” (0.13 mm)
Ground Via Hole Diameter
0.008” (0.20 mm)
C1
100 pF Capacitor, 0402 Pkg.
C2
33,000 pF Capacitor, 1206 Pkg.
R1
1,000 Ohm Resistor, 0402 Pkg.
R2
100 Ohm Resistor, 0402 Pkg.
LM1 Package Mounted to Evaluation PCB
5-6
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC283LM1
v04.1201
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
5
AMPLIFIERS - SMT
Suggested LM1 PCB Land Pattern Tolerance: ± 0.003” (± 0.08 mm)
Amplifier Application Circuit
Recommended Component Values
C1
100 pF
C2
33,000 pF
R1
1,000 Ohm
R2
100 Ohm
Note: Vgg1 and Vgg2 may be connected to a common Vgg feed. For optimal stable operation, it is recommended that
a voltage divider network be employed as shown above with Vgg set to achieve ldd = 300 mA typical.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5-7
HMC283LM1
v04.1201
Recommended SMT Attachment Technique
Preparation & Handling of the LM1 Millimeterwave Package for Surface Mounting
The HMC LM1 package was designed to be compatible with high volume surface mount PCB assembly processes.
The LM1 package requires a specific mounting pattern to
225
allow proper mechanical attachment and to optimize electrical
200
performance at millimeterwave frequencies. The PCB layout
175
pattern can be found on each LM1 product data sheet. It can
also be provided as an electronic drawing upon request from
150
Hittite Sales & Application Engineering.
125
0
TEMPERATURE ( C)
AMPLIFIERS - SMT
5
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
Follow these precautions to avoid permanent damage:
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM1 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
100
75
50
25
0
1
2
3
4
5
6
7
8
TIME (min)
Static Sensitivity: Follow ESD precautions to protect against
Recommended
solder
reflow profile
ESD strikes.
for HMC LM1 SMT package
General Handling: Handle the LM1 package on the top with
a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoid damaging the RF, DC, & ground
contacts on the package bottom. Do not apply excess pressure to the top of the lid.
Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is
not recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user’s experience and should be compatible with the metallization
systems used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder
paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical &
electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reflow
The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder
reflow profile is suggested above.
Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard
profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to
thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to
evaporate and the flux to completely activate. Reflow must then occur prior to the flux being completely driven off.
The duration of peak reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand
a peak temperature of 2350C for 15 seconds. Verify that the profile will not expose the device to temperatures in
excess of 2350C.
Cleaning
A water-based flux wash may be used.
5-8
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC283LM1
v04.1201
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
CONVERSION LOSS (dB)
HMC283LM1 can also perform as a frequency multiplier.
This is accomplished by biasing Vg1 into its pinchoff region
- typically -1V to -2V. By adjusting the Vg1 bias, the device
will operate as a doubler or tripler. Vg2 may also be
adjusted to minimize the levels of unwanted harmonics.
The plot shows the performance of HMC283 operated as
a doubler with Vg1 = -1V and the remaining gate voltages
(Vg2, 3, 4) set to -0.15V. In this condition the amplifier
draws 310mA at 3.5V drain bias (Vdd) and provides +5dB
to -5dB conversion loss dependent upon the output frequency.
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
10 dBm
15 dBm
18 dBm
10
15
20
25
30
35
40
AMPLIFIERS - SMT
5
Alternate Applications:
Frequency Multiplier Performance
OUTPUT FREQUENCY (GHz)
Voltage Detector, Built-In-Test (B.I.T.)
1.6
2
1.4
1.8
DETECTED VOLTAGE
INTO 10K RESISTOR (Volts)
DETECTED VOLTAGE
INTO 10K RESISTOR (Volts)
By connecting the Vdet port to a 10k Ohm resistor and monitoring the voltage, a B.I.T. circuit can be created to monitor
changes in the device output power. This circuit is extremely well compensated for temperature variations as shown
in the first plot. The detected voltage does change with frequency and the second plot shows its variation.
1.2
1
0.8
0.6
0.4
-55 C
+85 C
0.2
1.6
18 GHz
22 GHz
28 GHz
38 GHz
1.4
1.2
1
0.8
0.6
0.4
0.2
+25 C
0
0
10
12
14
16
18
OUTPUT POWER (dBm)
20
22
10
12
14
16
18
20
22
OUTPUT POWER (dBm)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
5-9