TSOP75D25 Datasheet

TSOP75D25
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IR Receiver Modules for 3D Synchronization Signals
FEATURES
• Center frequency at 25 kHz to reduce
interference with IR remote control signals at
30 kHz to 56 kHz
• Package can be used with IR emitters with
wavelength 830 nm as well as standard 940 nm
4
• Very low supply current and stand-by mode
3
2
• Photo detector and preamplifier in one package
1
• Internal filter for PCM frequency
• Supply voltage range: 2.5 V to 5.5 V
• Improved immunity against modulated light
sources
20953
• Insensitive to supply voltage ripple and noise
MECHANICAL DATA
• Taping available for topview and sideview assembly
Pinning:
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
1, 4 = GND, 2 = VS, 3 = OUT
DESCRIPTION
The TSOP75D25 is an SMD IR receiver module for 3D
sychronisation signals. The receiver is designed to operate
at a carrier frequency of 25 kHz and a wavelength of 830 nm
to avoid interference with standard remote control systems
at 940 nm and 30 kHz to 56 kHz. The TSOP75D25 can
receive continuously transmitted signal patterns with a
minimum burst length of 6 cycles and frame rates up to
200 Hz. The circuit provides good suppression of optical
noise from CFLs, LCD backlight and plasma panels.
PARTS TABLE
CARRIER FREQUENCY
GOOD NOISE SUPPRESSION AND FAST BURST RATE
25 kHz
TSOP75D25
BLOCK DIAGRAM
APPLICATION CIRCUIT
17170_5
2
30 k Ω
Transmitter
with
TSALxxxx
VS
Input
AGC
Band
pass
Demodulator
OUT
Control circuit
GND
µC
OUT
VO
GND
R1 and C1 are recommended for protection against EOS.
Components should be in the range of 33 Ω < R1 < 1 kΩ,
C1 > 0.1 µF.
20445-1
Rev. 1.2, 26-Jun-12
+ VS
C1
GND
1, 4
PIN
VS
Circuit
3
R1
IR receiver
1
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VS
- 0.3 to + 6
V
mA
Supply voltage (pin 2)
Supply current (pin 2)
IS
3
Output voltage (pin 3)
VO
- 0.3 to (VS + 0.3)
V
Output current (pin 3)
IO
5
mA
Tj
100
°C
Storage temperature range
Junction temperature
Tstg
- 25 to + 85
°C
Operating temperature range
Tamb
- 25 to + 85
°C
Ptot
10
mW
Tamb ≤ 85 °C
Power consumption
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Supply current (pin 2)
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
Ev = 0, VS = 3.3 V
ISD
0.27
0.35
0.45
mA
Ev = 40 klx, sunlight
ISH
Supply voltage
0.45
VS
Ev = 0, test signal see fig. 1,
IR diode TSAL6200,
IF = 250 mA
d
IOSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see fig. 1
VOSL
Minimum irradiance
Pulse width tolerance:
tpi - 80 μs < tpo < tpi + 160 μs,
test signal see fig. 1
Ee min.
Maximum irradiance
tpi - 80 μs < tpo < tpi + 160 μs,
test signal see fig. 1
Ee max.
Angle of half transmission
distance
ϕ1/2
Transmission distance
Output voltage low (pin 3)
Directivity
mA
2.5
5.5
V
45
m
0.15
100
mV
0.35
mW/m2
W/m2
30
± 50
deg
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1.5
Optical Test Signal
(IR diode TSAL6200, IF = 0.4 A, N = 6 pulses, f = fO, t = 10 ms)
1.4
tpo - Output Pulse Width (ms)
Ee
t
tpi *)
T
*) tpi ≥ 6/fo is recommended for optimal function
Output Signal
VO
3/fO < td < 9/fO
2)
tpi - 80 µs < tpo < tpi + 160 µs
VOH
VOL
14337-1
1)
Output Pulse Width
1.3
1.2
Input Burst Length
1.1
1.0
0.9
0.8
λ = 950 nm,
Optical Test Signal, Fig.1
0.7
0.6
0.5
td 1)
tpo 2)
t
0.1
22020
Fig. 1 - Output Active Low
Rev. 1.2, 26-Jun-12
1
10
102
103
104
105
Ee - Irradiance (mW/m2)
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
2
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Optical Test Signal
600 µs
t
600 µs
t = 60 ms
94 8134
Output Signal, (see fig. 4)
VO
VOH
VOL
t on
4
Ee min. - Threshold Irradiance (mW/m2)
Ee
Correlation with Ambient Light Sources:
2
3.5 10 W/m = 1.4 kLx (Std. illum. A, T = 2855 K)
10 W/m2 = 8.2 kLx (Daylight, T = 5900 K)
3
2
1.5
1
0.5
0
0.01
t
t off
Wavelength of Ambient
Illumination: λ = 950 nm
2.5
20757
Ee min. - Threshold Irradiance (mW/m2)
Ton, Toff - Output Pulse Width (ms)
0.8
Ton
0.6
0.5
Toff
0.4
0.3
λ = 950 nm,
Optical Test Signal, Fig. 1
0.2
0.1
0
0.1
1
22021
10
Ee - Irradiance
100
1000
10
100
1.0
f = 100 Hz
0.9
0.8
f = 10 kHz
0.7
0.6
f = 20 kHz
0.5
0.4
f = 30 kHz
0.3
f = fo
0.2
0.1
0
10 000
1
(mW/m2)
10
100
1000
VsRMS - AC Voltage on DC Supply Voltage (mV)
20753
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
Fig. 4 - Output Pulse Diagram
1.2
500
E - Max. Field Strength (V/m)
E e min./Ee - Rel. Responsivity
1
Fig. 6 - Sensitivity in Bright Ambient
Fig. 3 - Output Function
0.7
0.1
Ee - Ambient DC Irradiance (W/m2)
1.0
0.8
0.6
0.4
f = f0 ± 5 %
Δ f(3 dB) = f0/10
0.2
450
400
350
300
250
200
150
100
50
0.0
0
0.7
16925
0.9
1.1
0
1.3
20747
f/f0 - Relative Frequency
Fig. 5 - Frequency Dependence of Responsivity
Rev. 1.2, 26-Jun-12
500
1000
1500
2000
2500
3000
f - EMI Frequency (MHz)
Fig. 8 - Sensitivity vs. Electric Field Disturbances
3
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0°
10°
20°
30°
0.9
0.8
Max. Envelope Duty Cycle
f = 25 kHz, Ee = 3 mW/m²
0.7
40°
0.6
1.0
0.5
0.4
0.3
constant irradiance
0.9
50°
0.8
60°
70°
0.2
variable irradiance
0.1
80°
0
0
22022
10
20
30
40
50
60
70
0.6
80
0
0°
0.3
10°
20°
30°
0.25
40°
0.2
1.0
0.15
0.1
0.9
50°
0.8
60°
70°
0.05
80°
0
- 30
- 10
10
30
50
70
0.6
90
Tamb - Ambient Temperature (°C)
20755
0.4
0.2
0
drel - Relative Transmission Distance
21428
Fig. 13 - Vertical Directivity
Fig. 10 - Sensitivity vs. Ambient Temperature
1.0
0.2
Ee min. - Sensitivity (mW/m2)
S(λ)rel - Relative Spectral Sensitivity
0.2
Fig. 12 - Horizontal Directivity
Fig. 9 - Maximum Envelope Duty Cycle vs. Burst Length
Ee min. - Threshold Irradiance (mW/m2)
0.4
drel - Relative Transmission Distance
21427
Burst Length (number of cycles/burst)
0.8
0.6
0.4
0.2
0.18
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
0
700
22102
800
900
1000
2
1100
20756
λ - Wavelength (nm)
Fig. 11 - Relative Spectral Sensitivity vs. Wavelength
Rev. 1.2, 26-Jun-12
2.5
3
3.5
4
4.5
5
5.5
6
VS - Supply Voltage (V)
Fig. 14 - Sensitivity vs. Supply Voltage
4
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SUITABLE DATA FORMAT
IR Signal
The TSOP75D25 is designed to suppress spurious output
pulses due to noise or disturbance signals. Data and
disturbance signals can be distinguished by the devices
according to carrier frequency, burst length and envelope
duty cycle. The data signal should be close to the
band-pass center frequency (e.g. 25 kHz) and fulfill the
conditions in the table below.
When a data signal is applied to the TSOP75D25 in the
presence of a disturbance signal, the sensitivity of the
receiver is reduced to insure that no spurious pulses are
present at the output. Some examples of disturbance
signals which are suppressed are
• DC light (e.g. from tungsten bulb or sunlight)
0
• Continuous signals at any frequency
5
• Strongly or weakly modulated noise from fluorescent
lamps with electronic ballasts (see figure 15 or figure 16)
10
15
20
Time (ms)
16920
IR Signal
Fig. 15 - IR Signal from Fluorescent Lamp
with Low Modulation
0
16921
5
10
15
20
Time (ms)
Fig. 16 - IR Signal from Fluorescent Lamp
with High Modulation
TSOP75D25
Minimum burst length
6 cycles/burst
After each burst of length
a minimum gap time is required of
6 to 24 cycles
≥ 6 cycles
For bursts greater than
a minimum gap time in the data stream is needed of
24 cycles
> 4 x burst length
Maximum rate of short bursts (constant irradiance)
2000 bursts/s
Maximum rate of short bursts (variable irradiance)
220 bursts/s
Rev. 1.2, 26-Jun-12
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STAND-BY MODE OF THE TSOP75D25
If an application requires an ultra low average supply current in order to save battery life, the TSOP75D25 can be operated with
an intermittent supply voltage. A typical application circuit shown in fig. 17.
Battery
Supply
TSOP75D..
Input
RC data
Low Power
Microcontroller
IR Receiver
(memorizing the gain
level during standby)
RS
3 MΩ
other input and
output lines
Output
IR Rec. SBY
VS = 2.5 V to 5.5 V
22023-2
Fig. 17 - Application Circuit for the TSOP75D25 with Intermittent Supply Voltage
To receive a continuous data signal while using the TSOP75D25 with an intermittent supply voltage, the receiver must be
activated in advance of the expected data frame as shown in figure 18.
The transmitted IR
synchronizing pattern
Synchronizing pattern,
sent by the TV
The standby is deactivated in
advance of the expected data
frame
Standby on
Output signal of the
microcontroller to control the
standby mode of the IR
Receiver
Standby off
Output signal of the TSOP75D25
valid sync.
pattern
Data is valid only 2 ms after the
standby off signal
22024-2
Fig. 18 - Signal Timing in Power Saving Mode with Continuous Receiving Function
In normal operation without using the stand-by feature, the gain level of the TSOP75D25 returns to a default level after the device
is disconnected from supply voltage and reconnected again. A settling time of up to 100 ms is necessary until the gain has
settled to an optimum level that is well matched to the ambient noise level.
Using the device in stand-by mode, the TSOP75D25 memorizes its gain setting while in standby. On re-activation, the gain
immediately returns to the correct level present before stand-by. This operation insures that there are no spurious pulses on
power-up due to mismatch between the gain level and the ambient light conditions.
Rev. 1.2, 26-Jun-12
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ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
VS = 3 V
RS
1.2
1.5
2
VS = 5 V
RS
2
3
4
VS = 3 V, RS = 1.5 MΩ
ISBY
1
1.4
2
VS = 5 V, RS = 3 MΩ
ISBY
1
1.4
2
VS > 2.5 V, dark ambient,
output is valid
tdelay
0.4
0.8
VS > 2.5 V, 10 klx daylight,
output is valid
tdelay
1.5
2.5
Serial resistor to activate the
standby mode
Standby supply current
Latency time for standby-off
(delay until there is a valid
respose)
Duration of standby-off period
UNIT
MΩ
μA
ms
VS > 2.5 V, dark ambient
tSBY_OFF
1
VS > 2.5 V, 10 klx daylight,
AGC1 or AGC3 device
tSBY_OFF
4
VS > 2.5 V, 10 klx daylight,
AGC2 or AGC4 device
tSBY_OFF
3
ms
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
2.5
Latency Time after Standby-off
until there is a valid Output Signal
Latency Time (ms)
2
1.5
1
0.5
0
0.1
22025
1
10
100
Ambient Daylight Brightness (kLux)
Fig. 19 - Delay Time after Standby-off
until the TSOP75D25 is ready to receive Data
Rev. 1.2, 26-Jun-12
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PACKAGE DIMENSIONS in millimeters
6.8
6.6 ± 0.1
3.2
(3.4)
Mold residue
Mold residue
2.5
(1.8)
1.2 ± 0.2
3
0.8
2.2
(0.635)
(1)
1.27
(3 x)
0.5 ± 0.1
(4 x)
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
Marking area
2.2
Not indicated tolerances ± 0.15
(1.65)
Tool separation line
(2.2)
Proposed pad layout
from component side
(for reference only)
3 x 1.27 = 3.81
1.27
Pick and place area
1.8
(R1.3)
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
0.8
22608
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 1.2, 26-Jun-12
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
50
100
150
t (s)
19800
200
250
300
max. 2 cycles allowed
TAPING VERSION TSOP..TT DIMENSIONS in millimeters
3.35
0.3
4°
7.1
16
7.5
3.3
4°
1.75
Ø 1.5
4
8
Direction of feed
2
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5338.01-4
Issue: 3; 09.06.09
21578
Rev. 1.2, 26-Jun-12
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TAPING VERSION TSOP..TR DIMENSIONS in millimeters
3.3
0.3
4°
7.1
16
7.5
1.75
2.8
4°
1.34 ref.
Ø 1.5
Direction of feed
8
2
Ø 1.5 min
4
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5337.01-4
Issue: 1; 16.10.08
21577
Rev. 1.2, 26-Jun-12
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REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
LABEL
According to DIN EN 60286-3
0.1 N to 1.3 N
300 mm/min. ± 10 mm/min.
165° to 180° peel angle
Standard bar code labels for finished goods
Rev. 1.2, 26-Jun-12
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
11
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VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITTING
Item-description
Item-number
Selection-code
LOT-/serial-number
Data-code
Plant-code
Quantity
Accepted by
Packed by
Mixed code indicator
Origin
LONG BAR CODE TOP
Item-number
Plant-code
Sequence-number
Quantity
Total length
SHORT BAR CODE BOTTOM
Selection-code
Data-code
Batch-number
Filter
Total length
ABBREVIATION
INO
SEL
BATCH
COD
PTC
QTY
ACC
PCK
MIXED CODE
xxxxxxx+
TYPE
N
N
X
N
TYPE
X
N
X
-
DRY PACKING
LENGTH
18
8
3
10
3 (YWW)
2
8
Company logo
LENGTH
8
2
3
8
21
LENGTH
3
3
10
1
17
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Aluminum bag
Label
An EIA JEDEC standard JSTD-020 level 4 label is included
on all dry bags.
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
Reel
15973
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
FINAL PACKING
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
RECOMMENDED METHOD OF STORAGE
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard JSTD-020
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
22522
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
Rev. 1.2, 26-Jun-12
EIA JEDEC standard JSTD-020 level 4 label
is included on all dry bags
12
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ESD PRECAUTION
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electro-static
sensitive devices warning labels are on the packaging.
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
22178
Rev. 1.2, 26-Jun-12
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
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Document Number: 91000