SESD5ZxxV(SOD 523)

WILLAS
FM120-M+
SESD5ZxxVTHRU
Transient
Voltage
Suppressors
for ESDRECTIFIERS
Protection-20V- 200V
FM1200-M+
1.0A SURFACE
MOUNT
SCHOTTKY BARRIER
Pb Free Produc
SOD-123+ PACKAGE
Package outline
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
SOD-123H
General
Description
optimize
board space.
Features
power loss,
highare
efficiency.
• Low
The
SESD5Z
Series
designed to protect voltage
• High current capability, low forward voltage drop.
sensitive
from ESD and transient voltage
surge capability.
• Highcomponents
events.
Excellentforclamping
capability,
low leakage, and
overvoltage
protection.
• Guardring
Ultra high-speed switching.
•
fast response time, make these parts ideal for ESD
• Silicon epitaxial planar chip, metal silicon junction.
protection
on designs
board standards
space is
parts meetwhere
environmental
of at a
• Lead-free
z
0.146(3.7)
Small Body Outline Dimensions
0.130(3.3)
z
Low Body Height
z
Stand−off Voltage: 3 V − 12.0 V
z
µs
Peak Power up to 200 Watts @ 8 x 200.056(1.4)
z
Low Leakage
z
Response Time is Typically < 1 ns
z
Pb-Free package is available
0.040(1.0)
0.024(0.6)
RoHS product for packing code suffix ”G”
Halogen
freeTyp.product for packing code suffix
“H”Typ.
0.031(0.8)
0.031(0.8)
MIL-STD-19500 /228
premium.
• RoHS product for packing code suffix "G"
Halogen free product for packing code suffix "H"
Mechanical data
Applications
• Epoxy : UL94-V0 rated flame retardant
z
z
z
z
Digital cameras
• Polarity : Indicated by cathode band
Power supplies
• Mounting Position : Any
• Weight : Approximated 0.011 gram
0.071(1.8)
Pulse
Cellular
phonesplastic, SOD-123H
• Case : Molded
,
• Terminals
:Plated terminals, solderable per MIL-STD-750 z
Portable
devices
Method 2026
0.012(0.3) Typ.
Moisture Sensitivity Level 1
Complies with the
following standards
Dimensions in inches and (millimeters)
IEC61000-4-2
Level 4
15 kV (air discharge)
8 kV(contact discharge)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
MIL STD 883E - Method 3015-7 Class 3
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
Functional
For
capacitive load,diagram
derate current by 20%
RATINGS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
Marking Code
Maximum Recurrent Peak Reverse Voltage
VRRM
12
20
13
30
Maximum RMS Voltage
VRMS
14
21
28
Maximum DC Blocking Voltage
VDC
20
30
40
Maximum Average Forward Rectified Current
IO
IFSM
Peak Forward Surge Current 8.3 ms single half sine-wave
SOD-523
superimposed on rated load (JEDEC method)
RΘJA
Typical Thermal Resistance (Note 2)
Typical Junction Capacitance (Note
(T 1) =25°C
Absolute Ratings
Operating Temperature Range
amb
Symbol
Storage Temperature Range
PPP
TL
)
CJ
TJ
Parameter
TSTG
CHARACTERISTICS
16
60
18
80
Rated DC
TopBlocking Voltage
Operating
VF
IR
@T A=125℃Range
Temperature
35
42
50
60
IEC61000-4-2 (ESD)
-55 to +125
2012-06
56
70
105
140
80
100
150
200
-55 to +150
- 65 to +175
0.50
Value
Units
200
W
260
°C
0.5
-55 to +155
°C
10
-40 to +125
°C
150
°C
±15
±8
kV
40
A
25
kV
400
V
0.70
0.85
air discharge
contact discharge
Per Human Body Model
Per Machine Model
2012-09
120
200
IEC61000-4-4 (EFT)
ESD Voltage
115
150
40
120
Maximum junction temperature
2- Thermal Resistance From Junction to Ambient
10
100
1.0
30
Maximum lead temperature for soldering during 10s
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
15
50
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
TstgAverage Reverse
Storage
Temperature
Range
Maximum
Current
at @T A=25℃
NOTES: Tj
14
40
Peak Pulse Power (tp = 8/20μs)
Maximum Forward Voltage at 1.0A DC
25 kV HBM (Human Body Model)
0.9
0.92
WILLAS ELECTRONIC CORP
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
SESD5ZxxVTHRU
Transient
Voltage
Suppressors
for ESDRECTIFIERS
Protection-20V- 200V
1.0A SURFACE
MOUNT
SCHOTTKY BARRIER
FM1200-M+
Pb Free Product
SOD-123+ PACKAGE
Package outline
Electrical
Parameter
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Symbol
Parameter
• Low profile surface mounted application in order to
board space.
IPPoptimizeMaximum
Reverse Peak Pulse Current
• Low power loss, high efficiency.
V•CHigh current
Clamping
Voltage
@ IPP voltage drop.
capability,
low forward
High
surge
capability.
•
VRWM
Working Peak Reverse Voltage
• Guardring for overvoltage protection.
Maximum Reverse Leakage Current @
I•R Ultra high-speed switching.
VRWM planar chip, metal silicon junction.
• Silicon epitaxial
I•T Lead-free
Test
Current
parts
meet environmental standards of
SOD-123H
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
MIL-STD-19500 /228
V•BRRoHS product
Breakdown
Voltage
@ I"G"
T
for packing
code suffix
Halogen free product for packing code suffix "H"
IF
Forward Current
Mechanical data
0.040(1.0)
VF
Forward Voltage @ IF
0.024(0.6)
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
0.031(0.8) Typ.
0.031(0.8) Typ.
,
• Terminals
:Plated terminals, solderable
per MIL-STD-750
Electrical
Characteristics
Ratings at 25°C
ambient temperature unless otherwise specified.VF = 0.9V at IF = 10mA
Part Numbers Method 2026 VBR
• Polarity : Indicated by cathode band
• Mounting Position : Any
Min.
Typ.
Max.
• Weight : Approximated 0.011 gram
VF
Dimensions in inches and (millimeters)
IT
VRWM
IR
MAXIMUM
ANDVELECTRICAL
CHARACTERISTICS
V RATINGS
V
mA
V
µA
Ratings at 25℃ ambient temperature unless otherwise specified.
SESD5Z3V3
5.0 resistive
6.0of inductive
7.0 load. 1
Single
phase half wave, 60Hz,
For capacitive load, derate current by 20%
SESD5Z5V
6.0
6.6
7.1
7.5
8.1
8.6
RATINGS
SESD5Z7V
Marking
Code
Maximum
Recurrent Peak Reverse
SESD5Z12V
13.5 Voltage
14.2
Maximum RMS Voltage
1
Maximum DC Blocking Voltage
1
VRMS
bias
V
mA
pF
3.0
1
1.25
200
35
5.0
1
1.25
200
30
VDC
1
12
20
1.25
16
18200
80
200
10
100
14
56
70
20
80
100
7.0
13
30
12.0
14
40
21
28
30
40
1
1
15
50
35
60
1.25
42
50
60
1. VBR is measured with a pulse test current IT at an ambient temperature of 25℃.
IO
Maximum Average Forward Rectified Current
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed
on rated load (JEDEC method)
Typical
Characteristics
Typical Thermal Resistance (Note 2)
RΘJA
CJ
Operating Temperature Range
TJ
25115
25150
120
200
105
140
150
200
1.0
30
IFSM
Typical Junction Capacitance (Note 1)
Storage Temperature Range
Typ. 0v
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
15.0 VRRM
*Surge current waveform per Figure 1.
IF
Max.
C
40
120
-55 to +125
-55 to +150
- 65 to +175
TSTG
CHARACTERISTICS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
VF
Maximum Forward Voltage at 1.0A DC
Maximum Average Reverse Current at @T A=25℃
Rated DC Blocking Voltage
@T A=125℃
IR
0.50
0.70
0.85
0.5
0.9
0.92
10
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
2- Thermal Resistance From Junction to Ambient
Fig1. Pulse Waveform
2012-09
2012-06
Fig2.Power Derating Curve
WILLAS ELECTRONIC CORP
WILLAS ELECTRONIC CORP.
WILLAS
FM120-M+
SESD5ZxxVTHRU
Transient
Voltage
Suppressors
for ESDRECTIFIERS
Protection-20V- 200V
FM1200-M+
1.0A SURFACE
MOUNT
SCHOTTKY BARRIER
Pb Free Produc
SOD-123+ PACKAGE
Package outline
Features
design, excellent power dissipation offers
• Batch process
Application
Note
better reverse leakage current and thermal resistance.
SOD-123H
Electrostatic
discharge
(ESD)
is a major
of failure in electronic systems. Transient Voltage
mounted
application
in ordercause
to
• Low profile surface
optimize board space.
Suppressors
(TVS)
are an ideal choice for ESD protection. They are capable of clamping
the incoming
0.146(3.7)
loss, high efficiency.
• Low power
0.130(3.3)
0.012(0.3) Typ.
transient
to current
a low enough
level
such that
damage
capability,
low forward
voltage
drop. to the protected semiconductor is prevented.
• High
capability.
• High surge
Surface
mount
TVS offers the best choice for minimal lead inductance. They serve as parallel protection
• Guardring for overvoltage protection.
0.071(1.8) of
elements,
high-speed between
switching.the signal line to ground. As the transient rises above the operating voltage
• Ultraconnected
0.056(1.4)
Silicon
epitaxial
planar
chip,
metal
silicon
junction.
•
the device, the TVS becomes a low impedance path diverting the transient current to ground. The SESD5Z
• Lead-free parts meet environmental standards of
Series MIL-STD-19500
is the ideal board
/228evel protection of ESD sensitive semiconductor components.
RoHS
product
for
packing
code suffix
"G"design flexibility in the design of high density boards where the space
•
The tiny SOD-523 package
allows
Halogen free product for packing code suffix "H"
saving is at a premium. This enables to shorten the routing and contributes to hardening against ESD.
Mechanical data
0.040(1.0)
0.024(0.6)
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
,
SOD-523
Mechanical
Data
• Terminals
:Plated terminals,
solderable per MIL-STD-750
0.031(0.8) Typ.
0.031(0.8) Typ.
.035(0.90)
.028(0.70)
.014(0.35)
.009(0.25)
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
.051(1.30)
• Weight : Approximated 0.011 gram
Dimensions in inches and (millimeters)
.043(1.10)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
For capacitive load, derate current by 20%
RATINGS
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
Marking Code
VRRM
12
20
13
30
Maximum RMS Voltage
VRMS
14
21
28
35
Maximum DC Blocking Voltage
VDC
20
30
40
50
Maximum Average Forward Rectified Current
IO
IFSM
Peak Forward Surge Current 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method)
Typical Junction Capacitance (Note 1)
CJ
Operating Temperature Range
TJ
Storage Temperature Range
.067(1.70)
CHARACTERISTICS
.059(1.50)
Maximum Forward Voltage at 1.0A
DC
Rated DC Blocking Voltage
15
50
16
60
18
80
10
100
115
150
120
200
42
56
70
.028(0.70)
80
100
.020(0.50)
1.0
105
140
60
150
200
30
40
120
-55 to +125
-55 to +150
- 65 to +175
TSTG
SYMBOL FM120-MH FM130-MH FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
VF
0.50
Maximum Average Reverse Current at @T A=25℃
14
40
RΘJA
Typical Thermal Resistance (Note 2)
.008(0.20)
.002(0.05)
Maximum Recurrent Peak Reverse Voltage
IR in inches and (millimeters)
Dimensions
@T A=125℃
0.70
0.85
0.5
0.9
0.92
10
Marking
NOTES:
1- Measured at 1 MHZ and applied reverse voltage of 4.0 VDC.
Type number
2- Thermal Resistance From Junction to Ambient
2012-09
Marking code
SESD5Z3V3
ZE
SESD5Z5V
ZF
ZH
12V
SESD5Z7V
SESD5Z12V
2012-06
WILLAS ELECTRONIC CORP
WILLAS ELECTRONIC CORP.
SESD5ZxxV
Transient Voltage Suppressors for ESD Protection
Ordering Information: Device PN Part Number ‐T(1)G(2)‐WS Note: (1) Packing code, Tape & Reel Packing Tape&Reel: 3 Kpcs/Reel (2) RoHS product for packing code suffix ”G”;Halogen free product for packing code suffix “H” ***Disclaimer*** WILLAS reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other changes. WILLAS or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Data sheet specifications and its information contained are intended to provide a product description only. "Typical" parameters which may be included on WILLAS data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. WILLAS does not assume any liability arising out of the application or use of any product or circuit. WILLAS products are not designed, intended or authorized for use in medical, life‐saving implant or other applications intended for life‐sustaining or other related applications where a failure or malfunction of component or circuitry may directly or indirectly cause injury or threaten a life without expressed written approval of WILLAS. Customers using or selling WILLAS components for use in such applications do so at their own risk and shall agree to fully indemnify WILLAS Inc and its subsidiaries harmless against all claims, damages and expenditures. 2012-09
WILLAS ELECTRONIC CORP.