Semiconductor Qualification Test Report: pHEMT-J (QTR: 2012-00042)

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Report Title:
Qualification Test Report
Report Type:
See Attached
Date:
See Attached
Wafer Process: pHEMT-J
HMC6484
HMC284A
QTR: 2012-00042
Rev: 02
Wafer Process: pHEMT-J
QTR: 2012-00042
Rev: 02
Introduction
This Reliability test is designed to satisfy the reliability requirements designated by Hittite Microwave Corporation.
The testing is devised to simulate exposure to environments the product may experience during assembly, test, and
life in the end user application. The pass/fail criteria are dependent upon DC and critical RF parameters determined
by the appropriate catalog specifications.
The IC Process Reliability Plan for the pHEMT-J process is as follows:
IC Process Reliability
Wafer Process: pHEMT-J
QTR: 2012-00042
Rev: 02
Sample Selection: All devices used were from finished goods and met acceptance test requirements. 160 parts
were obtained from stock and divided to perform the following test.
IC Process Reliability
High Temperature Operating Life (HTOL) - Devices are subjected to 1000 hours of accelerated operating life test
at Tj=125°C with a DC bias applied. The supply current (Idd) is periodically monitored. A significant decrease or
increase in current indicates a potential device failure. This test is in accordance with JESD22-A108.
High Temperature Storage Life (HTSL) - Devices are subjected to 1000 hours at 150oC per JESD22-A103.
Wafer Process: pHEMT-J
QTR: 2012-00042
Rev: 02
Summary of Results/Conclusions
All testing is complete. There were no failures detected. The device meets the requirements for Hittite Reliability
Testing.
TEST
QTY
IN
QTY
OUT
PASS/FAIL
Initial electrical Test
160
160
Pass
HTSL
80
80
Pass
Post HTSL - Final Electrical Test
80
80
Pass
HTOL
80
80
Pass
Post HTOL - Final Electrical test
80
80
Pass
NOTES
Wafer Process: pHEMT-J
QTR: 2012-00042
Rev: 02
FIT / MTTF Calculation
Stress conditions:
Qty of Parts Tested = 80
Qty of parts out of spec = 0
Stress Die Junction Temp = 125°C
Max Use Die Junction Temp = 85°C
Activation Energy = 1.6eV
Acceleration Factor (AF):
, AF=185.5
Calculating the Upper Confidence Bound Failure Rate at 90% CL:
, at 90% CL and with 0 units out of spec,
λ90% =
155 FIT, or 6.4x106 hours or 735 years.